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A kind of oyster shell/fluoroapatite composite conductive silver paste and preparation method thereof

A technology of fluoroapatite and conductive silver paste, which is used in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problem of poor solder resistance, poor sintering performance and low adhesion and other problems, to achieve the effect of good temperature and humidity resistance, strong adhesion and lower production costs

Active Publication Date: 2016-07-20
李伟志
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The characteristics that conductive silver paste needs to have are: good conductivity (antistatic property), strong adhesion, good printing adaptability and excellent solvent resistance. However, the existing conductive silver paste on the market has many shortcomings, not only containing lead , cadmium, etc. and are toxic, pollute the environment, and when used on conductive substrates, the adhesion is low, the soldering resistance is not good, and the sintering performance is poor

Method used

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Examples

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Effect test

Embodiment Construction

[0012] The composite conductive silver paste of oyster shell / fluoroapatite is characterized in that it is made of the following raw materials in parts by weight: silver powder 44, kaolin 4, oyster shell 1, fluoroapatite 3, methylene Sodium dinaphthalene sulfonate 1.5, hydrogenated castor oil 0.8, aluminum potassium sulfate 1.6, germanium dioxide 2.7, linolenic acid 4, additives 37.

[0013] The auxiliary agent is made of the following raw materials in parts by weight: aluminum oxide 2, boron oxide 4, polyvinyl alcohol 7, rosin 15, 3-aminopropyltrimethoxysilane 1.5, polydimethylsiloxane 0.3 , acetone 12, cyclohexanone 8, the preparation method is to put aluminum oxide and boron oxide in a calciner and calcinate at 520-610°C for 1-2 hours, take it out and cool to room temperature, add polyvinyl alcohol and grind for 20- 40 minutes; mix cyclohexanone and rosin, react at 100-120°C for 2-3 hours, cool to 40-50°C, add acetone, 3-aminopropyltrimethoxysilane, polydimethylsiloxane , k...

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PUM

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Abstract

The invention discloses an oyster shell / fluoroapatite composite conductive silver paste, which is characterized in that it is made of the following raw materials in parts by weight: silver powder 40-50, kaolin 2-4, oyster shell 1-3, fluorophosphorus Limestone 3‑5, sodium methylene dinaphthalene sulfonate 1.2‑2.4, hydrogenated castor oil 0.8‑1.4, potassium aluminum sulfate 0.7‑1.6, germanium dioxide 1.2‑2.7, linolenic acid 4‑7, additives 30‑ 40; The present invention adds oyster shells, fluoroapatite, etc. to the raw materials after modification treatment, which reduces the cost, and can meet the electrical performance requirements of various devices under the condition of relatively low silver content. It has strong adhesion, good temperature and humidity resistance, and excellent fine line printing performance, which significantly reduces the production cost of paste.

Description

technical field [0001] The invention relates to the field of conductive silver paste, in particular to an oyster shell / fluoroapatite composite conductive silver paste and a preparation method thereof. Background technique [0002] Conductive silver paste refers to the silver paste printed on the conductive substrate to make it have the ability to conduct current and eliminate the accumulated static charge. It is generally printed on non-conductive substrates such as plastic, glass, ceramics or cardboard. It is made of conductive Filler, binder, solvent and additive composition. The characteristics that conductive silver paste needs to have are: good conductivity (antistatic property), strong adhesion, good printing adaptability and excellent solvent resistance. However, the existing conductive silver paste on the market has many shortcomings, not only containing lead , cadmium, etc., are toxic, pollute the environment, and when used on conductive substrates, have low adhesi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00
Inventor 蒋智谋周施峰周梅永胡加峰谢水兵张超崔海威吴华董子侠
Owner 李伟志
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