Preparation method of graphene electrode
A graphene electrode, graphene technology, applied in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of poor adhesion between graphene and the substrate, easy separation and detachment, etc., to optimize the charge transfer characteristics and process. Simple, low production cost effect
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Embodiment 1
[0016] In the present embodiment, a kind of preparation method of graphene electrode comprises the steps:
[0017] a. Using a GaN epitaxial wafer as the substrate, first place the cleaned GaN epitaxial wafer in a plasma device, then set the power to 50 watts, and the water vapor flow rate to 20 sccm, and treat for 10 minutes to complete the hydrophilicity of the GaN epitaxial wafer deal with;
[0018] b. First prepare a graphene film on a copper substrate, then spin-coat a layer of PMMA on the graphene film of the obtained copper substrate, then dry it at 180 degrees for 1 min, and then place it in an aqueous solution of 1mol / L ferric nitrate for etching Remove the copper substrate, then rinse it with deionized water for 3 times, then use the GaN epitaxial wafer in the above step a to pick it up, and then dry it in a vacuum oven at 70°C for 3 hours, and finally use acetone to fully remove PMMA, and then dry it , that is, the graphene electrode layer is preliminarily prepared...
Embodiment 2
[0022] This embodiment is basically the same as Embodiment 1, especially in that:
[0023] In the present embodiment, the preparation method of graphene electrode comprises the following steps:
[0024] a. Using a silicon wafer as the substrate, first soak the cleaned silicon wafer in chromic acid washing solution, take it out after 24 hours and rinse it repeatedly with deionized water, then immerse the cleaned silicon wafer in the piranha solution and heat at 85°C React for 45 minutes. After completion, rinse with a large amount of deionized water until the surface of the silicon wafer does not contain H+ ions, and dry it with nitrogen to complete the hydrophilic treatment of the silicon wafer;
[0025] b. First, graphene oxide is placed in deionized water, and 60 W power is used for ultrasonication for 3 h to make a graphene oxide dispersion coating slurry, and then the graphene oxide coating slurry is suspended-coated to the mixture obtained in the above step a. On the si...
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