Low-temperature poly-silicon thin film transistor and preparation method thereof
A low-temperature polysilicon, thin film transistor technology, applied in transistors, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve problems such as unfavorable applications and reducing the yield of thin-film field-effect transistor arrays
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[0065] Correspondingly, this application also provides a method for preparing a low-temperature polysilicon thin film transistor, which includes the following steps:
[0066] 1) Depositing a heat-conducting layer on the substrate, applying a yellowing process to the heat-conducting layer to thin it so that the heat-conducting layer has a number of strip-shaped protrusions;
[0067] 2) Depositing a planarization layer on the thermally conductive layer with a plurality of strip-shaped protrusions;
[0068] 3) Deposit an amorphous silicon layer on the planarization layer, and then perform excimer laser annealing on the amorphous silicon layer to obtain a low-temperature polysilicon film, and then apply a yellow light process to the low-temperature polysilicon film to obtain several The active layer of the active channel; the position of each of the strip-shaped protrusions is outside the side of the corresponding position of each of the active channels, and the two positions are adjacen...
Example Embodiment
[0096] Example 1
[0097] According to the technical parameters of AMOLED, determine the size of each sub-pixel and the position of the TFT inside the sub-pixel.
[0098] Use sputter to deposit aluminum oxide to deposit thickness on the glass substrate The thermally conductive buffer layer.
[0099] Through the yellow light manufacturing process, the thermally conductive buffer layer is thinned to form a number of strip-shaped protrusions; the thermal conductive layer pattern is as Figure 1 to Figure 3 Shown. In the yellow light process, the laser scans from right to left, and the position of each of the strip-shaped protrusions is located on the right side of the position of each of the active channels. The length of each strip-shaped protrusion is greater than the width of each corresponding active channel, and the width of each strip-shaped protrusion is 0.5 μm; the thickness of the thermally conductive buffer layer after thinning is
[0100] Deposition of SiO by sol-gel metho...
Example Embodiment
[0106] Example 2
[0107] According to the technical parameters of AMOLED, determine the size of each sub-pixel and the position of the TFT inside the sub-pixel.
[0108] Use sputter to deposit silicon carbide to deposit thickness on the glass substrate The thermally conductive buffer layer.
[0109] Through the yellow light manufacturing process, the thermally conductive buffer layer is thinned to form a number of strip-shaped protrusions; the thermal conductive layer pattern is as Figure 1 to Figure 3 Shown. In the yellow light process, the laser scans from right to left, and the position of each of the strip-shaped protrusions is located on the right side of the position of each of the active channels. The length of each strip-shaped protrusion is greater than the width of each corresponding active channel, and the width of each strip-shaped protrusion is 1 μm; the thickness of the thermally conductive buffer layer after thinning is
[0110] The acrylic material monomer is dep...
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