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Halogen-free soldering flux for lead-free solder paste

A lead-free solder and flux technology, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of high halogen content, poor high temperature oxidation resistance, etc., and achieve high activity.

Inactive Publication Date: 2014-12-03
JIANGSU BOQIAN NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a lead-free solder with high activity, no halogen, good thixotropy and high temperature oxidation resistance, and a wide viscosity range in order to solve the problems of high halogen content and poor high temperature oxidation resistance in the solder paste in the prior art Halogen-free flux for paste

Method used

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  • Halogen-free soldering flux for lead-free solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Add 48g of diethylene glycol monohexyl ether, 40g of hydrogenated rosin, 40g of polymerized rosin and 12g of TX-10 phosphate into the reaction vessel, heat up to 100°C, stir until completely dissolved; cool down to 85°C, add myristic acid 16g, succinic acid 3g, adipic acid 6g, glutaric acid 9g, suberic acid 2g, tolyltriazole 2g and methylimidazole 10g, stir until completely dissolved; cool down to 70°C, add modified hydrogenation Stir 12g of castor oil until completely dissolved, cool to 23°C, and use a three-roll mill to grind the solid particles in the uniformly mixed solution to a fineness of less than 10μm to obtain 196g of halogen-free flux for lead-free solder paste.

[0022]

Embodiment 2

[0024] A halogen-free flux for lead-free solder paste, add 46g of diethylene glycol butyl ether, 30g of hydrogenated rosin, 50g of polymerized rosin and 14g of Surfynol 104E into a reaction vessel, heat up to 108°C, stir until completely dissolved; cool down To 90°C, add 12g of p-tert-butylbenzoic acid, 4g of stearic acid, 4g of succinic acid, 7g of adipic acid, 8g of glutaric acid, 2g of suberic acid, 3g of CHIMASSORB 3030 and 12g of benzimidazole, and stir until completely Dissolve; cool down to 50°C, add 8g of ethylene bisstearic acid amide, stir until completely dissolved, cool to 20°C, use a three-roll mill to grind the solid particles in the mixed solution to a fineness of less than 10 μm, and obtain Halogen-free flux for lead solder paste 194g.

[0025]

Embodiment 3

[0027] A halogen-free flux for lead-free solder paste, 58g of diethylene glycol dibutyl ether, 36g of hydrogenated rosin, 40g of polymerized rosin and 10g of rosin ether surfactant are added to a reaction vessel, heated to 116°C, and stirred to Dissolve completely; cool down to 80°C, add 14g of dipropionic acid, 4g of succinic acid, 5g of adipic acid, 7g of glutaric acid, 2g of suberic acid, 2g of methylbenzotriazole and 12g of methylimidazole, and stir until completely dissolved; cool down to 65°C, add 10g of thixotropic agent 7500, stir until completely dissolved, cool to 22°C, use a three-roll mill to grind the solid particles in the mixed solution to a fineness of less than 10μm to obtain lead-free solder Paste with halogen-free flux 193g.

[0028]

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Abstract

The invention relates to the technical field of welding materials, in particular to a halogen-free soldering flux for lead-free solder paste. The halogen-free soldering flux for the lead-free solder paste comprises the following components in percentage by mass: 20 to 35 percent of solvent, 30 to 45 percent of rosin, 5 to 10 percent of surfactant, 10 to 20 percent of organic acid, 3 to 10 percent of antioxidant and 2 to 8 percent of thixotropic agent. According to the halogen-free soldering flux, a rosin mixture consisting of hydrogenated rosin and polymerized rosin at a weight ratio of 1:(1-3) is adopted, so that higher adhesive force of the solder paste is ensured; the proportion of the solvent and the rosin in the soldering flux is regulated, so that the viscosity range of the solder paste is wider; by the compounding of multiple organic acids, the prepared soldering flux is free of halogen, and has higher activity; the antioxidant for preparing the soldering flux is one or a combination of more than two of methylbenzotriazole, an antioxidant BHT, CHIMASSORB3030, benzimidazole and methylimidazole; the solder paste prepared from the soldering flux is long in service life, and has good de-molding effects.

Description

technical field [0001] The invention relates to the technical field of soldering materials, in particular to a halogen-free flux for lead-free solder paste. Background technique [0002] With the rapid development of electronic technology, electronic information products are developing in the direction of miniaturization, integration and multi-function, and surface mount technology has become the mainstream technology in the field of electronic assembly. Solder paste is a new type of soldering material that emerged with surface mount technology. The quality of solder paste directly affects the quality of soldering. Traditional solder paste products are composed of tin-lead tin powder and flux. With the advancement of technology in recent years and people's increasing concern for themselves and the environment, lead-free tin powder has gradually replaced tin-lead tin powder. The transition from lead-based solder paste to lead-free solder paste has met the requirements of env...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/362
Inventor 尹计深戴爱斌吕文慧
Owner JIANGSU BOQIAN NEW MATERIALS
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