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Terpolymer and thermosetting resin composition thereof

A technology of terpolymer and resin composition, which is applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., and can solve the problems of harsh reaction conditions, processing technology and storage effects, and dielectric constant and increased dielectric loss

Active Publication Date: 2014-12-17
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the acid anhydride curing agent is used in combination with epoxy resin, there is a problem of reactivity: in the case of no accelerator, the reaction conditions are harsh and the reaction temperature is high, but the reaction at room temperature is very fast when the accelerator is added. Both processing technology and storage are seriously affected
However, this patent uses the hydroxyl group on the hydroxyl modification agent or the newly generated carboxyl group after the modification reaction as the curing functional group to cure the epoxy resin, which will generate secondary hydroxyl groups during the curing process, which will deteriorate the dielectric properties of the cured product. , that is, the dielectric constant and dielectric loss increase, which is not conducive to its application in high-frequency and high-speed printed circuit board materials

Method used

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  • Terpolymer and thermosetting resin composition thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Fully dissolve 49 g of maleic anhydride, 110 g of dicyclohexylcarbodiimide, and 100 g of phenol in ethyl acetate, and then place them in a three-neck reaction flask for thorough mixing, then add 1.0 g of 4-dimethylaminopyridine under stirring, and After reacting at low temperature for 4 hours, the reaction solution was cooled in a low temperature environment of 0-5° C. for a period of time and then filtered to separate solid impurities, and then the obtained product was distilled and purified to obtain diphenyl maleate. Then, fully dissolve the diphenyl maleate 80g, styrene 830g, and maleic anhydride 175g prepared in front in butanone, add 45g benzoyl peroxide initiator and 100g pentene chain transfer agent, at 70~ The terpolymer (A-1) was prepared by reacting at 90°C for 5 hours. Its number average molecular weight was measured by GPC method to be 7000g / mol, and its structural formula contained the following three structural units:

[0052] (I) , (II) , (Ⅲ) ,

...

Embodiment 2

[0055] Fully dissolve 49g of maleic anhydride, 110g of dicyclohexylcarbodiimide, and 100g of phenol in ethyl acetate and then place them in a three-necked reaction flask and mix them thoroughly, then add 1.5g of 4-dimethylaminopyridine under stirring, and After reacting at low temperature for 4 hours, the reaction solution was cooled in a low temperature environment of 0-5° C. for a period of time and then filtered to separate solid impurities, and then the obtained product was distilled and purified to obtain diphenyl maleate. Then, fully dissolve the diphenyl maleate 400g, styrene 1040g, and maleic anhydride 33g prepared in front in butanone, add 50g benzoyl peroxide initiator and 100g pentene chain transfer agent, at 70~ The terpolymer (A-2) was prepared by reacting at 90°C for 5 hours. The number-average molecular weight was 11,000 g / mol as measured by GPC, and its structural formula contained the following three structural units:

[0056] (I) , (II) , (Ⅲ) ,

[0057...

Embodiment 3

[0059] Fully dissolve 49g of maleic anhydride, 110g of dicyclohexylcarbodiimide, and 170g of 3-hydroxy-1,2,3-benzotriazin-4(3H)-one in ethyl acetate and place in a three-neck reaction flask Mix well, then add 2.0g of 4-dimethylaminopyridine under stirring, react at room temperature for 8 hours, place the reaction solution in a low temperature environment of 0-5°C to cool for a period of time, then filter to separate solid impurities, and then prepare The obtained product is distilled and purified to obtain diphenyl maleate. Then, fully dissolve maleic acid diester 267g, styrene 312g, and maleic anhydride 33g in butanone, add 20g benzoyl peroxide initiator and 50g pentene chain transfer agent, at 70~90 The terpolymer (A-3) was prepared by reacting at ℃ for 5 hours. The number average molecular weight was measured by GPC method to be 14000g / mol, and its structural formula contained the following three structural units:

[0060] (I) , (II) , (Ⅲ) ,

[0061] In the formula,...

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Abstract

The invention provides a terpolymer containing structural units represented by a general formula (I), a general formula (II) and a general formula (III). The invention also provides a thermosetting resin composition containing the terpolymer and epoxy resin. The composition has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, processing manufacturability and storage performance. The invention also provides a prepreg and a laminate prepared from the thermosetting resin composition, and the thermosetting resin composition can be used in printed circuit substrate material and printed circuit board.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, in particular to a terpolymer and a thermosetting resin composition thereof, as well as a prepreg and a laminate made of the resin composition, and belongs to the technical field of electronic materials. Background technique [0002] In the prior art, the material prepared from the thermosetting resin composition with epoxy resin and its curing agent as an essential component has the advantages of good heat resistance, insulation, processability and low cost, so it is widely used in semiconductors, printing Among electronic materials such as circuit boards, it has become the most important raw material in printed circuit boards. [0003] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F212/08C08F222/08C08F222/14C08G59/42C08L63/00C08K13/04C08K7/14C08J5/24B32B15/092B32B27/04H05K1/03
Inventor 何继亮马建崔春梅
Owner SHENGYI TECH SUZHOU
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