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A kind of LED encapsulation silicone

A technology of LED encapsulation and silica gel, applied in the direction of adhesives, adhesive additives, electrical components, etc., can solve problems such as delamination, and achieve the effect of increasing the refractive index, improving stability, and high refractive index

Inactive Publication Date: 2017-02-01
SHENZHEN CAPCHEM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, nano-diamonds are prone to delamination when mixed with siloxane

Method used

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  • A kind of LED encapsulation silicone

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Experimental program
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Effect test

preparation example Construction

[0041] Further, the surface-modified nano-diamonds are prepared by the following method: white oil, siloxane coupling agent and nano-diamonds are mixed, and the mass ratio of the siloxane coupling agent and nano-diamonds is 2:1 , stirred evenly at 60-80°C, separated to obtain solids, dried at 120-150°C, -0.1-0.99Mpa for 60-120min, and obtained the surface-modified nano-diamond of claim 1; the silicon The oxane coupling agent is selected from one or more of γ-glycidyloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane and vinyltrimethoxysilane.

[0042] It can be seen from the above description that this embodiment provides a specific method for surface modification of nano-diamonds. Nano-diamonds are mainly grown by vapor phase deposition method, such as ICP, PECVD, MOCVD and other semiconductor process equipment. The particle size D50 is 10-100nm, and the thermal conductivity is 2300W / mk. And hydrophobicity, can prevent the intervention of air water vapor, avoid ...

Embodiment 1

[0055] 1. Preparation of surface-modified nanodiamonds

[0056] Take 50ml of white oil and put it into a 100ml beaker, add 0.10g of γ-glycidyl etheroxypropyl trimethoxysilane, add 0.05g of nano diamonds into the beaker, stir at 80°C for 20min, filter, and wash with toluene for 3 times , centrifuged, and dried at 150°C and -0.99Mpa for 120min to obtain surface-modified nano-diamonds.

[0057] 2. Preparation of LED packaging silica gel

[0058] 80 mass parts of polysiloxane A of 7000mPa.s, 20 mass parts of polysiloxane B of 500mPa, 0.2 mass parts of surface-modified nano-diamonds, 0.001 mass parts of curing accelerator and 0.0001 of curing inhibitor Under the action of the disperser, make it disperse evenly, remove the air bubbles in the vacuum defoamer, put the initial glue on the 50W COB after solid crystal and wire bonding, and heat at 80°C for 1h , and then heated at 150° C. for 3 hours for curing treatment, and then tested the optical brightness and attenuation life of th...

Embodiment 2

[0060] 1. Preparation of surface-modified nanodiamonds

[0061] Take 50ml of white oil and put it into a 100ml beaker, add 0.10g of γ-methacryloxypropyltrimethoxysilane, add 0.05g of nano-diamonds into the beaker, stir at 60°C for 20min, filter, and wash with toluene 3 times, centrifuge, and dry at 120°C and -0.1Mpa for 60min to obtain surface-modified nano-diamonds.

[0062] 2. Preparation of LED packaging silica gel

[0063] 90 mass parts of polysiloxane A of 8000mPa.s, 10 mass parts of polysiloxane B of 400mPa, 0.02 mass parts of nano-diamonds, 0.002 mass parts of curing accelerator and 0.0005 of curing inhibitor were dispersed in Under the action of the machine, make it disperse evenly, remove the air bubbles in the vacuum defoaming machine, point the initial glue on the 50W COB with crystal solidification and wire bonding, heat at 100°C for 0.5h, and then put it on Heating at 150° C. for 2 hours for curing treatment, and then testing the optical brightness and attenuati...

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Abstract

The invention relates to LED packaging silica gel which is prepared from the following raw materials in parts by weight: 50-90 parts of polysiloxane A, 10-50 parts of polysiloxane B, 0.01-0.5 part of surface-modified nano-diamond, 0.0001-0.0003 part of curing accelerator and 0.0001-0.001 part of curing inhibitor, wherein the polysiloxane A refers to polysiloxane of which each molecule contains at least two alkylenes and at least one aryl; the polysiloxane B refers to polysiloxane of which each molecule contains at least two Si-H and at least one aryl; and the surface-modified nano-diamond refers to nano-diamond of which the surface is connected with an organic group. The invention also relates to a method for preparing the LED packaging silica gel. The LED packaging silica gel provided by the invention has high index of refraction and high temperature resistance, so that the reliability of the light source is improved, the service life is prolonged, and compressive performances of packaging materials are effectively improved.

Description

technical field [0001] The invention relates to the field of LED encapsulation glue, in particular to an LED encapsulation silica gel. Background technique [0002] With the development of LED chips and their packaging technology, the traditional epoxy resin glue can no longer meet the needs of the existing packaging production. LED silicone has gradually replaced epoxy resin in the field of LED packaging to improve the lumen of the light source and reduce the light source. the cost of. The use of LED COB and the development of integrated technology is one of the current development directions. With the development of COB technology, more and more chips are concentrated in a limited size space, and the power of the light source is continuously increased, which puts forward higher requirements for the heat resistance and light extraction efficiency of silica gel. For high-power, high-brightness, high-power lamp beads, COB, outdoor street lights, and automotive lighting, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04H01L33/56
Inventor 赵大成汪雄伟马子淇
Owner SHENZHEN CAPCHEM TECH CO LTD