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Halogen-free soldering flux applicable to SnBi series soldering paste and preparation method

A technology of solder paste and flux, applied in welding equipment, welding medium, manufacturing tools, etc., can solve problems such as poor wettability, blackened solder joints, easy oxidation of alloy components, etc., and achieve the effect of solving poor solderability

Active Publication Date: 2015-01-28
云南锡业锡材有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

SnBi series solder paste is easy to oxidize due to its alloy composition and has poor wettability, so it is prone to blackening of solder joints after soldering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: Prepare raw materials according to the following weight ratio: hydrogenated rosin 30.0%, polymerized rosin 15.0%, ethylene glycol monoethyl ether 10.0%, dipropylene glycol methyl ether 28.0%, dipropionic acid 3.0%, adipic acid 2.0%, 5 - Hydroxysalicylic Acid 1.5%, Castor Oil 1.5%, Polyoxyethylglycerin 1.5%, ST 5.0%, Lauryl Hydroxystearamide 2.5%.

[0019] Specific preparation method:

[0020] 1) Melt ordinary hydrogenated rosin in a reactor at a temperature of 120°C to 130°C.

[0021] 2) Slowly add the solvent into the molten rosin, keep the temperature at 110°C to 120°C, stir for 10 minutes, then add the active agent and surfactant, and stir for 10 minutes.

[0022] 3) Cool the material to 70°C ~ 80°C, finally add the thixotropic agent and stir for 30 minutes.

[0023] 4) Cool to room temperature to obtain the flux of the present invention.

Embodiment 2

[0024] Embodiment 2: Raw materials are prepared according to the following weight ratio: water white rosin 25.0%, polymerized rosin 20.0%, dipropylene glycol monomethyl ether 15.0%, diethylene glycol methyl ether 25.0%, dipropionic acid 2.5%, succinic acid 2.5% %, 5-hydroxysalicylic acid 1.0%, castor oil 1.0%, polyoxyethylglycerin 1.5%, ST 5.5%, lauryl hydroxystearamide 1.0%.

[0025] Concrete preparation method is identical with embodiment 1.

Embodiment 3

[0026] Embodiment 3: Raw materials are prepared according to the following weight ratio: water white rosin 30.0%, polymerized rosin 15.0%, ethylene glycol monomethyl ether 15.0%, diethylene glycol (single) ether 25.0%, dipropionic acid 3%, clothing Conic acid 1.0%, 3,4-dihydroxybenzoic acid 1.0%, castor oil 1.5%, polyoxyethyl glycerin 1.0%, ST 5.5%, lauryl hydroxystearamide 2.0%.

[0027] Concrete preparation method is identical with embodiment 1.

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PUM

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Abstract

The invention relates to a formula and a preparation process of soldering-paste soldering flux serving as a soldering aid material of SMT (surface mount technology), belongs to the technical field of solder materials, and provides halogen-free soldering flux applicable to SnBi series soldering paste and a preparation method. Activators in the soldering flux system are malonic acid and halogen-free organic acid in the weight ratio of 2-3:1-3; a solvent is formed by mixing two kinds of ethers with different boiling points, and the boiling points are lower than the melting point of SnBi series alloy powder; the soldering flux comprises, by mass, 3.0-8.0% of the activators, 1.0-2.0% of antioxidant, 1.0-3.0% of wetting agent, 3.0-10.0% of thixotropic agent, 35.0-45.0% of the solvent and the balance of film forming agent. The soldering flux is high in activity and good in weldability and storage stability, and the problems that the SnBi series soldering paste is easy to oxidize and peripheries of solder joints are black are solved. The halogen-free soldering flux is applicable to SnBi series soldering paste products.

Description

technical field [0001] The invention relates to a formula and a preparation process of a soldering flux for solder paste, which is used as a soldering flux material for SMT and belongs to the technical field of soldering materials. Background technique [0002] Solder paste is mainly used in surface mount technology (SMT) welding. With the development of information equipment, SMT has become the mainstream technology of electronic assembly. Among them, the use of SnBi series solder paste is also increasing. On the other hand, the quality of solder paste depends not only on the quality of solder powder, but also on the performance of flux in solder paste. Therefore, it is particularly important to study the formulation and preparation of flux in SnBi series solder paste. [0003] There are many types of fluxes for solder paste, and their component ratios and applicability are different. SnBi series solder paste is easy to oxidize due to its alloy composition, and its wettabi...

Claims

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Application Information

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IPC IPC(8): B23K35/362
CPCB23K35/362
Inventor 秦俊虎白海龙刘宝权古列东吕金梅赵玲彦邓勇段雪霖孙萍肖飞武信
Owner 云南锡业锡材有限公司
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