Organic silicon modified phenyl emulsion pressure-sensitive adhesive with high release force and low residue as well as preparation method thereof and application

A silicone, low-residue technology, used in adhesives, adhesive types, ester copolymer adhesives, etc., which can solve the problems of easy hydrolysis of silicone monomers, unstable system cohesion, and large differences in reactivity ratios. , to avoid hydrolysis and self-condensation, ensure mechanical stability, and achieve the effect of narrow particle size distribution

Inactive Publication Date: 2015-02-11
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of siloxane containing double bonds and acrylate free radical copolymerization to introduce siloxane still has some shortcomings, such as the easy hydrolysis and condensation of silicone monomers, and

Method used

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  • Organic silicon modified phenyl emulsion pressure-sensitive adhesive with high release force and low residue as well as preparation method thereof and application
  • Organic silicon modified phenyl emulsion pressure-sensitive adhesive with high release force and low residue as well as preparation method thereof and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Weigh 32.8g of butyl acrylate, 32.8g of isooctyl acrylate, 1.6g of acrylic acid, 3.6g of hydroxypropyl acrylate, 5.2g of methyl methacrylate, and 4g of styrene, and mix them evenly to obtain a mixed monomer; mix 48ml of water, 0.8 Add g2-acrylamido-2-methylpropanesulfonic acid, 1.06g sodium dodecyl sulfate (SDS), 0.54g octylphenol polyoxyethylene ether (OP-10) into the pre-emulsification bottle and stir to dissolve, add For a good monomer mixture, pre-emulsify for 30 minutes under stirring at 10000r / min to obtain a pre-emulsion.

[0035] Add 26ml of water to a four-neck flask, add aqueous sodium bicarbonate solution (0.2g of sodium bicarbonate dissolved in 10ml of water), protect it with nitrogen, put it in an oil bath at 65°C, and measure about 1 / 8 by volume with a graduated cylinder After adding the pre-emulsion, stir at a speed of 260 rpm, raise the temperature to 70°C, add an aqueous initiator solution (0.3g potassium persulfate is dissolved in 10ml water), and cont...

Embodiment 2

[0040] Weigh 35.5g of butyl acrylate, 35.5g of isooctyl acrylate, 1.6g of acrylic acid, 3.6g of hydroxypropyl acrylate, 2.2g of methyl methacrylate, and 1.7g of styrene, and mix them evenly to obtain a mixed monomer; mix 48ml of water, Add 1.6g of 2-acrylamido-2-methylpropanesulfonic acid, 0.53g of sodium dodecyl sulfate (SDS), and 0.27g of octylphenol polyoxyethylene ether (OP-10) into the pre-emulsification bottle and stir to dissolve, add The weighed mixed monomer was pre-emulsified for 40 minutes under stirring at 6000r / min to obtain a pre-emulsion.

[0041] Add 26ml of water into the four-neck flask, add aqueous sodium bicarbonate solution (0.2g of sodium bicarbonate dissolved in 10ml of water), protect it with nitrogen, put it in an oil bath at 70°C, and measure about 1 / 8 by volume with a graduated cylinder After adding the pre-emulsion, stir at a speed of 100 rpm, raise the temperature to 80°C, add an aqueous initiator solution (0.3g potassium persulfate dissolved in 10...

Embodiment 3

[0046] Weigh 35.5g of butyl acrylate, 35.5g of isooctyl acrylate, 1.6g of acrylic acid, 3.6g of hydroxypropyl acrylate, 2.2g of methyl methacrylate, and 1.7g of styrene, and mix them evenly to obtain a mixed monomer; mix 48ml of water, Add 1.2g of 2-acrylamido-2-methylpropanesulfonic acid, 0.8g of sodium dodecyl sulfate (SDS), and 0.4g of octylphenol polyoxyethylene ether (OP-10) into the pre-emulsification bottle and stir to dissolve. Add the weighed mixed monomer, and pre-emulsify for 20 minutes under stirring at 8000r / min to obtain a pre-emulsion.

[0047] Add 26ml of water into the four-neck flask, add aqueous sodium bicarbonate solution (0.2g of sodium bicarbonate dissolved in 10ml of water), protect it with nitrogen, put it in an oil bath at 70°C, and measure about 1 / 8 by volume with a graduated cylinder After adding the pre-emulsion, stir at a speed of 600 rpm, raise the temperature to 80°C, add an aqueous initiator solution (0.3g potassium persulfate dissolved in 10ml ...

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Abstract

The invention belongs to the technical field of pressure-sensitive adhesive for packaging an electronic product, and discloses organic silicon modified phenyl emulsion pressure-sensitive adhesive with high release force and low residue and a preparation method thereof. The method comprises the following steps: firstly synthesizing polyacrylate seed emulsion, adding organic silicon by utilizing an after-dropping technology, facilitating the ring-opening reaction of an epoxy group with carboxyl on a polymer chain and an amino group on a reactive emulsifier to obtain organic silicon modified phenyl emulsion through the treatment after heating an adhesive film. By increasing cross-linking points of carboxyl and hydroxy, the cohesion can be further enhanced. By adopting the method, the introduction of siloxane which does not contain two bonds is realized, the weakness of the low conversion rate caused by different cohesion rates when vinyl siloxane and acrylate monomer are copolymerized can be overcome, the difficulty of the reduced polymer stability caused by the hydrolysis of the organic silicon can be solved, the complicated procedure that the cohesion can be improved by additionally adding the cross-linking agent is avoided, the low residual adhesion under high initial adhesion and high stripping strength can be realized, and the water resistance and high-temperature aging resistance can be improved.

Description

technical field [0001] The invention belongs to the technical field of pressure-sensitive adhesives used for electronic product packaging, and in particular relates to a silicone-modified styrene-acrylic emulsion-type pressure-sensitive adhesive with good peelability and low residue and its preparation and application. Background technique [0002] During the production, transportation and storage of electronic products, they need to be packaged and protected to avoid mechanical scratches or dust pollution. The commonly used method is to paste a layer of surface protection film, and then remove the protection film after processing, transportation and other treatments. [0003] However, the current problem is that there is residual glue after peeling off, which affects the use of electronic products. According to the cause and mechanism of adhesive residue: changes in peel strength over time, aging, surface compatibility with the adherend, stretching effect, etc., the main s...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J7/02C08F220/18C08F220/14C08F220/28C08F212/08C08F220/06C08F220/58C08F2/26C08F2/30
Inventor 廖兵李朋娟庞浩李海涛黄健恒程劲松刘海露马哲
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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