Modified alumina composite material, copper clad substrate and preparation method thereof

A technology for composite materials and copper-clad substrates, applied in chemical instruments and methods, circuit substrate materials, synthetic resin layered products, etc. Problems such as low force

Active Publication Date: 2017-04-12
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, alumina particles have a large specific surface area and high surface energy, so that alumina particles are easy to aggregate into agglomerates, and because of the low force between alumina and polymer, it is more difficult for alumina to be uniform in the polymer matrix. Distribution, the traditional copper-clad substrate containing alumina particles is prone to clustering

Method used

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  • Modified alumina composite material, copper clad substrate and preparation method thereof
  • Modified alumina composite material, copper clad substrate and preparation method thereof
  • Modified alumina composite material, copper clad substrate and preparation method thereof

Examples

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preparation example Construction

[0059] Such as figure 1 The preparation method of the above-mentioned copper-clad substrate shown includes the following steps:

[0060] S10. Dissolve 35-55 parts of modified alumina particles, 15-35 parts of liquid crystal epoxy resin, 10-21 parts of curing agent and 0.1-1 part of accelerator in an organic solvent according to the mass fraction , the mixed solution was obtained after ultrasonication for 0.5h-2h.

[0061] The organic solvent can be 2-butanone or acetone.

[0062] The modified alumina particles are obtained by modifying the alumina particles with a silane coupling agent. The particle size of the modified alumina particles may be 100nm-1000nm.

[0063] In a preferred embodiment, the particle size of the modified alumina particles is 700nm.

[0064] The silane coupling agent is γ-aminopropyltriethoxysilane, γ-(2,3-glycidoxy)propyltrimethoxysilane or γ-methacryloxypropyltrimethoxysilane.

[0065] The process of modifying alumina particles with silane coupling...

Embodiment 1

[0086] (1) Preparation of γ-aminopropyltriethoxysilane-modified alumina.

[0087] First, dry the alumina particles at 110°C for 4 hours. After cooling to room temperature, weigh 15.0 g of alumina particles with a particle size of 700 nm and 50 mL of xylene into a three-necked flask for ultrasonic dispersion for 10 minutes, then put them in an oil bath, and stir them magnetically. solution and warmed to 90°C. Add 1.0 g of the surface modifier γ-aminopropyltriethoxysilane dropwise with a dropper, raise the temperature to 115° C. after the dropwise addition, keep magnetic stirring, and react for 6 hours.

[0088] Cool the mixed solution, pour it into a suction filter funnel while it is hot, wash the sample obtained by suction filtration with absolute ethanol several times, put it in a vacuum drying oven at 110°C for 12 hours, and obtain γ-aminopropyltriethoxysilane surface-modified of alumina.

[0089] figure 2 and image 3 These are the SEM pictures of the alumina particles...

Embodiment 2

[0105] The preparation method is basically the same as that of Example 1, except that the curing agent used in step (2) is 4,4'-dihydroxybiphenyl, stirred and mixed evenly at 130°C, and reacted at 130°C for 30 minutes to obtain amber viscous transparent epoxy resin compound.

[0106] The prepared copper-clad substrate includes a first electrode layer, a dielectric layer and a second electrode layer stacked in sequence, wherein both the first electrode layer and the second electrode layer are copper foil sheets with a thickness of 40 microns, and the dielectric layer consists of two prepregs composition, with a thickness of 500 microns.

[0107] After testing, it was found that the radial thermal conductivity of the substrate material was 0.876W / m·K, the axial thermal conductivity was 1.358W / m·K, and the glass transition temperature was 130°C.

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Abstract

Disclosed is a modified aluminium oxide composite material, comprising the following materials in parts by mass: 35-55 parts of modified aluminium oxide particles, 25-35 parts of reinforced fibers, 15-35 parts of a liquid crystal epoxy resin, 10-21 parts of a curing agent and 0.1-1 parts of an accelerant; the modified aluminium oxide particles are obtained by modifying aluminium oxide particles by a silane coupling agent. The modified aluminium oxide composite material comprises modified aluminium oxide particles, reinforced fibers and a liquid crystal epoxy resin. After the aluminium oxide particles are modified by the silane coupling agent, active chemical groups such as an amino group and a hydroxyl group are formed on the surface thereof, and the aluminium oxide particles are chemically bonded to the liquid crystal epoxy resin via active groups such as the amino group and the hydroxyl group formed on the surface, thus improving an interaction effect at an interface, reducing thermal resistance at the interface and reducing clustering. Also disclosed are a copper-coated substrate employing the above modified aluminium oxide composite material and preparation method thereof.

Description

technical field [0001] The invention relates to the field of preparation of copper-clad substrates, in particular to a modified alumina composite material, a copper-clad substrate using the modified alumina composite material and a preparation method thereof. Background technique [0002] Copper-clad substrate is a plate material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. The copper-clad substrate mainly provides three functions of heat conduction, insulation and support for the chip, and is a key raw material for manufacturing printed circuit boards (PCBs). In recent years, electronic products are developing in the direction of portability, miniaturization, light weight and multi-function. This market demand puts forward higher requirements for copper clad substrates. [0003] Alumina is by far the most commonly used substrate material in the microelectronics ind...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K13/06C08K9/06C08K3/22C08K7/10C08G59/62C08G59/50C08G59/24B32B15/092B32B27/04B32B37/10B32B37/06H05K1/03
CPCB32B15/092B32B27/04B32B37/06B32B37/10C08K3/22C08K7/10C08K9/06C08K13/06C08L63/00H05K1/03
Inventor 曾小亮孙蓉郭坤
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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