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A Diode Sputtering Coating Equipment for Coating the Inner Wall of a Vacuum Cup

A technology for sputtering coating and coating equipment, applied in the field of vacuum cups, can solve problems such as raising production costs, differences in coating quality, and inability to form industrialization.

Active Publication Date: 2017-01-25
BEIJING TECHNOL SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing coating equipment on the market has certain defects and technical bottlenecks in coating the inner wall of the vacuum cup
For example, the electroplating method, especially the electroplating of heavy metals such as copper and silver, will cause serious environmental pollution and resource and energy consumption; general PVD (physical vapor deposition) vacuum coatings such as vacuum evaporation, magnetron sputtering and multi-arc ion plating are difficult to achieve. The uniform coating of the deep or complex inner wall can not even be completely covered, and the different positions of the workpiece will cause a huge difference in the quality of the coating; although CVD (chemical vapor deposition) can achieve uniform coating, the silver and copper gas source is expensive. High production cost, unable to form industrialization

Method used

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  • A Diode Sputtering Coating Equipment for Coating the Inner Wall of a Vacuum Cup
  • A Diode Sputtering Coating Equipment for Coating the Inner Wall of a Vacuum Cup

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Use this diode sputtering coating equipment for coating the inner wall of the vacuum cup to plate nano-silver coating on the inner wall of the stainless steel vacuum cup.

[0033] First, ultrasonically clean the inner wall of the stainless steel vacuum cup and the silver electrode and dry them. At the same time, clean the vacuum chamber and vacuum system of the equipment, and place the vacuum cup and silver electrode in the vacuum chamber. Start the vacuum system to evacuate until the vacuum degree of the vacuum chamber rises to 10 -4 Pa order of magnitude; open the heater vacuum cup workpiece to 200 and open the argon valve to feed argon until the vacuum chamber pressure is 10 0 Pa order of magnitude; turn on the sputtering power supply and adjust the voltage to about 4KV, turn on the bias power supply and adjust the voltage to about 100V. The coating time is 20~60 minutes.

Embodiment 2

[0035] The nano-copper alloy coating is plated on the inner wall of the stainless steel vacuum cup by using the diode sputtering coating equipment for coating the inner wall of the vacuum cup.

[0036] First, ultrasonically clean the inner wall of the stainless steel vacuum cup and silver electrodes and dry them. At the same time, clean the vacuum chamber and vacuum system of the equipment, and place the vacuum cup and copper alloy electrodes in the vacuum chamber. Start the vacuum system to evacuate until the vacuum degree of the vacuum chamber rises to 10 -4 Pa order of magnitude, open the heater vacuum cup workpiece to 300 and open the argon valve to feed argon until the vacuum chamber pressure is 10 0 Pa order of magnitude, turn on the sputtering power supply and adjust the voltage to about 6KV, turn on the bias power supply and adjust the voltage to about 150V. The coating time is 10~20 minutes.

[0037] The technology used in the present invention is the two-pole sputt...

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Abstract

The invention discloses diode sputtering coating equipment used for coating the inner wall of a vacuum cup. The diode sputtering coating equipment comprises a support, a sputtering coating device and a vacuum device, wherein the sputtering coating device is arranged on the support, the vacuum device is connected with one end of the sputtering coating device, and a plurality of cup tools are arranged in the sputtering coating device and can be matched with different sputtering electrodes. The diode sputtering coating equipment has the benefits that the diode sputtering coating equipment is suitable for vacuum cups in different sizes and shapes and is simple in structure, easy to maintain and good in continuity; multiple workpieces can be machined in the same parameter, the production efficiency is high, and the quality consistence of coatings is good; additionally, due to the fact that the sputter electrodes can be replaced freely, the deposition temperature and other key parameters can be adjusted at will, and the quality and the components of the coatings can be adjusted; besides, once a more developed anti-bacteria coating is developed in the future, the equipment is very favorable for updating of the novel anti-bacteria coating and quick building of industrialization.

Description

technical field [0001] The invention relates to a two-pole sputtering coating device for coating the inner wall of a vacuum cup, which is applicable to vacuum cups with various sizes and shapes of the inner wall. Background technique [0002] With the development of society, vacuum cups have entered thousands of households, and the models and categories on the market are becoming more and more abundant. The main function of the vacuum cup is heat insulation. Its principle is to seal a vacuum interlayer with a certain degree of vacuum between the inner and outer layers of structural materials, and then supplement it with a sealed top cover to achieve the purpose of reducing internal and external heat exchange. With the advancement of technology, the traditional vacuum cup with tail has been replaced by the vacuum cup without tail. Using high-temperature fusion sealing technology to operate numerical control in a large vacuum chamber, it can be sealed in the stainless steel li...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/36
CPCC23C14/34C23C14/3492
Inventor 施戈彭建陈良贤
Owner BEIJING TECHNOL SCI
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