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Process for producing layered product, layered product, process for producing layered product with device using said layered product, and layered product with device

By adding lubricant and patterning treatment to the polyimide film, combined with coupling agent and organic alkali treatment, the problems of surface smoothness and dimensional stability when the polyimide film is bonded to the inorganic substrate are solved, achieving It achieves efficient device manufacturing under high temperature conditions and improves the performance and production efficiency of semiconductor components.

Inactive Publication Date: 2015-03-04
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is necessary to use laser irradiation or etching means on the adhesive layer when peeling off, and the process becomes complicated and the cost becomes high
Patent Document 6 discloses the use of UV irradiation to bond polymer films to each other, and discloses that it is also effective to use a coupling agent at this time. However, this technology only involves the bonding of polymer films, not the coupling by UV light irradiation. Control of the bonding and peeling force of the joint agent itself
[0015] In the case of a device requiring smoothness of the film surface, if the surface of a film to which a lubricant is generally added is compared with a glass substrate or the like, the surface roughness becomes large, so it is difficult to use a film with excellent productivity in the above device, and in When a film without lubricant is conveyed by multiple rollers, microscopic damage will inevitably be introduced in this process
Therefore, it is difficult to create a smooth surface only by directly applying a varnish without adding a lubricant to a glass substrate and firing it.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0188] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated more concretely, this invention is not limited to the following Example. In addition, the evaluation methods of the physical properties in the following examples are as follows.

[0189] 1. Reduced viscosity (ηsp / C) of polyamic acid

[0190] Ubbelohde-type viscometer tube (Ubbelohde-type viscometer tube) at 30 ° C to the concentration of polymer dissolved in N-methyl-2-pyrrolidone (or N, N-dimethylacetamide) to 0.2 g / dl solution was measured. (When the solvent used in the preparation of the polyamic acid solution is N,N-dimethylacetamide, use N,N-dimethylacetamide to dissolve the polymer and perform the measurement.)

[0191] 2. Solution viscosity of polyamic acid solution

[0192] Measurement was carried out at 25° C. using a Brookfield viscometer.

[0193] 3. Thickness of polyimide film etc.

[0194] Measurement was performed using a micrometer (Millitron 1245D...

manufacture example 1~3

[0241] (Preparation of polyamic acid solution A)

[0242] After nitrogen replacement in the reaction vessel equipped with a nitrogen gas inlet tube, a thermometer, and a stirring rod, 223 parts by mass of 5-amino-2-(p-aminophenyl)benzoxazole and 4416 parts by mass of N,N-dimethylacetamide were added. After completely dissolving it, add 217 parts by mass of pyromellitic dianhydride and SNOWTEX (DMAC-ST30, Nissan Chemical Industry Co., Ltd. ), made the amount of silicon dioxide described in Table 1, and stirred at a reaction temperature of 25°C for 24 hours to obtain brown and viscous polyamic acid solutions A1 to A3. The measurement results are described in Table 1 and Table 2.

manufacture example 4~6

[0244] (Preparation of polyamic acid solution B)

[0245] After replacing nitrogen in the reaction vessel equipped with a nitrogen introduction tube, a thermometer, and a stirring rod, 398 parts by mass of 3,3',4,4'-biphenyltetracarboxylic dianhydride as tetracarboxylic dianhydride, terephthalic dianhydride, and 147 parts by mass of amines were dissolved in 4600 parts by mass of N,N-dimethylacetamide, and reacted in the same manner while keeping the temperature at 20° C. or lower to obtain polyamic acid solutions B1 to B3. The measurement results are described in Table 1 and Table 2.

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PUM

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Abstract

Provided is a backing-supported layered polyimide which has a smooth surface to enable a sophisticated device to be formed thereon and in which the layered polyimide does not readily peel off even in a high-temperature process for device formation and can be easily separated from the backing after the device formation on the layered polyimide. A polyimide film is used in which the surface that is to face a backing has undergone a surface treatment. At least either of the surfaces of the backing and polyimide film which are to face each other is patterned using a coupling agent to form a satisfactorily bondable part and an easily releasable part which differ in adhesion / peel strength. Thereafter, the backing and the polyimide film are superposed and laminated by pressing and heating. The surface of the polyimide film is treated with an organic alkali, and subsequently a polyamic acid solution containing no lubricant ingredient is applied and then dried and imidized. Thus, a layered product which has a structure composed of at least three layers and has one or more layers that contain a lubricant and in which both surfaces contain no lubricant is produced.

Description

technical field [0001] The present invention relates to a method for producing a polyimide laminate with a support composed of a polyimide laminate and a support, the polyimide laminate with a support, and the polyimide laminate with a support. Manufacturing method of a polyimide laminate with a support and a device in which a device is formed on an imide laminate, the polyimide laminate with a support and a device, and from the support and a device Method for producing a polyimide laminate with a device except for a support, and the polyimide laminate with a device, in which the above-mentioned devices, that is, a semiconductor element, a MEMS element, a display element, etc. are included When thin-film devices requiring microfabrication are formed on the surface of a polyimide film, it is used to bond the polyimide film temporarily or even semi-permanently to a substrate formed of an inorganic substance as a support to obtain a support and a tape. Method for a polyimide lam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/34H05K1/03
CPCB32B27/34H05K1/0346H05K2201/0154H05K3/007B32B7/06B32B27/08B32B27/16B32B27/281B32B27/36B32B2255/10B32B2255/26B32B2307/746B32B2307/748B32B2379/08B32B2457/08B32B2457/14B32B37/12B32B37/182B32B38/04B32B38/10B32B2310/0831B32B2457/00Y10T428/24612B32B37/26B32B5/145B32B37/0038B32B2250/04
Owner TOYOBO CO LTD