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A low dielectric constant double-sided flexible copper clad laminate

A flexible copper clad laminate, low dielectric constant technology, used in electronic equipment, lamination, applications, etc., can solve the problem that the thickness of the insulating layer cannot be made thin

Active Publication Date: 2016-09-14
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the deficiencies of the prior art, the present invention provides a low dielectric constant double-sided flexible copper-clad laminate and a preparation method thereof, which can prepare Low Dk double-sided flexible copper-clad laminates with an insulating layer thickness as low as 13 μm, while ensuring relatively high The mechanical properties of the insulating layer in the case of thin thickness can solve the problem that the thickness of the insulating layer cannot be made thinner when using liquid crystal polyester film to prepare Low Dk double-sided flexible copper clad laminates.

Method used

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  • A low dielectric constant double-sided flexible copper clad laminate
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  • A low dielectric constant double-sided flexible copper clad laminate

Examples

Experimental program
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Effect test

Embodiment 1

[0025] A method for preparing a low dielectric constant double-sided flexible copper clad laminate includes the following steps:

[0026] 1) Prepare the polyimide resin precursor solution, the preparation method is as follows:

[0027] Weigh 23.10g of TFMB and dissolve it in 180g of DMAc while stirring in a 500ml three-necked flask, then cool the solution to 10°C in a water bath, slowly add 21.07g of BPDA under nitrogen flow, and continue stirring for 6 hours. Polymerization reaction, prepared viscous polyimide resin precursor solution.

[0028] 2) Apply the polyamic acid solution of Low Dk obtained in step 1) on a 12μm electrolytic copper foil, and control the thickness of the polyamic acid solution so that the thickness of the polyimide layer obtained after imidization is 5μm; at 160°C Bake for 3 minutes to remove part of the solvent, and then apply the liquid crystal polyester solution to control its thickness in the finished product to 1.5μm. Bake at 160°C for 3 minutes, and the...

Embodiment 2

[0031] A method for preparing a low dielectric constant double-sided flexible copper clad laminate includes the following steps:

[0032] 1) Prepare the polyimide resin precursor solution, the preparation method is as follows:

[0033] Weigh 23.10g of TFMB and dissolve it in 180g of DMAc while stirring in a 500ml three-necked flask, then cool the solution to 10°C in a water bath, slowly add 21.07g of BPDA under nitrogen flow, and continue stirring for 6 hours. Polymerization reaction, prepared viscous polyimide resin precursor solution.

[0034] 2) Coat the 12μm electrolytic copper foil with the polyamic acid solution of Low Dk obtained in step 1), and control the thickness of the polyamic acid solution so that the thickness of the polyimide layer obtained after imidization is 7μm; at 160°C Bake for 3 minutes to remove part of the solvent, and then apply the liquid crystal polyester solution to control its thickness in the finished product to 3μm. Bake at 160℃ for 3min, and then bak...

Embodiment 3

[0037] A method for preparing a low dielectric constant double-sided flexible copper clad laminate includes the following steps:

[0038] 1) Prepare the polyimide resin precursor solution, the preparation method is as follows:

[0039] Weigh 23.10g of TFMB and dissolve it in 180g of DMAc while stirring in a 500ml three-necked flask, then cool the solution to 10°C in a water bath, slowly add 21.07g of BPDA under nitrogen flow, and continue stirring for 6 hours. Polymerization reaction, prepared viscous polyimide resin precursor solution.

[0040] 2) Coat the 12μm electrolytic copper foil with the polyamic acid solution of Low Dk obtained in step 1), and control the thickness of the polyamic acid solution so that the thickness of the polyimide layer obtained after imidization is 8μm; at 160°C Bake for 3 minutes to remove part of the solvent, and then apply liquid crystal polyester solution to control its thickness in the finished product to 4.5μm, bake at 160℃ for 3min, and then bake ...

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Abstract

The invention provides a low-dielectric-constant two-side flexible copper-clad plate of a novel structure. The low-dielectric-constant two-side flexible copper-clad plate comprises an insulation layer and copper foil layers on two sides of the insulation layer, wherein the insulation layer consists of a liquid crystal polyester layer and Low Dk polyimide resin layers on two sides of the liquid crystal polyester layer, and the thickness of the insulation layer is 12 to 50 micrometers. According to the low-dielectric-constant two-side flexible copper-clad plate and a preparation method thereof, the Low Dk two-side flexible copper-clad plate with the thickness of 13 micrometers can be prepared, the mechanical property of the insulation layer also can be guaranteed under the situation of small thickness, and the problem of the soft plate industry at present that the thickness of the insulation layer cannot be minimized when the Low Dk two-side flexible copper-clad plate is prepared by utilizing the liquid crystal polyester film can be solved.

Description

Technical field [0001] The present invention relates to the technical field of copper clad laminates, in particular to a low dielectric constant flexible copper clad laminate. Background technique [0002] With the rapid development of information science and technology, various electronic consumer products with high-speed information processing functions have become an indispensable part of people’s daily lives, which has accelerated the transformation of wireless communication and broadband application industrial technology from traditional military fields to civilian consumer electronics. The speed of field transfer. Due to the strong demand in the consumer electronics market, higher technical requirements such as high-speed information transmission, completeness, and product multi-function and miniaturization have been continuously proposed, which has promoted the continuous development of high-frequency and high-speed application technologies. Because high Dk will slow down...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B27/08B32B15/20B32B37/06B32B37/10
CPCB32B15/01B32B2250/02B32B2255/06B32B2255/26B32B2307/206B32B2309/105B32B2457/00
Inventor 梁立茹敬宏伍宏奎
Owner GUANGDONG SHENGYI SCI TECH