Manufacturing method for anti-electromagnetic interference thin-film capacitor

Abstract

The invention discloses a manufacturing method for an anti-electromagnetic interference thin-film capacitor. The method comprises the steps of (1) thin-film metallization, wherein polypropylene thin films are adopted as base films, zinc and aluminum are used as evaporation materials, the method for thickening the edge of a metallization layer is adopted, the sheet resistance of the edge portion ranges from 1 omega / square to 2 omega / square, and the internal sheet resistance ranges from 6 omega / square to 10 omega / square; (2) winding and forming, wherein the metallization polypropylene thin films and a metallization electrode form a capacitor core in a non-inductive winding mode, the space ranging from 0.6 mm to 0.75 mm is formed between the two thin films during winding, series connection is achieved inside the core, and then forming is carried out; (3) metal spraying, wherein a metal alloy layer is sprayed on the end face of the core, pure zinc materials are selected as a bottoming, and then zinc-tin alloy lines are sprayed; (4) enabling; (5) welding assembly and epoxy resin encapsulation; (6) testing. According to the manufacturing method for the anti-electromagnetic interference thin-film capacitor, the obtained thin-film capacitor can bear high current density and pulse current, and is high in voltage resistance and good in dielectric property.

Description

Technical field [0001] The invention relates to the technical field of film capacitor manufacturing, in particular to a method for manufacturing an anti-electromagnetic interference film capacitor. Background technique [0002] With the development of electronic science and technology, the technical content and complexity of household appliances and electronic products continue to increase, generating a large amount of electromagnetic radiation, making the electromagnetic environment increasingly complex. The electromagnetic compatibility of electrical and electronic products has received increasing attention from governments and manufacturers. Relevant departments have stipulated that all electronic products can enter the market only if they meet electromagnetic compatibility standards. This has promoted the development of anti-electromagnetic interference countermeasure electronic components and circuit protection electronic components. Anti-electromagnetic interference capac...

AI Technical Summary

Problems solved by technology

However, under the impact of high pulse voltage and current, the current film capacitors tend to increase the temperature at the junction of the metal film and the gold-sprayed layer, and the film inside the core shrinks, which directly affects the contact state between the end face of the core and the gold-sprayed layer. It often happens that the gold-sprayed layer is disconnected from the core, and the shell smokes and bursts. Moreover, after a long time, problems such as a decrease in capacitance and short-circuit breakdown of the core often occur.