Liquid photosensitivedark dark-color solder resisting material and preparation method thereof

A photosensitive solder resist and liquid technology, which is applied in the field of circuit board materials, can solve the problems that the heat resistance is difficult to meet the user's requirements, the solder resist layer is easy to become brittle, and the scrap rate increases, and it can solve the problem of poor bridge protection performance and excellent performance. , the effect of a reasonable formula

Active Publication Date: 2015-04-15
江门市阪桥电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Liquid photosensitive solder resist materials include both photocurable and thermally curable materials. The photosensitive resin is mainly obtained by reacting novolac epoxy resin with unsaturated carboxylic acid and then reacting with acid anhydride. Because the resin contains acid groups, so It can be developed with alkaline water. The material has excellent heat resistance after curing, but because of the large shrinkage after curing, the solder mask layer is easy to become brittle, and the scrap rate is high in the production process.
In order to change the brittleness of photosensitive resins using novolac epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins or methylol bisphenol A epoxy resins have been used to completely replace novolac epoxy resins. Epoxy resin or partial replacement products to synthesize photosensitive resin, which has indeed been greatly improved in terms of shrinkage after curing, but unfortunately bisphenol A or bisphenol F and its modified bisphenol A or bisphenol F The heat resistance of epoxy resin is always a bit difficult to meet the requirements of users, especially the implementation of the lead restriction order, bisphenol A or bisphenol F and its modified bisphenol A or bisphenol F epoxy resin in soldering pure tin Or the solder resistance is more attacked when soldering tin, and the novolak epoxy resin is also incapable of soldering pure tin or soldering tin, resulting in an increase in the scrap rate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The production method of the photosensitive resin described in this example is: dissolve 200 parts of silicone-modified novolac epoxy resin in 199.5-220 parts of solvent in a reaction vessel, heat to 80°C to dissolve, and add unsaturated mono 90 parts of carboxylic acid methacrylic acid, 1.5 parts of N,N-dimethylbenzylamine, 80 parts of toluene, and 1 part of concentrated sulfuric acid, heated to 100°C-120°C for about 12 hours, refluxed for dehydration, distilled to remove toluene, then added 70.5-135 parts of acid anhydride, heated to 110°C-130°C, and reacted for 10 hours to obtain a photosensitive resin with an acid value of 60mgKOH / g to 75mgKOH / g and a solid content of 70%.

Embodiment 2

[0022] For the liquid photosensitive dark solder resist material described in this example, take the following components according to the weight ratio, take 55 parts of photosensitive resin made by the method in Example 1, and 40 parts of trisphenol methane triglycidyl ether epoxy resin , 20 parts of barium sulfate, 1 part of phthalocyanine green, 0.5 parts of dicyandiamide, 10 parts of polydipentaerythritol hexaacrylate, 0.5 parts of additives, 6.5 parts of ethylene glycol monoethyl ether acetate, put the above substances under the high-speed disperser Disperse evenly, then grind on a three-roller machine to a fineness of ≤ 20 μm, and finally adjust the viscosity to 65 ps with 6 parts of ethylene glycol monoethyl ether acetate to obtain the new photosensitive resin liquid photosensitive solder resist material of the present invention. The performance test results are as follows:

[0023] Pre-baking (75°C): 40 minutes

[0024] Exposure: 330mJ / cm2

[0025] Exposure Level: Le...

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PUM

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Abstract

The invention discloses a liquid photosensitive solder resisting material. The solder resisting material comprises the components of photosensitive resin, acrylic acid monomer, hot solidification resin, paint, a filling material, a photoinitiator, an additive and a solvent, and is characterized by comprising the following materials in parts by weight: 30-50 parts of photosensitive resin, 10-20 parts of an acrylic acid monomer, 3-20 parts of hot solidification resin, 2-5 parts of paint, 20-35 parts of a filling material, 3-8 parts of a photoinitiator, 0.3-5 parts of an additive, and 25-40 parts of a solvent. The obtained liquid photosensitive solder resisting material has superior heat resistance, and excellent flexibility, improves bridge protecting performance to 2.5 mil through a resin synthesis reaction, solves the problem that the bridge protecting performance of original photosensitive resin is low, and is simple in technology, reasonable in formula and good in performance.

Description

technical field [0001] The invention relates to a circuit board material, and proposes a series of new liquid photosensitive dark solder resist materials used on PCBs. The solder resist material forms a solder resist layer on the surface of PCB. The invention also relates to liquid photosensitive dark color resist Welding materials and their preparation methods. Background technique [0002] The solder mask is a permanent protective layer coated on the surface of the printed board. It selectively protects the surface of the printed board and prevents short circuits and bridging between wires and pads when soldering components. In addition, it also has the functions of moisture proof, mildew proof and salt spray proof. Therefore, the quality of the solder mask not only affects the appearance of the printed board, but also affects the service life of the printed board. With the development of printed circuit boards, curtain coating (or screen printing) liquid photosensitive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075C08G59/17C08G59/14
Inventor 周中涛
Owner 江门市阪桥电子材料有限公司
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