High-toughness low-shrinkage epoxy resin composition, insulating part and preparation method

An epoxy resin, low shrinkage technology, applied in low shrinkage epoxy resin materials, high toughness fields for high voltage electrical insulation products, can solve the problems of high brittleness of epoxy resin, easy cracking of metal insert interface, etc., to solve the problem of brittleness Large, improve insulation and sealing performance and service life, the effect of high impact strength

Inactive Publication Date: 2015-04-29
SHENZHEN WOER HEAT SHRINKABLE MATERIAL +4
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the high-voltage insulation parts using epoxy resin overcome the shortcomings of traditional ceramic and glass high-voltage insulation products such as easy damage, but due to the high brittleness of epoxy resin itself, problems such as easy cracking at the interface with metal inserts after curing strictly limit its use in high-voltage insulation. Insulation application

Method used

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preparation example Construction

[0047] The preparation method of the epoxy resin high voltage insulating part of the present invention comprises the following steps:

[0048] First, the above-mentioned high-toughness, low-shrinkage epoxy resin composition is stirred and mixed at a high speed at room temperature to obtain an epoxy resin composition;

[0049] Then, inject the above-mentioned epoxy resin combination into the preheated mold by APG process, and shape it at 130-180° C. for 10-25 minutes.

[0050] Finally, the molded product is demoulded, and placed in a blast oven at 130-180°C for post-curing treatment for 8-12 hours.

[0051] The high-toughness and low-shrinkage epoxy resin composition of the invention effectively solves the problems of high brittleness and easy cracking of epoxy resin castings, while maintaining its high temperature resistance and mechanical properties.

Embodiment 1

[0054] First, 70 parts of epoxy resin E51 modified by epoxidized natural rubber, 30 parts of bis(2,3-epoxycyclopentyl) ether, 85 parts of methyl tetrahydrophthalic anhydride, curing accelerator The agent and filler are weighed according to the above ratio and placed in a high-speed disperser. The system is heated to 40°C, and the high-speed disperser is vacuum degassed. The dispersion time is 4 hours and the vacuum degree is 200Pa;

[0055] (2) Preheat the mold, apply a release agent on the cavity, and inject the above epoxy resin mixture into the mold through an epoxy pouring machine using the APG process. The molding temperature is 160°C and the molding time is 15 minutes;

[0056](3) Put the demolded product into a forced air oven for post-curing at a curing temperature of 150°C for 12 hours to obtain a molded epoxy resin high-voltage insulation product.

Embodiment 2

[0058] First, 50 parts of epoxy resin E51 modified by maleic anhydride grafted polyphenylene ether, 50 parts of bis(2,3-epoxycyclopentyl) ether, 85 parts of methyl tetrahydrophthalic anhydride , 2 parts of 2-ethyl 4-methylimidazole, and 350 parts of quartz powder were weighed according to the above ratio and placed in a high-speed disperser. The system was heated to 40°C, and the high-speed disperser was vacuum degassed. Degree 200Pa;

[0059] (2) Preheat the mold, apply a release agent on the cavity, and inject the above epoxy resin mixture into the mold through an epoxy pouring machine using the APG process. The molding temperature is 160°C and the molding time is 15 minutes;

[0060] (3) Put the demolded product into a forced air oven for post-curing at a curing temperature of 150°C for 12 hours to obtain a molded epoxy resin high-voltage insulation product.

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Abstract

The invention discloses a high-toughness low-shrinkage epoxy resin composition which comprises the following components in parts by weight: 100 parts of an epoxy resin, 50-100 parts of a curing agent, 1-5 parts of a curing accelerator and 200-450 parts of an inorganic filler, wherein the epoxy resin comprises a modified epoxy resin; and the modified epoxy resin refers to an epoxy resin modified by rubber or a thermoplastic resin. The invention also provides an insulating part prepared by adopting the high-toughness low-shrinkage epoxy resin composition, and a preparation method of the composition. According to the epoxy resin cured material modified by the rubber or thermoplastic resin, the high temperature resistance and mechanical property of the epoxy resin can be maintained, the epoxy resin has the obvious advantages of high impact strength, basically no shrinkage after curing and the like, the problems that the epoxy resin casting product is high in brittleness and easy to crack and the like can be effectively solved, the insulating property is enhanced, and the insulation sealing properties of the insulating part are improved, and the service life of the insulating part is prolonged.

Description

technical field [0001] The invention relates to a high-toughness, low-shrinkage epoxy resin composition, in particular to a high-toughness, low-shrinkage epoxy resin material for high-voltage electric insulation products. Background technique [0002] Epoxy resin is widely used in coatings, adhesives, aerospace, electronics, etc. due to its high mechanical strength, good electrical insulation, strong adhesion, good thermal stability, excellent chemical resistance, and good craftsmanship. Electricity and other fields. [0003] Although the high-voltage insulation parts using epoxy resin overcome the shortcomings of traditional ceramic and glass high-voltage insulation products such as easy damage, but due to the high brittleness of epoxy resin itself, problems such as easy cracking at the interface with metal inserts after curing strictly limit its use in high-voltage insulation. Insulation applications. Contents of the invention [0004] The object of the present inventi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/06C08K9/06C08K7/18C08K7/20C08G59/42C08G59/50
Inventor 熊明饶喜梅李绪军
Owner SHENZHEN WOER HEAT SHRINKABLE MATERIAL
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