Nano-structural photo-thermal double-curing type transparent and heat-conductive epoxy glue and preparation method thereof
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A nano-structure, dual-curing technology, applied in the direction of epoxy resin glue, novolac epoxy resin adhesive, adhesive, etc., can solve the problems of low thermal conductivity and opacity of common thermal conductive adhesives
Inactive Publication Date: 2015-04-29
SHANGHAI LIANLANG NEW MATERIAL TECH
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Problems solved by technology
[0005] The technical problem to be solved by the present invention is to provide a nano-structure light-thermal dual-curing transparent heat-conducting epoxy adhesive and its preparation method to overcome the problems of low thermal conductivity
Method used
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Embodiment 1
[0022] Weigh 15% of nano-structure modified bisphenol A epoxy resin, 15% of methyl hexahydrophthalic anhydride, 15% of ethylene glycol diglycidyl ether, 22.5% of nano-calcium, 30% of boron nitride, and 0.5% of KH560 coupling agent , 0.5% of carbon black 101 dye, 0.5% of 1-methylimidazole accelerator, and 1% of defoamer are added to the mixer in turn, vacuumed until the vacuum degree is -0.08~-0.05MPa, and stirred at 300~1000 rpm 0.5 to 4 hours, stir evenly, let it cool down to room temperature, and pack it tightly.
Embodiment 2
[0024] Weigh 30% of nano-structure modified bisphenol F epoxy resin, 30% of methyl hexahydrophthalic anhydride, 1% of butanediol diglycidyl ether, 1.7% of nano-silicon dioxide, 34% of nano-boron nitride, and 1% of nano-diamond %, KH560 coupling agent 0.1%, carbon black 101 dye 0.1%, benzyl triphenyl phosphorus chloride accelerator 0.1%, defoamer 2%, add to the mixer in turn, vacuumize until the vacuum degree is -0.08~- 0.05MPa, stir at 300-1000 rpm for 0.5-4 hours, stir evenly, let it air naturally to room temperature, and seal the package.
Embodiment 3
[0026] Weigh 18% of nano-structure modified novolac epoxy resin, 17% of methyl hexahydrophthalic anhydride, 7% of 1,2-cyclohexanediol diglycidyl ether, 15.7% of nano-silica, 39% of nano-alumina, and Gas-phase silicon 1%, KH560 coupling agent 0.3%, carbon black 101 dye 0.2%, 1,4-dimethylimidazole accelerator 0.3%, defoamer 1.5%, add to the mixer in turn, vacuum until the vacuum degree is - 0.08~-0.05MPa, stir at 300~1000 rpm for 0.5~4 hours, stir evenly, let it air to room temperature naturally, and seal it.
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Abstract
The invention relates to nano-structural photo-thermal double-curing type transparent and heat-conductive epoxy glue and a preparation method thereof. The glue is single-component glue and is prepared from the following raw materials in percentage by weight: 15 to 30% of epoxy resin, 15 to 30% of anhydride, 1 to 15% of a diluent, 40 to 67% of filler, 0 to 0.5% of an active silane coupling agent, 0 to 0.5% of dye, 0 to 0.5% of an accelerant, 0 to 0.5% of a photoinitiator, and 1 to 2% of an antifoaming agent. The nano-structural photo-thermal double-curing type transparent and heat-conductive epoxy glue is used for solving the phenomenon that the epoxy resin glue is nontransparent due to the adding of the filler; the glue is capable of being photo-thermally double-cured, transparent and high in heat conducting coefficient, and therefore, the heat conducting glue meets the application with requirements on heat conducting and transparent performances; in addition, the glue has the performances above and does not lose modulus and other physical performances; the cured system is high in adhering reliability and wide in applicable scope.
Description
technical field [0001] The invention relates to a nanostructure photothermal dual-curing transparent heat-conducting epoxy adhesive and a preparation method thereof, belonging to the field of epoxy resin adhesives. Background technique [0002] Epoxy resin is one of the most widely used matrix resins in composite materials. It has excellent comprehensive physical properties, such as excellent mechanical properties, good electrical insulation properties, excellent corrosion resistance, low curing shrinkage, and good chemical and thermal stability. , high strength and high modulus, good bonding performance, excellent processing performance, etc., so it has been widely used in many fields. However, the thermal conductivity of ordinary epoxy resin is only 0.2 w / m.k after curing, and the thermal conductivity is low. Ability, but lost the transparency performance, this defect leads to many fields that need both heat conduction and transparency, the traditional heat conduction adh...
Claims
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