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Ultrasonic welding preparation method of Ag-Cu-Ti layer-shaped composite solder

An ag-cu-ti, layered composite technology, applied in welding equipment, welding equipment, non-electric welding equipment and other directions, can solve problems such as protection against unfavorable Ti activity, poor alloy smelting processability, difficult metal synchronous deformation, etc., to avoid Composition segregation, good weldability, easy size effect

Active Publication Date: 2015-05-06
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the low solubility of Ti in Ag or Cu, it is easy to form segregation and aggregation, and the alloy melting process is poor
The active elements in paste solder and solder prepared by powder metallurgy are easily oxidized, thereby reducing activity and making it difficult to store; it is difficult to ensure that the metals of each layer are deformed synchronously by the layer hot rolling method, and the Cu of the Ag-Cu eutectic foil will It is easy to react with Ti during high-temperature hot rolling, which is not conducive to the protection of Ti activity, and it is difficult to roll due to coarse grains.

Method used

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  • Ultrasonic welding preparation method of Ag-Cu-Ti layer-shaped composite solder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] The upper and lower layers are 21μm Ag-Cu eutectic foil, and the middle layer metal is 10.4μm pure Ti foil. Under the conditions of ultrasonic welding parameters such as welding pressure F: 120N, welding time t: 30ms, vibration frequency ?: 20kHz, amplitude A: 14μm, and welding speed 1m / min, the metal strips with a width of 30mm are superimposed and ultrasonic roll welding is performed. A layered composite solder with a thickness of 50 μm is prepared, the mass percentage of the active element Ti is 10.0%, the melting temperature range is 780 ° C ~ 870 ° C, it has good wettability to ceramics, and there is a higher joint after brazing strength.

Embodiment 2

[0015] The upper and lower layers are 51 μm Ag-Cu eutectic foil, and the middle layer metal is 1 μm pure Ti foil. Under the conditions of ultrasonic welding parameters such as welding pressure F: 150N, welding time t: 50ms, vibration frequency ?: 20kHz, amplitude A: 15μm, and welding speed 1.5m / min, the metal strips with a width of 30mm are stacked and ultrasonic seam welding is performed. , a layered composite solder with a thickness of 100 μm was prepared, the mass percentage of the active element Ti was 0.4%, and the melting temperature range was 780 ° C ~ 830 ° C. It has good wettability to ceramics and has a higher joint strength.

example 3

[0017] The upper and lower layers are 38μm Ag-Cu eutectic foil, and the middle layer metal is 7μm pure Ti foil. Under the conditions of ultrasonic welding parameters: welding pressure F: 140N, welding time t: 40ms, vibration frequency ?: 20kHz, amplitude A: 15μm, and welding speed 1.2m / min, the metal strips with a width of 30mm are superimposed and ultrasonic roll welding is performed. , a layered composite solder with a thickness of 100 μm was prepared, the mass percentage of the active element Ti was 4.1%, and the melting temperature range was 780 ° C ~ 850 ° C. It has good wettability to ceramics and has a higher joint strength.

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Abstract

Disclosed is an ultrasonic welding preparation method of an Ag-Cu-Ti layer-shaped composite solder. According to the method, solid-state forming characteristics of ultrasonic welding are utilized for the Ag-Cu-Ti layer-shaped composite solder for ceramic and ceramic brazing and for ceramic and metal brazing. The method comprises the steps that three layers of metal foil with the width of 30 mm are stacked for ultrasonic welding, the layer-shaped composite solder is prepared, the upper layer and the lower layer are Ag-Cu eutectic foil, the thickness of the eutectic foil ranges from 21 micrometers to 51 micrometers, and pure Ti foil is arranged on a middle layer; the thickness ratio of the metal foil on the upper layer to the metal foil on the middle layer to the metal foil on the lower layer is 1:0.02-0.50:1, the thickness ratio of the metal foil is adjusted, and therefore the content of active elements in the solder can be adjusted; the mass percent of the active element Ti ranges from 0.4 percent to 10 percent. The thickness of the composite solder ranges from 50 micrometers to 100 micrometers, and the molten temperature region ranges from 780 DEG C to 870 DEG C. The composite solder prepared through the method has the good wettability on the ceramic, and the soldering requirement of the ceramic / ceramic and ceramic / metal can be met.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to a method for preparing Ag-Cu-Ti layered composite brazing material which can be used for brazing ceramics and ceramics or ceramics and metals by utilizing the solid-state forming characteristics of ultrasonic welding. technical background [0002] Ceramic materials have the characteristics of unique oxidation resistance, corrosion resistance, high temperature resistance, high strength, high hardness and wear resistance, and have developed into generally recognized high-performance structural materials, widely used in metallurgy, aerospace, energy, machinery , automotive, electronics, optics and other fields. The most commonly used joining method for ceramic materials is brazing, including direct brazing and indirect brazing. Indirect brazing is to pre-metallize the ceramic surface and then braze it with conventional metal brazing filler metals. Due to the cumbersome p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/10B23K35/14
CPCB23K20/10B23K35/40
Inventor 李玉龙崔庆波温昌金
Owner NANCHANG UNIV
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