Soft-brittle material processing abrasive tool as well as manufacturing method thereof and method for processing soft-brittle material

Abstract

The invention discloses a soft-brittle material processing abrasive tool as well as a manufacturing method of the abrasive tool and a method for processing the soft-brittle material. The processing abrasive tool comprises a base body, wherein a plurality of diamond sheets are fixed on the processing surface of the base body; the processing surfaces of the diamond sheets are arc-shaped surfaces; patterned slots are formed in the arc-shaped surfaces of the diamond sheets; the protrusion height of each of the diamond sheets relative to the base body is 1mm-2mm. The method for processing the soft-brittle material comprise the following steps of grinding the soft-brittle material through the soft-brittle material processing abrasive tool until surface roughness of the surface of the soft-brittle material is detected to be 0.01 micron to 0.1 micron. The processing abrasive tool is utilized to process the soft-brittle material, so that the material processing quality is improved and the ultra-precise processing problem of the soft-bristle material is solved.

Description

technical field [0001] The invention relates to an abrasive tool for processing soft and brittle materials, a manufacturing method thereof and a method for processing soft and brittle materials, mainly used for processing soft and brittle materials, especially for KDP (potassium dihydrogen phosphate), CZT (zinc telluride Cadmium), GaAs (gallium arsenide), InP (indium phosphide) and other soft and brittle materials with precision and low damage processing. Background technique [0002] Soft and brittle materials refer to a class of materials that are soft and brittle. Compared with hard and brittle materials, they have low hardness and high brittleness, and are easily broken during processing. For example, the Mohs hardness of GaAs is 4.5, and the Mohs hardness of InP It is 3, which is far from the hardness of silicon (the Mohs hardness of Si is 7), and it is prone to micro deformation under the opposite external force. [0003] At present, common soft and brittle materials ...

AI Technical Summary

Problems solved by technology

Although these soft and brittle materials have excellent physical properties, because they are both brittle and soft, it is difficult to process high-quality surfaces without surface damage layers

For example, KDP (potassium dihydrogen phosphate) is the preferred crystal material in inertial confinement fusion (ICF). The manufacturing requirements of ICF laser devices for KDP (aperture>30cm, thickness2 , surface roughness rms﹤5nm) is almost close to the manufacturing limit, and its commonly used machining methods include precision turning, polishing, precision grinding, etc. However, when precision turning is used to process KDP, small-scale ripples will inevitably occur on the crystal surface, affecting Laser damage threshold of the crystal; polishing KDP crystals can easily cause sag effect; grinding KDP crystals can obtain crystal surfaces with small surface roughness, small shape errors, and no small-scale ripples, but due to The texture of KDP is soft, and the abrasive grains falling off from the grinding wheel are easily embedded in the crystal, and the embedded abrasive grains are difficult to remove through subsequent processing

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