Ultralow-concentration ion palladium activation solution and process for chemical nickel-plating on copper surface

An ultra-low concentration, chemical nickel plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of cumbersome process and high cost, and achieve the effect of low ion concentration

Active Publication Date: 2015-05-06
广东致卓环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a kind of ultra-low concentration ionic palladium activation solution for electroless nickel plating on

Method used

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  • Ultralow-concentration ion palladium activation solution and process for chemical nickel-plating on copper surface
  • Ultralow-concentration ion palladium activation solution and process for chemical nickel-plating on copper surface
  • Ultralow-concentration ion palladium activation solution and process for chemical nickel-plating on copper surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Use glass fiber boards (PCB glass fiber copper clad laminates) printed with copper wires and copper surfaces of different sizes and spacings to conduct an example test to facilitate the observation of missing plating and overflow plating.

[0029] Activation solution composition:

[0030]

[0031] Operating procedures:

[0032] Plate → Degreasing → Washing → Microetching → Washing → Activation → Washing → Plating.

[0033] The degreasing liquid used is an acidic degreasing liquid, and the conditions of the activation process are controlled: room temperature, no stirring, and a time of 90 s. There is no overflow plating and missing plating phenomenon after nickel plating of the sample.

Embodiment 2

[0035] Activation liquid composition:

[0036]

[0037] Conditional control:

[0038] Room temperature, activation time 2min, stirring method: the test piece moves.

[0039] Operation process is the same as embodiment 1. Nickel plating without overflow plating and missing plating phenomenon

Embodiment 3

[0041] Activation solution composition:

[0042]

[0043] Conditional control:

[0044] At room temperature, without stirring, activate for 1 min;

[0045] The operation process is the same as that in Example 1, and the nickel plating has no overflow plating and missing plating phenomenon.

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Abstract

The invention discloses an ultralow-concentration ion palladium activation solution and a process for chemical nickel-plating on a copper surface. The ultralow-concentration ion palladium activation solution is characterized in that a plating solution comprises the following raw materials: 2-10ppm (palladium ion concentration) of a palladium salt, 0.5-10ml/L of sulfuric acid or hydrochloric acid, 0.01-4g/L of a surfactant, 0.1-10g/L of an accelerant and 1-50mg/L of a stabilizing agent. By using the accelerant, the concentration of palladium ions used by the activation solution can be significantly reduced under the condition that the chemical nickel-plating effect is not influenced, and a construction process is convenient and easy to implement.

Description

technical field [0001] The invention relates to a surface chemical treatment technology, more specifically to a pretreatment activation solution and a process for electroless nickel plating on the surface of metal copper. Background technique [0002] The electroless nickel plating layer has excellent comprehensive physical and chemical properties such as uniformity, hardness, wear resistance and corrosion resistance. This technology has been widely used in aerospace industry, automobile industry, electronic computer industry, food industry, machinery industry, Petroleum industry, plastics industry, printing industry, valve system, etc. all have different proportions of applications. Taking the manufacturing process of printed circuit boards in electronic equipment as an example, the commonly used surface treatment processes are the ENIG process (electroless nickel immersion gold) and the electroless nickel-palladium-gold process. In these two types of processes, the copper...

Claims

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Application Information

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IPC IPC(8): C23C18/18C23C18/32
Inventor 范小玲李冰宗高亮李宁刘松孔德龙
Owner 广东致卓环保科技有限公司
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