Ceramic slurry for LED (light-emitting diode) metal substrate and preparation method of LED (light-emitting diode) metal substrate

A technology of metal substrate and ceramic slurry, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of few adopters of manufacturing technology, poor thermal conductivity and insulation performance, poor adhesion and heat resistance, etc. , to achieve the effect of improving thermal conductivity and insulation performance, high thermal conductivity, and short sintering time

Active Publication Date: 2015-05-06
广州市尤特新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The third method: anodic oxidation or micro-arc oxidation process is used to form a layer of oxidized metal film on the surface of the metal plate layer, and this film is used as the insulating layer, but this process will form micropores in the insulating layer, which greatly affects the insulation. characteristics, few adopters of this manufacturing process
[0004] The insulation layer is basically made of epoxy resin or silicone resin heat-cured. In order to pursue thermal conductivity, the insulation layer is very thin, about tens to hundreds of microns, and the thermal conductivity and insulation performance are relatively poor.
[0005] The copper foil and the metal plate layer are bonded with epoxy resin or silicone resin. The adhesion and heat resistance between the copper foil and the metal plate layer are not good, which will affect the stability of the substrate.
[0006] The copper foil is laminated on the metal plate layer through the resin insulating layer, and the surface flatness is poor, which makes it difficult to electroplate fine lines

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0032] In the preparation method of the insulating ceramic slurry, various raw materials are uniformly mixed, and the slurry is obtained after grinding, dispersing, stirring and filtering.

[0033] The preparation method of the LED metal substrate, the steps are: 1) select a metal plate, polish and polish the printing surface of the metal plate layer, wash and dry; 2) apply the above-mentioned insulating ceramic slurry to the printing surface of the metal plate, sinter, cool to room temperature, Form an insulating layer; 3) Apply solderable silver paste to the surface of the insulating layer, sinter, and cool to room temperature to form a circuit layer; 4) The non-electrode part of the circuit layer is coated with solder resist ink, marking the positive and negative positions, and the ink is cured That's it.

[0034] In step 1), the material of the metal substrate is selected from one of aluminum, aluminum alloy, copper and copper alloy.

[0035] In step 2), the coating thick...

Embodiment 1

[0040] The preparation method of LED metal substrate, the steps are:

[0041] Step 1: Choose a metal aluminum plate with a length of 50mm, a width of 30mm, and a thickness of 1mm. Then use a machine to polish and polish the printed surface of the aluminum plate layer to make the surface flatness less than ±0.01mm, then clean and dry;

[0042] Step 2: The first step is to prepare ceramic powder: the ceramic powder is made of insulating ceramic slurry, the main component of which is ceramic powder. The preparation process is as follows: the SiO 2 , B 2 o 3 、 Bi 2 O3, ZnO, P 2 o 5, CaO, Al 2 o 3 The powders of these seven oxides are uniformly mixed in a mass ratio of 10:20:40:10:8:7:5. Then pour the mixed powder into the corundum tong pot. And put the tongs into the high-temperature muffle furnace to be fired. Start at 300°C, sinter at 300-400°C for 15 minutes, hold at 400°C for 30 minutes, sinter at 400-800°C for 40 minutes, sinter at 800-1180°C for 40 minutes, and ho...

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PUM

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Abstract

The invention discloses ceramic slurry for an LED (light-emitting diode) metal substrate and a preparation method of the LED (light-emitting diode) metal substrate. The ceramic slurry consists of ceramic powder, solution, surface active agent and moistening agent. The preparation method of the LED metal substrate includes: 1) selecting a metal plate, burnishing and polishing a printing surface of the metal plate, cleaning and drying it; 2) coating the slurry on the printing surface of the metal plate, sintering and cooling to the room temperature, and forming an insulation layer; 3) coating weldable silver slurry to the surface of the insulation layer, sintering and cooling to the room temperature, and forming a circuit layer; 4) coating solder resist ink at a non-electrode part, mark out positive and negative poles, and then solidify ink. The insulation layer of the ceramic slurry for the LED metal substrate is high in heat conductivity coefficient and good in insulation performance; the insulation layer is coated by the method of silk-screen printing and sintered under medium temperature; the insulation layer at the surface of the metal plate is compact, uniform and smooth; the circuit layer is coated by the method of silk-screen printing and sintered under medium temperature; thus the ceramic slurry is green and environmental-friendly.

Description

technical field [0001] The invention relates to a ceramic slurry for an LED metal substrate and a method for preparing the LED metal substrate. Background technique [0002] The LED metal substrate is mainly composed of three parts, which are circuit layer, insulating layer and metal plate layer from top to bottom. The main substrate of the circuit layer is copper foil, and the required circuit pattern is formed by electroplating, chemical plating, etc. The metal plate layer is mainly a common metal with good thermal conductivity, such as copper, aluminum, copper alloy, aluminum alloy and so on. The insulating layer is the core layer of the substrate, which plays the role of bonding, heat conduction and insulation. At present, there are three main methods for making the insulating layer in the market. The first method is to bond the copper foil and the metal plate layer with glass fiber cloth soaked in epoxy resin, and then cure it after thermal baking. The glass fiber cl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62C04B35/453
CPCC04B35/453H01L33/48
Inventor 朱鑫陈海文沈艳斌江永钊
Owner 广州市尤特新材料有限公司
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