TFT backboard manufacturing method and structure suitable for AMOLED
A manufacturing method and backplane technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as low manufacturing efficiency and cumbersome manufacturing process, and achieve increased manufacturing process, simple manufacturing process, and reduced number of manufacturing processes Effect
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[0048] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0049] see figure 2 , the present invention firstly provides a method for manufacturing a TFT backplane suitable for AMOLED, comprising the following steps:
[0050] Step 1, such as image 3 As shown, a substrate 10 is provided, and a buffer layer 20 is deposited on the substrate 10 .
[0051] Specifically, the substrate 10 is a transparent substrate, preferably, the substrate 10 is a glass substrate. The buffer layer 20 includes one of a silicon oxide layer, a silicon nitride layer or a combination thereof.
[0052] Step 2, such as Figure 4 As shown, an active layer 30 is formed on the buffer layer 20 , and a gate insulating layer 40 is deposited on the active layer 30 and the buffer layer 20 .
[0053] The active layer 30 includes an ...
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