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Preparation method and application of columnar embedded type flexible circuit

A flexible circuit, embedded technology, applied in printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of thin printed circuit thickness, attenuation of electrical conductivity, low electronic mobility of printed circuit, etc., to improve the thickness and printing accuracy. , The effect of increasing the thickness of the wire and avoiding the cost

Active Publication Date: 2015-06-24
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, inkjet printing can only form a conductive layer of a few hundred nanometers due to the spread of ink droplets on a flexible substrate, while the thickness of a circuit made by photolithography can reach the micron level, which results in low electron mobility of the printed circuit and repeated bending. Post-conductivity attenuation
In addition, the spread of ink droplets on the substrate leads to low resolution of printed circuits. At present, the accuracy of inkjet printing of a single conductive circuit is generally at 20-30 μm, which is still far behind the sub-micron resolution of photolithography. , which is crucial to improve the integration of printed circuits
[0004] Therefore, although the preparation of flexible circuits by inkjet printing has the advantages of high efficiency, low cost, and no pollution, the thickness of the printed circuit is thin and the precision is low due to the spreading of ink droplets. These problems limit the application of inkjet printing technology in the field of flexible circuit board manufacturing. application

Method used

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  • Preparation method and application of columnar embedded type flexible circuit
  • Preparation method and application of columnar embedded type flexible circuit
  • Preparation method and application of columnar embedded type flexible circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Mix the polydimethylsiloxane prepolymer and the crosslinking agent ethyl silicate at a mass ratio of 5:1, and centrifuge at 2000 rpm to remove air bubbles. Spin-coat the mixture on a polyethylene terephthalate film with a thickness of 125 um at a speed of 2000 rpm using a homogenizer to obtain a viscous fluid state polymer substrate for use. Dissolve the synthesized silver nanoparticles in a mixed solvent of water and ethylene glycol with a volume ratio of 4:1 to prepare a conductive ink with a mass fraction of 10%, and use a Fuji Dimatix inkjet printer to print the ink according to the designed circuit On the viscous fluid substrate, the printed substrate was cured and sintered at 100°C for 2 hours, and the polydimethylsiloxane layer became a flexible circuit board.

Embodiment 2

[0027] Polyimide was dissolved in dimethylformamide to obtain a viscous solution with a mass fraction of 25%, which was spin-coated on a glass slide at a speed of 3000 rpm using a homogenizer. Dissolving silver nanoparticles and silver nanowires in a mixed solution of water, ethylene glycol, and ethanol (6:3:1 in mass ratio) was centrifugally dispersed, and filtered through a filter membrane with a pore size of 1 μm to obtain conductive ink. The ink was printed on the spin-coated polyimide viscous layer using the Microfab inkjet printing system to obtain a set circuit. The above samples are heated in an oven at 200°C-300°C for 3 hours, and the polyimide layer becomes the flexible circuit.

Embodiment 3

[0029] Mix 3g of polydimethylsiloxane and 0.3g of crosslinking agent, stir evenly, remove air bubbles by ultrasonication for 30 minutes, and evenly coat on a 210mmx297mm aluminum sheet with a roller coater. Dissolve 0.2 g of carbon nanotubes in 10 g of dimethylformamide, ultrasonically disperse, centrifuge at 3000 rpm, and take the supernatant as conductive ink. Use the Fuji Dimatix inkjet printer to print the ink on the viscous substrate, heat the substrate and the support material together in an oven at 90°C for 30 minutes, and uncover the cross-linked polydimethylsiloxane to become flexible circuit.

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Abstract

The invention discloses a preparation method and application of a columnar embedded type flexible circuit. The method includes the steps of coating a supporting material with a viscous-state macro-molecule material, spraying conductive ink for printing, making the conductive ink deposit in the viscous-state macro-molecule material under the spraying impact effect of a spray nozzle, and finally conducting solidification through heating or illuminating to obtain the columnar embedded flexible circuit, wherein the conductive circuit is formed after the conductive ink is dried, the viscous-state macro-molecule material is solidified into a film, and the packing material of the conductive circuit is formed. The width and height of a single wire of the prepared conductive circuit each range from 500 nanometers to 50 microns, the ratio of width to height ranges from 0.5 to 2, and the distance between the wire and an upper interface of a packing base material and the distance between the wire and a lower interface of the packing base material each range from 10 microns to 100 microns. By means of the method and application, the thickness and printing accuracy of the printing circuit are greatly improved while high pollution and high cost during exposure etching are avoided; by means of the method of packing the circuit at a time, the subsequent packing process is omitted, and the preparation method can be applied to the field of preparing transparent ultra-thin flexible circuit boards, high-integration-density flat cables and the like.

Description

technical field [0001] The invention belongs to the technical field of flexible circuit preparation, in particular to a method for preparing a columnar embedded flexible circuit board by spraying conductive ink on a viscous fluid state substrate. Background technique [0002] Flexible printed circuits have the advantages of dynamic bending, light weight, thin thickness, and small footprint. They can greatly reduce the weight and size of electronic products and increase their packaging density. They have been widely used in smartphones, notebook computers, and liquid crystal display modules. , digital cameras, printer nozzle cables and other occasions with high integration and bending resistance requirements. With the popularity of electronic products such as smart phones, large-size LCD screens, and flexible displays, the demand and output of flexible circuits are increasing, but the current mainstream method for making flexible printed circuits is still photolithography. A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12
CPCH05K1/097H05K3/125
Inventor 姜杰克鲍斌宋延林
Owner INST OF CHEM CHINESE ACAD OF SCI