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A kind of preparation method of low molecular weight high epoxy value cardanol epoxy resin

A cardanol epoxy resin and cardanol technology, which is applied in the direction of organic chemistry and the like, can solve the problems of non-self-solidification at high temperature, poor stability and weather resistance, and achieve the effects of low viscosity and good toughness.

Inactive Publication Date: 2016-10-05
上海美东生物材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The object of the present invention is to provide a kind of preparation method of low molecular weight high epoxy value cardanol epoxy resin, the preparation method of described this low molecular weight high epoxy value cardanol epoxy resin will solve the environmental problems in the prior art Oxygen resin has poor stability and weather resistance, and technical problems that cannot be self-cured at high temperature

Method used

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  • A kind of preparation method of low molecular weight high epoxy value cardanol epoxy resin
  • A kind of preparation method of low molecular weight high epoxy value cardanol epoxy resin

Examples

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Effect test

Embodiment 1

[0021] Add 1 mole of cardanol monoglycidyl ether at room temperature, raise the temperature to 40 degrees, slowly add 1.2 moles of dipropylamine dropwise for 2 hours, control the temperature at 40-60 degrees, and add 1.5 peracetic acid after no obvious exothermic reaction Mole, 0.3% styrene peroxybenzoic acid is used as a catalyst, and the solvent is 100 mL of chloroform for oxidation, reacted at 50 degrees for 5 hours, washed with water to neutralize the acid and alkali, and filtered to remove the solvent to obtain the desired product.

[0022] The measured epoxy value is 0.38, the viscosity is 2500, the surface is dry in 28 minutes, the hard work is 5 hours, the toughness is 1mm, and the Shore hardness is 80 after self-curing at 160 degrees for 2 hours and cooling to room temperature.

Embodiment 2

[0024] Add 1 mole of cardanol monoglycidyl ether at room temperature, raise the temperature to 50 degrees, slowly add 1.1 moles of dipropylamine dropwise for 2 hours, control the temperature at 40-60 degrees, and add 1.5 peracetic acid after no obvious exothermic reaction Mole, 0.3% styrene peroxybenzoic acid is used as a catalyst, and the solvent is 100 mL of chloroform for oxidation, reacted at 50 degrees for 5 hours, washed with water to neutralize the acid and alkali, and filtered to remove the solvent to obtain the desired product.

[0025] The measured epoxy value is 0.38, the viscosity is 2600, the surface is dry for 32 minutes, hard drying for 5 hours, the toughness is 1mm, and the Shore hardness is 78 after self-curing at 160 degrees for 2 hours and cooling to room temperature.

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Abstract

The invention provides a preparation method of a low-molecular-weight high-epoxide-number cardanol epoxy resin, which comprises the following steps: weighing cardanol monoglycidol ether, adding into a reaction vessel at room temperature, heating, and dropwisely adding dipropenyl amine, wherein the mole ratio of the cardanol monoglycidol ether to the dipropenyl amine is 1:(1-2); adding peroxyacetic acid when no obvious exothermic reaction occurs, adding benzoyl hydroperoxide styrene oxide as a catalyst, meanwhile, adding trichloromethane as a solvent to perform oxidation reaction at 40-60 DEG C for 4-6 hours, neutralizing with a sodium hydroxide water solution until the pH value is 7, and filtering to remove the solvent, thereby obtaining the required product. The low-molecular-weight high-epoxide-number cardanol epoxy resin has the advantages of low molecular weight, high epoxide number, low viscosity, high temperature resistance, no chlorine, environment friendliness, quick drying and favorable toughness, and can be self-cured.

Description

Technical field: [0001] The invention relates to the field of chemical industry, in particular to a low molecular weight high epoxy value cardanol epoxy resin, in particular to a preparation method of a low molecular weight high epoxy value cardanol epoxy resin. Background technique: [0002] The development direction of low molecular weight epoxy resin is to improve product quality, increase epoxy group content, reduce resin viscosity, reduce chlorine content, and reduce raw material consumption. Dipropenylamine is used in the production of cross-linking formaldehyde-free color-fixing agents and cross-linking agents, as well as pharmaceutical intermediates, intermediates of agricultural chemicals, dyes and coatings, organic synthesis and resin modifiers. It can also be used to prepare amphoteric high molecular polymers, organic synthesis raw materials, ionic water purifiers, polymer monomers, pharmaceutical intermediates and synthetic resin modifiers, etc. [0003] Bisphen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C07D303/36C07D301/14
CPCC07D301/14C07D303/36
Inventor 黎炘宋学良毕丽杰
Owner 上海美东生物材料股份有限公司
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