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Chemical tinning liquid, preparation method thereof and chemical tinning method

A technology of chemical tin plating and tin salt, applied in the field of chemical plating, can solve problems such as poor stability of chemical tin plating solution, achieve high compactness, ensure long-term stability, and solve the effects of poor stability

Active Publication Date: 2015-07-01
BYD CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention solves the technical problem of poor stability of the chemical tin plating solution existing in the prior art, and proposes a novel chemical tin plating solution and its preparation method and a chemical tin plating method

Method used

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  • Chemical tinning liquid, preparation method thereof and chemical tinning method

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[0031] The present invention also provides the preparation method of described electroless tin-plating liquid, comprises first tin salt, complexing agent, reducing agent are dissolved in water respectively to prepare respective aqueous solution, then tin salt solution and complexing agent aqueous solution are first mixed, and then Adding a sulfonic acid accelerator, and finally mixing with an aqueous solution of a reducing agent, obtains the electroless tin plating solution.

[0032] As mentioned above, the electroless tin plating solution needs to be guaranteed to be in an alkaline environment, so a pH regulator needs to be added to adjust the pH value of the system. Preferably, after the components in the electroless tin plating solution are uniformly mixed, a pH regulator can be added to adjust the pH value of the system to 8-10, and the chemical tin plating solution provided by the present invention can be obtained.

[0033]Finally, the present invention provides an electr...

Embodiment 1

[0036] Dissolve tin salt, complexing agent, reducing agent titanium chloride, surfactant PEG1000, and thiourea in water to prepare their respective aqueous solutions according to the formula, then mix the tin salt solution and complexing agent aqueous solution first, and then add sulfonic acids Accelerator, after stirring for 2min, add other aqueous solutions, finally add 25wt% ammonia water to adjust the pH value of the system, and obtain the electroless tin plating solution S1 of the present embodiment. Its formula is: stannous sulfate 10g / L, sodium citrate 30g / L, Methanesulfonic acid 20g / L, sulfamic acid 10g / L, potassium dodecyl selenosulfonate 3g / L, PEG1000 0.05g / L, thiourea 6g / L, titanium chloride 4g / L, ammonia water 7g / L L, pH 9.0.

Embodiment 2

[0038] Adopt the method identical with embodiment 1 to prepare the electroless tin plating solution S2 of the present embodiment, its formula is: tin protochloride 12g / L, citric acid 40g / L, sodium methanesulfonate 30g / L, sulfamic acid 12g / L, potassium dodecyl selenosulfonate 4g / L, PEG1000 0.08g / L, thiourea 7g / L, titanium chloride 5g / L, ammonia water 9g / L, and the pH value is 9.6.

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Abstract

The invention provides a chemical tinning liquid and a preparation method thereof. The chemical tinning liquid contains tin salt, a complexing agent, a reducing agent and an accelerant, wherein the reducing agent is titanium dichloride; the accelerant contains sulfoacid accelerant; the sulfoacid accelerant is selected from at least one of A, B and C, wherein A is dedecylseleno sulfonate B is a mixture of dodecyl sulfonate and seleno sulfonate and C is a mixture of dodecyl sulfonate and seleno sulfate. The invention also provides a method for chemical tinning by using the chemical tinning liquid. According to the invention, the sulfoacid accelerant is added into the chemical tinning liquid using the titanium dichloride as the reducing agent, so that the activity and the stability of the chemical tinning liquid are effectively improved, the long-term stability of the tinning liquid is ensured and the compactness and the smoothness of a tin coating are improved.

Description

technical field [0001] The invention belongs to the field of electroless plating, and in particular relates to an electroless tin plating liquid, a preparation method thereof and an electroless tin plating method. Background technique [0002] In recent years, as a solderable coating, tin coating has been widely used in industries such as electronic components and semiconductor packaging based on copper and copper alloys. In addition, tin coating has also been widely used as a protective coating for copper and copper in water supply systems. Plating of the inner surface of copper alloy tubes. Due to the increasingly serious pollution caused by lead, the application of tin-lead alloy coating is more and more restricted. However, there are not many reports on lead-free solderable tin-based alloy plating technology at home and abroad. Therefore, on general electronic components, tin plating is still the preferred solderable coating. [0003] In terms of plating methods, comp...

Claims

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Application Information

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IPC IPC(8): C23C18/52
Inventor 韦家亮
Owner BYD CO LTD
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