Chemical tinning liquid, preparation method thereof and chemical tinning method
A technology of chemical tin plating and tin salt, applied in the field of chemical plating, can solve problems such as poor stability of chemical tin plating solution, achieve high compactness, ensure long-term stability, and solve the effects of poor stability
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[0031] The present invention also provides a method for preparing the electroless tin plating solution, which includes first dissolving the tin salt, complexing agent, and reducing agent in water to prepare respective aqueous solutions, and then mixing the tin salt aqueous solution and the complexing agent aqueous solution first, and then The sulfonic acid accelerator is added, and finally mixed with the reducing agent aqueous solution to obtain the electroless tin plating solution.
[0032] As mentioned earlier, the electroless tin plating solution needs to be in an alkaline environment, so a pH regulator needs to be added to adjust the pH of the system. Preferably, after the components in the electroless tin plating solution are uniformly mixed, a pH regulator can be added to adjust the pH value of the system to 8-10 to obtain the electroless tin plating solution provided by the present invention.
[0033] Finally, the present invention provides an electroless tin plating method,...
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[0035] Example 1
[0036] According to the formula, the tin salt, complexing agent, reducing agent titanium chloride, surfactant PEG1000, and thiourea were dissolved in water to prepare their respective aqueous solutions, and then the tin salt aqueous solution and the complexing agent aqueous solution were mixed first, and then the sulfonic acid was added Promoter, stir for 2 minutes and then add other aqueous solutions, and finally add 25wt% ammonia to adjust the pH value of the system to obtain the electroless tin plating solution S1 of this embodiment. Its formula is: stannous sulfate 10g / L, sodium citrate 30g / L, Methanesulfonic acid 20g / L, sulfamic acid 10g / L, potassium dodecylselenosulfonate 3g / L, PEG1000 0.05g / L, thiourea 6g / L, titanium chloride 4g / L, ammonia 7g / L, pH value is 9.0.
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[0037] Example 2
[0038] The electroless tin plating solution S2 of this example was prepared by the same method as in Example 1. The formula was: stannous chloride 12g / L, citric acid 40g / L, sodium methanesulfonate 30g / L, and sulfamic acid 12g / L, potassium dodecyl selenosulfonate 4g / L, PEG1000 0.08g / L, thiourea 7g / L, titanium chloride 5g / L, ammonia 9g / L, pH 9.6.
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