Flexible substrate and preparation method for flexible display device
A flexible substrate and flexible display technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of low temperature resistance characteristics, and achieve the advantages of good high temperature resistance, good flexibility and light transmittance, and good The effect of thermal stability
Active Publication Date: 2015-07-01
TRULY HUIZHOU SMART DISPLAY
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Problems solved by technology
[0004] In traditional technology, flexible substrates mostly use polymer substrates, such as PEN (polyethylene naphthalate film) substrates, PI (polyimide film) substrates, etc. These substrates need to add multi-layer composite protective films to increase water resistance. Oxygen barrier effect, at the same time, its low temperature resistance is a challenge to the preparation of TFT device layers on the substrate, and it is necessary to improve the preparation process of TFT devices
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[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0028] see figure 1 and figure 2 , in one embodiment, a method for preparing a flexible substrate is provided. The method can be applied to semiconductor display devices, especially the substrate preparation process in flexible display devices. The method includes:
[0029] Step 101, preparing a silicon carbide film.
[0030] Specifically, in this embodiment, such as figure 2 1. Spin coating a silicon carbide film with a thickness of 1500-5000 nm on a substrate (such as glass), and heat-baking at 300-400° C. Silicon carbide film has good chemical stability, waterproof and oxygen-proof, and ...
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Abstract
The invention discloses a flexible substrate preparation method. The flexible substrate preparation method comprises the following steps: preparing a silicon carbide film; preparing a metal film on the silicon carbide film; etching the metal film to form a metal grid. The invention further discloses a flexible display device preparation method. According to the technical scheme disclosed by the invention, when the conventional TFT (thin film transistor) device preparation process is adapted, the good thermal stability, the water vapor blocking characteristics and the light transmission of the substrate are guaranteed.
Description
technical field [0001] The invention relates to the technical field of semiconductor device preparation, in particular to a method for preparing a flexible substrate and a flexible display device. Background technique [0002] Flexible display devices, such as AMOLED (Active Matrix Organic Light Emitting Diode, active matrix organic light-emitting diode), are a new generation of display panels. Compared with ordinary liquid crystal panels, they have the advantages of fast response speed, high contrast, and wide viewing angle. [0003] In the manufacturing process of flexible devices, there are related technical difficulties such as flexible substrates, flexible TFT (Thin Film Transistor, thin film transistor) device layers, and flexible OLED (Organic Light-Emitting Diode, organic light-emitting diode) device layers. Among them, flexible substrates require good thermal stability, water vapor barrier properties, and light transmittance. [0004] In traditional technology, fle...
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IPC IPC(8): H01L27/32H01L21/77H01L51/56
Inventor 刘海燕任思雨苏君海李建华
Owner TRULY HUIZHOU SMART DISPLAY