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Preparation method of MQ branched-chain modified silicon resin polymer for large-scale integrated circuit package

A technology of large-scale integrated circuit and MQ silicone resin, which is applied in the field of preparation of MQ branched modified silicone resin polymer in large-scale integrated circuit packaging, can solve the problems of poor tensile strength, impact strength and bonding performance, and achieves The effect of excellent weather resistance and electrical properties, low thermal conductivity, and low production cost

Inactive Publication Date: 2015-07-29
江苏三木化工股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main disadvantages are that the tensile strength, impact strength and bonding performance are poor

Method used

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  • Preparation method of MQ branched-chain modified silicon resin polymer for large-scale integrated circuit package
  • Preparation method of MQ branched-chain modified silicon resin polymer for large-scale integrated circuit package
  • Preparation method of MQ branched-chain modified silicon resin polymer for large-scale integrated circuit package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] In terms of parts by mass, take 70 parts of α,ω-dihydroxy polydimethylsiloxane with a degree of polymerization of 10 and 30 parts of methylvinyl MQ silicone resin with an M / Q value of 0.7 and a vinyl content of 3.0%. (Linear polymer A) was put into the reactor, started to stir for 25 minutes, the rotation speed was 75 rpm, the temperature was raised to 90°C, and the heating rate was 2°C / min; 0.03% by mass of dihydroxy polydimethylsiloxane was added to potassium trimethylsiliconate as a catalyst, and stirred at a constant temperature for 2.5 hours. After the reactant became a transparent colloid, the heating was stopped, and the stirring was continued until it was cooled to room temperature, and the product 1 was obtained. , and various performance tests were carried out on the product, and the test results are shown in Table 1:

[0028] Table 1 Main performance indicators of product 1

[0029] Performance name

Embodiment 2

[0031] According to the number of parts by mass, take 80 parts of α, ω-hydroxypoly(dimethyl-methylvinyl) siloxane with a degree of polymerization of 15 and 20 parts of methyl MQ silicone resin (cyclic polymer B) into the reaction Kettle, start and stir for 35 minutes, the speed is 80 rpm, the temperature is raised to 85°C, and the heating rate is 2°C / min; after the system is mixed uniformly and the temperature is stable, according to the 0.02% by mass of vinyl) siloxane was added potassium trimethylsiliconate as a catalyst, stirred at constant temperature for 1.5 hours, stopped heating after the reactant turned into a transparent colloid, and continued to stir until cooled to room temperature to obtain product 2. And various performance tests were carried out on the product, and the test results are shown in Table 2:

[0032] Table 2 Main performance indicators of product 2

[0033] Performance name

Embodiment 3

[0035] According to the number of parts by mass, take 85 parts of α, ω-dihydroxy polydimethylsiloxane with a degree of polymerization of 20 and 15 parts of methyl vinyl MQ silicone resin with an M / Q value of 0.7 (cross-linked polymer C) Put it into the reaction kettle, start stirring for 35 minutes, the speed is 60 rpm, the temperature is raised to 95°C, and the heating rate is 2°C / min; after the system is uniformly mixed and the temperature is stable, according to the 0.04% by mass of siloxane was added with sodium trimethylsiliconate as a catalyst, stirred at a constant temperature for 3 hours, stopped heating after the reactant turned into a transparent colloid, and continued to stir until cooled to room temperature to obtain product 3. And various performance tests were carried out on the product, and the test results are shown in Table 3:

[0036] Table 3 Main performance indicators of product 3

[0037] Performance name

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Abstract

The invention discloses a preparation method of an MQ branched-chain modified silicon resin polymer for large-scale integrated circuit package. Alpha, omega-dyhydroxyl polydimethylsiloxane or alpha, omega-hydroxyl poly(dimethyl-methyl vinyl) silicon dioxide is taken as a main raw material, methyl vinyl MQ silicon resin with the value of M / Q value being 0.6-0.9 or methyl MQ silicon resin is taken as an auxiliary raw material, the mixture is stirred to have a reaction for 45 minutes at the rotation speed of 70 revolutions per minute, the temperature is raised to 50-130 DEG C, and the temperature rising rate is 2 DEG C per minute; sodium trimethylsilanol or potassium trimethylsilanol accounting for 0.01%-0.1% of the main raw material by mass is added to serve as a catalyst, the mixture is stirred for 1-4 hours at the constant temperature, and a target product is obtained. The tensile strength, the impact strength and the adhesive property of the polymer prepared with the method are excellent, the resistance is higher than 1,013 omega, the heat conductivity is lower than 1.40 W / mK, the silicon resin polymer can resist radiation not lower than 109 rad, and the elasticity is good.

Description

technical field [0001] The invention belongs to the technical field of packaging materials for large-scale integrated circuits, in particular to a preparation method for MQ branched chain modified silicone resin polymers used for packaging large-scale integrated circuits. Background technique [0002] Packaging materials have a significant impact on the performance, stability and service life of integrated circuits. Especially for large-scale integrated circuits, due to its high-speed, multi-functional and miniaturized characteristics, under long-term high-current operating conditions, packaging materials are easily carbonized, forming conductive channels on the device surface, resulting in device failure. Epoxy resin materials currently used for large-scale integrated circuit packaging have high crosslinking density, large internal stress, high brittleness, poor impact resistance after curing, transparency decreases with increasing temperature, and carbonization reaction oc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/20C08G77/08
Inventor 宋坤忠熊诚惠正权薛中群
Owner 江苏三木化工股份有限公司
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