Halogen resin composition and application thereof

A technology of resin composition and epoxy resin, applied in the field of resin composition, can solve the problems of affecting the stability of the resin composition, unable to achieve lead-free process, reducing the heat resistance of copper clad laminates, etc. Dielectric loss, the effect of overcoming poor heat resistance

Inactive Publication Date: 2015-08-05
GUANGZHOU GRACE ELECTRON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the conventional high-frequency resin composition is mostly made of cyanate ester, polyphenylene ether and other materials to prepare high-frequency copper-clad laminates, and the cost is relatively high.
However, the application of benzoxazine resin to the

Method used

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  • Halogen resin composition and application thereof
  • Halogen resin composition and application thereof
  • Halogen resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] A halogen-containing resin composition prepared from the following raw materials in parts by weight:

[0052]

[0053] The halogen-containing resin composition of this example is selected to prepare a metal foil substrate, and the preparation method is as follows:

[0054] (1) dissolve.

[0055] Take the above-mentioned halogen-containing resin composition, use methyl ethyl ketone as a solvent, and stir at room temperature at high speed to obtain a resin glue solution with a solid content of 60 wt%.

[0056] (2) Impregnated and glued.

[0057] Take the glass fiber cloth of 2116 specifications and impregnate the above resin glue.

[0058] (3) drying.

[0059] Dry the glass fiber cloth impregnated with the resin glue solution at 160°C-190°C to obtain a prepreg.

[0060] (4) Take the prepreg prepared above and copper foil with a thickness of 1 ounce (35 μm thick), and press them with a hot press. The pressing specification is 2116×6ply. After 60 minutes, the metal ...

Embodiment 2

[0062] A halogen-containing resin composition prepared from the following raw materials in parts by weight:

[0063]

[0064] The metal foil substrate was prepared by using the halogen-containing resin composition of this example, and the metal foil substrate was prepared according to the preparation method in Example 1.

Embodiment 3

[0066] A halogen-containing resin composition prepared from the following raw materials in parts by weight:

[0067]

[0068] The metal foil substrate was prepared by using the halogen-containing resin composition of this example, and the metal foil substrate was prepared according to the preparation method in Example 1.

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PUM

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Abstract

The invention relates to a halogen resin composition and an application thereof. The halogen resin composition is prepared from the following raw materials in parts by weight: 20-50 parts of dicyclopentadiene epoxy resin, 10-40 parts of styrene-maleic anhydride copolymer, 10-30 parts of benzoxazine resin, 20-40 parts of halogenous fire retardant, and 5-20 parts of multi-functional group epoxy resin, wherein the halogenous fire retardant is at least one of the decabrominated dipheny ethane, tri(tribromophenyl) triazine, brominated polyolefin, brominated polystyrene, ethyl-di(tetrabromobenzene o-dicarboximide), decabromodiphenyl ether, hexabromocyclododecane, eight bromo ether, tetrachlorophthalic anhydride, Hexachlorocyclopentadiene and perchlorinated cyclopentyl decane. A metal foil substrate made of the halogen resin composition has the advantages of low dielectric constant and dielectric loss, excellent heat resistance, good machinability and low swelling coefficient and can be well applied to a composite board.

Description

technical field [0001] The invention relates to a resin composition, in particular to a halogen-containing resin composition and its application. Background technique [0002] At present, the electronics industry is developing rapidly, and the requirements for the performance of copper clad laminates are getting higher and higher, especially in the three major portable electronic products, satellite transmission and communication electronic products. The factors that can directly affect the performance of the above products are basically attributed to the dielectric coefficient (Dk) and dielectric loss tangent (Df) of the substrate. The smaller the dielectric coefficient of the substrate, the faster the signal transmission speed and the dielectric loss. The smaller the tangent value, the more complete the transmission of the signal, and the higher the authenticity of the signal. Especially the current electronic products are small, light and thin, and the transmission frequ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L25/08C08L79/04C08L25/06C08K13/02C08K5/3492C08K3/36
Inventor 罗文李宏途肖浩周俊文
Owner GUANGZHOU GRACE ELECTRON CORP
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