Dry and wet dual-purpose laser welding diamond saw blade

A diamond saw blade and laser welding technology, which is applied in stone processing tools, stone processing equipment, manufacturing tools, etc., can solve problems such as harsh environments, and achieve the effects of not easy to fall off, good safety performance, and stable cutting performance

Active Publication Date: 2015-09-02
JIANGSU FENGTAI TOOLS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous development of technology, the requirements for cutting efficiency and cutting speed are getting higher and higher, and the cutting environment is also very har

Method used

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  • Dry and wet dual-purpose laser welding diamond saw blade

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Take 2.7kg of copper powder, 4.16kg of iron powder, 0.5kg of nickel powder, 1.5kg of cobalt powder, 0.7kg of tin powder, and 0.15kg of rare earth alloy powder, put them into the mixing tank and mix for 30 minutes, then add 0.13kg of liquid paraffin, diamond 0.16kg (compressive strength 25Kg, particle size 35 / 40), continue mixing for 3 hours, pour the powder into the mold for cold pressing, hot pressing sintering (sintering temperature is 800°C, pressure 320kg / cm 2 ), grind the cutter head with the grinding wheel and the abrasive belt, put the cutter head and the substrate together on the corresponding substrate position according to the drawings, adjust the light spot of the laser welding machine to the appropriate position between the cutter head and the substrate, and start the laser welding machine to weld, so that The cutter head and the substrate are welded together at the moment of laser penetration, and then 600N / mm 2 Intensity Standards Welding strength testing ...

Embodiment 2

[0034] Take 3.1kg of copper powder, 4.15kg of iron powder, 0.8kg of nickel powder, 1.1kg of cobalt powder, 0.4kg of tin powder, and 0.15kg of rare earth alloy powder, put them into the mixing tank and mix for 30 minutes, then add 0.10kg of liquid paraffin, diamond 0.20kg (compressive strength 25Kg, particle size 35 / 40), continue mixing for 3 hours, pour the powder into the mold for cold pressing, hot pressing sintering (sintering temperature is 800°C, pressure 320kg / cm 2 ), grind the cutter head with the grinding wheel and the abrasive belt, put the cutter head and the substrate together on the corresponding substrate position according to the drawings, adjust the light spot of the laser welding machine to the appropriate position between the cutter head and the substrate, and start the laser welding machine to weld, so that The cutter head and the substrate are welded together at the moment of laser penetration, and then 600N / mm 2Intensity Standards Welding strength testing i...

Embodiment 3

[0036] Take 2.9kg of copper powder, 4.3kg of iron powder, 0.65kg of nickel powder, 1.2kg of cobalt powder, 0.5kg of tin powder, and 0.16kg of rare earth alloy powder, put them into the mixing tank and mix for 30 minutes, then add 0.11kg of liquid paraffin, diamond 0.18kg (compressive strength 25Kg, particle size 35 / 40), continue mixing for 3 hours, pour the powder into the mold for cold pressing, hot pressing sintering (sintering temperature is 800°C, pressure 320kg / cm 2 ), grind the cutter head with the grinding wheel and the abrasive belt, put the cutter head and the substrate together on the corresponding substrate position according to the drawings, adjust the light spot of the laser welding machine to the appropriate position between the cutter head and the substrate, and start the laser welding machine to weld, so that The cutter head and the substrate are welded together at the moment of laser penetration, and then 600N / mm 2 Intensity Standards Welding strength testing ...

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Abstract

The invention relates to a dry and wet dual-purpose laser welding diamond saw blade, and belongs to the technical field of diamond processing tools. The diamond saw blade comprises a circular base body which comprises a side circumferential surface located on the edge. A plurality of chip removal grooves extending in the circle center direction inwards are formed in the side circumferential surface at intervals. Diamond tool bits are formed between the chip removal grooves. The chip removal grooves include the first chip removal grooves and the second chip removal grooves, wherein the first chip removal grooves and the second chip removal grooves are formed at intervals. The diamond tool bits include the first diamond tool bits and the second diamond tool bits, wherein the first diamond tool bits and the second diamond tool bits are arranged at intervals. The cross sections of the first chip removal grooves are larger than those of the second chip removal grooves. The surfaces of the first diamond tool bits are planes. A plurality of protruding strips are arranged on the surfaces of the second diamond tool bits. Grooves are formed between the protruding strips. Chip removal and heat dissipation can be well conducted through the diamond saw blade in the cutting process, the good cutting performance can be kept under the condition of no cooling water grinding, and the purpose of conducting processing under extreme conditions is achieved for users.

Description

technical field [0001] The invention relates to the technical field of diamond processing tools, more specifically, the invention relates to a laser welding diamond saw blade for wet and dry use. Background technique [0002] In today's market, diamond saw blades have been widely used in the cutting and processing of marble, granite, concrete, asphalt, ceramics, glass, jewelry and jade, semiconductors and other materials, continuously improving product efficiency and reducing material loss, especially in the processing of precious stone, jade and glass products When it comes to semiconductor materials, reducing material loss and improving economic benefits are the common pursuit of the market. The diamond saw blade is composed of two aspects: the diamond blade and the central substrate of the circular saw blade. The thickness of the central substrate of the circular saw blade determines the thickness of the diamond blade. The larger the size, the worse the economic benefit,...

Claims

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Application Information

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IPC IPC(8): B28D1/04
CPCB28D1/04
Inventor 邱瑜铭董先龙方利灵
Owner JIANGSU FENGTAI TOOLS
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