Black surface treatment method for electrolytic copper foil

An electrolytic copper foil and surface treatment technology, which is applied in metal material coating process, superimposed layer plating, coating and other directions, can solve the problem that the peel strength, heat resistance and oxidation resistance of electrolytic copper foil products cannot fully meet the actual requirements. Production needs and other issues, to achieve good prospects and application value, good environmental protection characteristics

Active Publication Date: 2015-10-28
LINGBAO WASON COPPER FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the existing treatment methods, the electrolytic copper foil products still cannot fully meet the actual production needs in terms of specific properties such as peel strength, heat resistance, and oxidation resistance. Therefore, it is still necessary to further explore new copper foil treatment processes.

Method used

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  • Black surface treatment method for electrolytic copper foil
  • Black surface treatment method for electrolytic copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The method for treating the black surface of the electrolytic copper foil used in this embodiment includes the following steps.

[0031] (1) Raw material treatment, the electrolytic copper foil with a thickness of 12 microns produced by Lingbao Huaxin Copper Foil Co., Ltd. after two roughening and curing treatments was used in this example;

[0032] Specifically, the process conditions of the first roughening and the second roughening are: Cu 2+ Concentration 25g / L, H 2 SO 4 Concentration 43g / L, temperature 25℃, current density 1400A / m 2 ;

[0033] The process conditions of the first curing and the second curing are: Cu 2+ Concentration 37gL, H 2 SO 4 Concentration 45g / L, temperature 30°C, current density 1700A / m 2 .

[0034] (2) Electrodeposition of Ni-Zn binary alloy,

[0035] Preparation of electroplating Ni—Zn binary alloy solution: Potassium pyrophosphate (K 4 P 2 o 7 ), nickel sulfate, zinc sulfate, additive A, additive B, and complexing agent are diss...

Embodiment 2

[0049] The method for treating the black surface of the electrolytic copper foil used in this embodiment includes the following steps.

[0050] (1) Raw material treatment, the raw materials are the same as in Example 1, all of which are electrolytic copper foils with a thickness of 12 microns produced by Lingbao Huaxin Copper Foil Co., Ltd. after two roughening and curing treatments;

[0051] (2) Preparation of electroplating Ni—Zn binary alloy solution, potassium pyrophosphate (K 4 P 2 o 7 ), nickel sulfate, zinc sulfate, additive A, additive B, complexing agent and other substances are dissolved separately and mixed evenly;

[0052] Described additive A is the ammonium chloride that can release ammonium root after dissolving;

[0053] Described additive B adopts Zn, Ag, and its mass ratio is 2:7;

[0054] The complexing agent adopts complexing agent R;

[0055] The concentration levels of each material are as follows:

[0056] K 4 P 2 o 7 , 180g / L; Ni 2+ , 10g / L; Z...

Embodiment 3

[0064] The method for treating the black surface of the electrolytic copper foil used in this embodiment includes the following steps.

[0065] (1) Raw material treatment, the raw materials are the same as in Example 1, which are electrolytic copper foils with a thickness of 12 microns produced by Lingbao Huaxin Copper Foil Co., Ltd. after twice roughening and curing.

[0066] (2) Electrodeposition of Ni-Zn binary alloy,

[0067] Electroplating Ni—Zn binary alloy solution: Potassium pyrophosphate (K 4 P 2 o 7 ), nickel sulfate, zinc sulfate, additive A, additive B, complexing agent and other substances are dissolved separately and mixed evenly;

[0068] The additive A is a mixture of sodium sulfite capable of releasing sulfite after dissolving and sodium chloride releasing chloride ions after dissolving, wherein the mass ratio of sodium sulfite to sodium chloride is 2:1;

[0069] Described additive B adopts Zn, Co, and its mass ratio is 3:2;

[0070] Complexing agent adop...

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Abstract

The invention belongs to the technical field of electrolytic copper foil surface treatment, and particularly relates to a black surface treatment method for electrolytic copper foil. The method includes the steps of raw material handling, electro-deposition of Ni-Zn binary alloy, passivating treatment, coupling agent spraying and the like. The method has the advantages that 1, harmful elements such as Pb and As are not included in the method, the environment-friendly characteristic is good, and treated copper foil with a certain good property and a black appearance is obtained by selecting a proper surface treatment process condition under the condition that additives doing harm to the health of people are not used; 2, testing shows that the peeling resistance strength, heat resistance, oxidation resistance, corrosion resistance and other performance of 12 [mu]m electrolytic copper foil products prepared through the method all meet the application requirements, and the prospect and application value are good.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil surface treatment, and in particular relates to a black surface treatment method of electrolytic copper foil. Background technique [0002] According to different manufacturing methods of copper foil, it can be divided into two categories: rolled copper foil and electrolytic copper foil. Electrodeposited copper foil is different from calendered copper foil. The two surfaces of electrolytic copper foil have different crystal forms. The side close to the cathode roller is relatively smooth, which is called the smooth side; Since electrolytic copper foil has a columnar crystal structure, its strength, toughness and other properties are inferior to those of rolled copper foil, so electrolytic copper foil is mostly used in the production of rigid copper clad laminates, and then made into rigid printed boards. With the continuous development of high-density, thin-line, multi-layer, thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/00C25D3/56C25D7/06C23C22/60C23C22/68
Inventor 樊斌锋王建智韩树华张欣
Owner LINGBAO WASON COPPER FOIL
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