Silver alloy wire

Abstract

The present invention provides a silver alloy wire, which comprises a core wire, a gold-plated layer and a palladium-plated layer formed between the gold-plated layer and the core wire, the core wire contains silver, palladium, a first additive component and a second Two additional components, the first additive component can be platinum, nickel or copper, the second additive component can be germanium, cerium, gold or iridium, based on the total weight of the core wire, the content of palladium is greater than or equal to 1.1wt % and less than or equal to 2.8wt%, the content of the first added component is greater than 0.1wt% and less than 1wt%, and the content of the second added component is greater than 0.02wt% and less than 0.2wt%. Therefore, the silver alloy wire rod of the present invention can not only have good electrical conductivity, oxidation resistance, wire drawing workability, ball stability, PCT reliability and u-HAST reliability, but also can specifically improve the silver alloy wire rod and packaging material The bonding strength of the interface.

Description

technical field [0001] The invention relates to the related fields of semiconductor and LED packaging, in particular to a silver alloy wire with silver as the main component. Background technique [0002] In view of the good ductility, electrical conductivity and resistance to oxidation of gold wires, most of the wire bonding manufacturing methods in the early semiconductor field used gold wires with a wire diameter of 15 to 50 microns to bond The die is interconnected with the substrate for signal transfer purposes. [0003] However, as the price of gold soars year by year and the brittle intermetallic compound formed at the interface between the gold wire and the aluminum pad is easy to deteriorate the reliability of the contact, the industry turns to the cheap copper wire instead of gold wire to reduce the reliability of electronic products Production costs, and the copper wire has the advantages of high strength and is not easy to form intermetallic compounds with the a...

AI Technical Summary

Problems solved by technology

However, the silver alloy wires in the prior art are prone to chemical reactions with the packaging materials in the harsh environment of the reliability test, so that the silver alloy wires in the prior art are often corroded to reduce their reliability; and Delamination (also known as delamination (delamination)) often occurs between the surface of the silver alloy wire and the packaging material, so that the silver alloy wire of the prior art cannot have sufficient interface bonding strength with the packaging material, and even Cause problems such as line fusing (burn out)

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