TiB2 direct-current magnetron sputtering coating target prepared through vacuum gas shield pressure sintering
A DC magnetron sputtering and gas shielding technology, applied in sputtering coating, vacuum evaporation coating, ion implantation coating and other directions, can solve the problems of high raw material cost, easy cracking, difficult sintering and densification, etc. The effect of stable process, outstanding application value and short preparation cycle
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[0022] Embodiment 1: to the TiB that purity is 99.95% 2 The powder is ball milled to make the particle size small and uniform, then molded, sintered at T=1000°C, pressurized to 1MPa to obtain a semi-finished product, and finally the semi-finished product is processed to machine the sintered target body. Make sure all planes remain flat and the angles are at right angles to get TiB 2 Coated target. Then keep the pressure constant, increase the temperature to 1200°C and 1300°C, etc., and so on, do multiple sets of experiments respectively to obtain TiB with excellent performance 2 Coated target.
[0023] In the foregoing, TiB 2 The powder is a dark gray powder with uniform appearance and color, without visible impurities; physical and chemical properties include: specific gravity 4.52g / cm 3 , Melting point 2980 ℃, Mohs hardness > 9, resistivity 12μΩ·M, no reaction with acid and alkali, wear resistance, thermal shock resistance.
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