Polyimide high-dielectric composite film mixed with nano-molybdenum disulfide-loaded graphene oxide and used for capacitor and preparation method thereof

Abstract

The invention discloses a polyimide high-dielectric composite film mixed with nano-molybdenum disulfide-loaded graphene oxide and used for a capacitor. Nano-molybdenum disulfide and graphene oxide sol are mixed in the polyimide film preparation process and the graphene oxide is loaded in nano-molybdenum disulfide, so that the dispersity and utilization rate of the graphene oxide are improved; coating processing is performed on powder by utilizing a polyvinyl alcohol film having good stability in an organic solvent; composite powder having undergone silane coupling agent surface modification treatment and organic glue solution are good in interfacial compatibility and are liable to be scattered evenly, and accordingly the dielectric properties of the material are improved stably and efficiently. Compared with a pure polyimide film, the finally prepared composite film is greatly improved in dielectric properties, still maintains good mechanical properties and processing performance and is good in application prospect.

Description

technical field [0001] The invention relates to the technical field of preparation of high dielectric composite materials, in particular to a polyimide high dielectric composite film for capacitors mixed with nanomolybdenum disulfide supported graphene oxide and a preparation method thereof. Background technique [0002] With the advancement of electronic technology, the requirements for the dielectric properties and energy storage capacity of capacitors are getting higher and higher. It is particularly important to develop dielectric materials with high dielectric constant and low dielectric loss. Traditional film capacitor dielectric materials are mainly There are non-polar polystyrene, polyethylene, polypropylene and polar polyimide, polycarbonate and other materials, among which polyimide has good mechanical properties and thermal stability, easy processability, and base It has the advantages of good material compatibility and easy film formation, and is outstanding in t...

AI Technical Summary

Problems solved by technology

The dielectric constant of pure polyimide film is too low to meet the production requirements. At present, the common method for improving the dielectric constant of the film is mainly to use the method of mixing high dielectric materials in the polymer. However, these methods are generally Defects are manifested in the deterioration of film processing performance, the increase of dielectric constant and the increase of dielectric loss, etc.