Preparation method of thermal conducting and insulating material of LED substrate

Abstract

The invention relates to a preparation method of a thermal conducting and insulating material of an LED substrate. The thermal conducting and insulating material comprises, by mass, 30-80% of nanoscale inorganic thermal conducting powder with thermal conductivity coefficient larger than 10 W / mk, 10-60% of graft copolymer of grafting modifier and polyolefin resin and 0.25-10% of dispersing agents. The nanoscale inorganic thermal conducting powder is grafted on the grafting modifier, and the grafting modifier is grafted on branch chains of the polyolefin resin; maleic anhydride serves as the grafting modifier; one or more of organic dispersants or silane coupling agents such as 3-ethylhexyl phosphoric acid, lauryl sodium sulfate, methyl anyl alcohol, cellulose derivatives, polyacrylamide, gul glue and fatty acid polyglycol ester serves / serve as the dispersing agents. By adding the nanoscale inorganic thermal conducting powder to resin material, the resin material has good thermal conductivity, and the rigidity of the resin material is increased.

Description

technical field [0001] The invention belongs to the technical field of material chemistry, and relates to a thermally conductive insulating material for a high-power LED substrate and a preparation method thereof. Background technique [0002] For low-power LED packaging, ordinary PCB boards can meet the demand, but for high-power LEDs, only 20% of the input energy is converted into light, and the rest is consumed in the form of heat. If the outside world is excluded, the life of the LED will be greatly reduced. The heat dissipation capability of LEDs is usually affected by the packaging mode and the thermal conductivity of the materials used. [0003] The traditional cannonball-type package is used in a plug-in type. It is widely used in the indicator lights of home appliances or communication products. The colors that are often seen are red, yellow, and green. However, because most of the heat generated by LEDs can only pass through two The wire conducts heat to the asse...

AI Technical Summary

Problems solved by technology

Commonly used thermally conductive fillers include alumina, magnesia, silicon oxide, aluminum nitride, boron nitride, silicon carbide, etc. These thermally conductive fillers are filled in the resin material to make the resin material have high thermal conductivity, and the higher the proportion of thermally conductive filler in the resin The larger the resin, the better the thermal conductivity of the resin. In the past, micron-sized thermal conductive fillers were added to the resin and placed in an extruder to extrude and granulate. Due to the addition of inorganic substances in the resin, the mechanical strength of the resin was reduced, and it was resistant to bending and twisting. The performance is poor, and the anti-compression and anti-shock ability becomes poor, so people began to study adding nano-scale inorganic fillers to organic resin materials, but it is difficult to make nano-scale inorganic fillers into organic resin materials. The fillers are well dispersed, and the nano-scale inorganic fillers are easy to agglomerate together, resulting in poor physical properties and thermal conductivity of thermally conductive resin materials