Graphite-metal heat conduction composite material and preparation method thereof

A metal composite material and composite material technology, applied in the field of graphite-metal thermally conductive composite materials and their preparation, can solve the problems of low bonding capacity, high equipment requirements, poor wettability, etc., and achieve good thermal conductivity and high bonding strength. Effect
CN105081333AActive Publication Date: 2015-11-25宁波赛墨科技有限公司
13 Cites 8 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
宁波赛墨科技有限公司
Publication Date
2015-11-25

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to a graphite-metal heat conduction composite material and a preparation method thereof. The graphite-metal heat conduction composite material comprises a metal base body and a graphite composite body distributed in the interior and / or the surface of the metal base body. The graphite composite body comprises graphite particles, a carbide layer and a carbide forming element layer, wherein the carbide layer is combined to the surfaces of the graphite particles, and the carbide forming element layer is combined to the surface of the carbide layer; carbide forming elements comprise B, Si, Cr, W and Mo; carbides comprise a boron carbide, a silicon carbide, a tungsten carbide, a chromium carbide and a molybdenum carbide; and the graphite composite body is combined with the metal base body through the carbide forming element layer. The composite material has the excellent performance and is widely applied.
Need to check novelty before this filing date? Find Prior Art

Description

Technical field

[0001] The invention belongs to the field of thermally conductive composite materials. Specifically, the present invention relates to a graphite-metal thermally conductive composite material and a preparation method thereof. Background technique

[0002] With the rapid development of the electronic technology industry, more and more heat is dissipated per unit area of ​​devices, which puts more stringent requirements on the performance of thermal management materials. As an important part of the development of electronic packaging materials, materials are required to have high thermal conductivity, low expansion coefficient, light weight, and low cost. However, although the traditional Al / SiC composite materials, Cu / W composite materials and Cu / Mo composite materials and other special alloy materials have low thermal expansion coefficients, they have all undergone special processing, sacrificing the performance of the materials in terms of thermal conductivity an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More