CEM-3 type copper-clad laminated plate base paper manufacturing method

A manufacturing method and technology of laminated boards, which are applied in chemical instruments and methods, lamination, and layered products, etc., can solve the problem of poor tracking resistance, peeling resistance, cracking resistance, etc. of copper-clad laminated board base paper. Poor impact performance, shortened shelf life of adhesive sheets, etc., to achieve the effects of improving peel strength, enhancing adhesiveness and flame retardancy, and reducing curing time

Inactive Publication Date: 2015-12-09
忠信(太仓)绝缘材料有限公司
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] (1) When not toughened, the cured product is generally brittle, with poor peeling, cracking and impact resistance
[0008] (2) Low adhesion to materials with low polarity (such as polyethylene, polypropylene, fluoroplastics, etc.)
[0009] (3) Some raw materials such as reactive diluents, curing agents, etc. have varying degrees of toxicity and irritation
[0012] However, the high-performance resin-modified epoxy resin used, but due to the presence of a large number of benzene rings, the base paper of the copper-clad laminate has poor tracking resistance.
Moreover, the use of such a modified epoxy resin requires a higher curing temperature when processing the board; in addition, it will react slowly at room temperature, so that the storage period of the adhesive sheet is greatly shortened. In addition, the system does not have ultraviolet light. blocking function

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • CEM-3 type copper-clad laminated plate base paper manufacturing method
  • CEM-3 type copper-clad laminated plate base paper manufacturing method
  • CEM-3 type copper-clad laminated plate base paper manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Add tetrabromobisphenol A and epichlorohydrin into the reaction kettle, stir at room temperature for 25 minutes, heat up to 60°C, add 20% NaOH aqueous solution dropwise, finish the dropwise addition within 30 minutes, and raise the temperature to 70°C after the dropwise addition ℃, reacted for 2h, added distilled water and toluene, stirred until dissolved, separated, and vacuum distilled to obtain the brominated bisphenol A type epoxy resin;

Embodiment 2

[0068] Add tetrabromobisphenol A and epichlorohydrin into the reaction kettle, stir at room temperature for 30 minutes, heat up to 50°C, add 20% NaOH aqueous solution dropwise, finish the dropwise addition within 60 minutes, and raise the temperature to 80°C after the dropwise addition ℃, reacted for 1.5h, added distilled water and toluene, stirred until dissolved, separated, and vacuum distilled to obtain the brominated bisphenol A epoxy resin;

Embodiment 3

[0070] Add tetrabromobisphenol A and epichlorohydrin into the reaction kettle, stir at room temperature for 28 minutes, heat up to 60°C, add 20% NaOH aqueous solution dropwise, and finish the dropwise addition within 50 minutes, then raise the temperature to 75°C ℃, reacted for 2h, added distilled water and toluene, stirred until dissolved, separated, and vacuum distilled to obtain the brominated bisphenol A type epoxy resin;

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a CEM-3 type copper-clad laminated plate base paper manufacturing method, which comprises: 1) preparing an impregnating glue liquid; 2) manufacturing a surface material; 3) manufacturing a core material; 4) stacking the obtained surface material and the obtained core material, covering copper foil on the upper surface of the plurality of the stacked base plates, covering a layer of a release film on the bottom surface, and then placing between two stainless steel plates; 5) placing into a laminator, carrying out a heating and pressurization treatment at a heating temperature of 170-175 DEG C under a pressure of 1-2 MPa, maintaining the pressure for 10-15 min, taking out, cutting, and testing to obtain the CEM-3 type copper-clad laminated plate base paper finished product. According to the present invention, the brominated bisphenol A type epoxy resin specially made through the method is matched with a variety of preparations to form the glue liquid, and the manufacturing process and the manufacturing conditions are subjected to the optimized combination so as to obtain the copper-clad laminated plate with characteristics of high temperature resistance and high fire-retardant property.

Description

technical field [0001] The invention relates to a method for manufacturing a base paper of a CEM-3 type copper-clad laminate. Background technique [0002] Copper Clad Laminate (CCL), also known as copper clad laminate base paper, is made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. A plate-shaped material, referred to as copper clad laminate. Various printed circuit boards of different forms and functions are selectively processed, etched, drilled and copper-plated on the copper clad laminate to make different printed circuits. It mainly plays the role of interconnection, insulation and support for printed circuit boards, and has a great influence on the transmission speed, energy loss and characteristic impedance of signals in the circuit. Therefore, the performance, quality and manufacturing of printed circuit boards The processability, manufacturing level, manufactu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/06B32B17/04B32B15/14B32B7/06B32B15/20B32B15/18C08L63/00C08L47/00C08L75/04C08G59/50C08G59/62C08K3/22C08K3/34C08K3/26C08K3/36
CPCB32B37/10B32B5/02B32B7/06B32B15/14B32B15/18B32B15/20B32B37/06B32B2260/021B32B2260/046B32B2262/101B32B2307/306B32B2307/3065B32B2309/02B32B2309/12B32B2457/08C08G59/5033C08G59/504C08G59/62C08L63/00C08L2201/02C08L2201/08C08L47/00C08K5/54C08L75/04
Inventor 张国强
Owner 忠信(太仓)绝缘材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap