Method for preparing aluminium nitride powder through high-temperature fusion process

A high-temperature melting, aluminum nitride technology, used in chemical instruments and methods, nitrogen compounds, inorganic chemistry, etc., can solve the problems of difficult control of the reaction process, incomplete nitridation, low cost, etc., to achieve narrow particle size distribution, sphericity High and low cost effect

Active Publication Date: 2015-12-09
SHANDONG SINOCERA FUNCTIONAL MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The direct nitriding process is simple, but there are problems of easy agglomeration of the product and incomplete nitriding; the self-propagating method has a fast reaction speed and low cost, but the reaction process is difficult to control and the product purity is low; the carbothermal reduction method can prepare high-grade

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  • Method for preparing aluminium nitride powder through high-temperature fusion process
  • Method for preparing aluminium nitride powder through high-temperature fusion process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A mixture of ammonia and nitrogen is fed into the melting furnace, the purity of ammonia is 99.9%, the purity of nitrogen is 99.9%, the mixing molar ratio of ammonia and nitrogen is 2:1, and the supply rate is 30L / min for cleaning the air in the furnace;

[0028] The melting furnace is heated up, from room temperature to 1650°C in 5 hours, and kept at 1650°C;

[0029] After heat preservation at 1650°C, the air intake of ammonia and nitrogen mixture is 300L / min. The aluminum powder is ultra-fine atomized aluminum powder, the average particle size of the aluminum powder is 2μm, and the supply rate of the aluminum powder is 400g / min. The cooling water supply rate is 20L / min. During the reaction process, the temperature at the lower end of the cooling tower fluctuates between 340 and 370 °C.

[0030] Finally, the aluminum nitride powder collected by the bag filter has an average particle size of 3 μm, a narrow particle size distribution, high sphericity, and no agglomera...

Embodiment 2

[0032] A mixture of ammonia and nitrogen is fed into the melting furnace, the purity of ammonia is 99.9%, the purity of nitrogen is 99.9%, the mixing molar ratio of ammonia and nitrogen is 2:1, and the supply rate is 30L / min for cleaning the air in the furnace;

[0033] The melting furnace is heated up, from room temperature to 1750°C in 5 hours, and kept at 1750°C;

[0034] After heat preservation at 1750°C, the air intake of ammonia and nitrogen mixture is 300L / min. The aluminum powder is ultra-fine atomized aluminum powder, the average particle size of the aluminum powder is 2μm, and the supply rate of the aluminum powder is 400g / min. The cooling water supply rate is 20L / min. During the reaction process, the temperature at the lower end of the cooling tower fluctuates between 340 and 370 °C.

[0035] Finally, the aluminum nitride powder collected by the bag filter has an average particle size of 3 μm, a narrow particle size distribution, high sphericity, and no agglomera...

Embodiment 3

[0037] Into the melting furnace into the mixed gas of ammonia and nitrogen, the purity of ammonia gas is 99.9%, the purity of nitrogen gas is 99.9%, the mixing molar ratio of ammonia gas and nitrogen gas is 3:1, the supply rate is 30L / min, for exhaust the air in the furnace;

[0038] The melting furnace is heated up, from room temperature to 1650°C in 5 hours, and kept at 1650°C;

[0039] After heat preservation at 1650°C, the air intake of ammonia and nitrogen mixture is 300L / min. The aluminum powder is ultra-fine atomized aluminum powder, the average particle size of the aluminum powder is 2μm, and the supply rate of the aluminum powder is 400g / min. The cooling water supply rate is 20L / min. During the reaction process, the temperature at the lower end of the cooling tower fluctuates between 340 and 370 °C.

[0040] Finally, the aluminum nitride powder collected by the bag filter has an average particle size of 3 μm, a narrow particle size distribution, high sphericity, an...

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Abstract

A method for preparing aluminium nitride powder through high-temperature fusion process is realized through the following operation steps: (1) introducing a mixed gas of ammonia gas and nitrogen into a fusion furnace, and controlling the feed speed of the ammonia-gas nitrogen mixed gas to be 25 L/min-35 L/min, and discharging air in the furnace; (2) heating the fusion furnace body to 1100 DEG C-2200 DEG C, keeping warm at a set temperature, and controlling the reaction temperature to be higher than the melting point of aluminium powder, and guaranteeing the aluminium powder to be liquefied during reaction; (3) adding a high-purity aluminium powder into the fusion furnace body, also feeding ammonia gas and nitrogen, controlling the feed speed of ammonia-gas nitrogen mixed gas to be 280 L/min-320 L/min, and enabling the aluminium powder to be melt and reacted; (4) controlling the temperature of a lower end of a cooling area of a cooling furnace to be lower than 400 DEG C; (5) transferring reacted aluminium powder into the cooling furnace for cooling, and enabling collected aluminium powder to enter a bag filter; and (6) introducing tail gas into tail-gas processing equipment by a blower. The employed method is low in cost, and the prepared aluminium nitride powder is high in purity, high in sphericility, narrow in particle size distribution and free of caking phenomenon.

Description

technical field [0001] The invention relates to a method for preparing aluminum oxide powder, in particular to a method for preparing aluminum nitride powder by a high-temperature melting method. Background technique [0002] At present, with the rapid development of the electronics industry and LED industry, devices are gradually developing towards miniaturization and high power, which will inevitably lead to high heat generation. The application of high thermal conductivity materials can effectively solve the heat dissipation problem of high power devices . At present, high thermal conductivity substrates that have been used in practical and development applications include alumina, silicon carbide, beryllium oxide, aluminum nitride, CVD-BN, etc. Alumina is low in cost, but its relatively low thermal conductivity limits its use in high-end applications. Although silicon carbide has high thermal conductivity, it has large capacitance, low resistivity, and poor insulation....

Claims

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Application Information

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IPC IPC(8): C01B21/072
Inventor 宋锡滨张兵张曦潘光军
Owner SHANDONG SINOCERA FUNCTIONAL MATERIAL CO LTD
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