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Solder for soldering different-component W-Cu alloy, preparing method and soldering method thereof

A brazing material and brazing technology, which is applied in welding equipment, metal processing equipment, welding/welding/cutting articles, etc., can solve the problems that have not been seen in the brazing reports of different components of W-Cu alloy, and achieve the promotion of solid solution Effect of metallurgical reaction, improvement of comprehensive performance, improvement of plasticity and strength

Active Publication Date: 2015-12-23
无锡腾达海川新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are no reports on the brazing of heterogeneous W-Cu alloys

Method used

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  • Solder for soldering different-component W-Cu alloy, preparing method and soldering method thereof
  • Solder for soldering different-component W-Cu alloy, preparing method and soldering method thereof
  • Solder for soldering different-component W-Cu alloy, preparing method and soldering method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] W75-Cu1 alloy and W55-Cu2 alloy were selected for butt joint vacuum brazing. Among them, the size of W75-Cu1 alloy and W55-Cu2 alloy samples are both 20mm×20mm×6mm, and the surface to be brazed is 20mm×6mm in section.

[0037] The composition and mass percentage ratio of the solder are: Mn13.0%, Co2.5%, Ni3.0%, Ti3.0%, Si0.5%, B0.2%, and the balance is Cu. The thickness of the solder is 100 μm.

[0038] Above-mentioned a kind of solder preparation method of brazing W75-Cu alloy and W55-Cu alloy comprises the following steps:

[0039] 1) Weigh high-purity 130g Mn flakes, 25g Co granules, 30gNi granules, 30gTi granules, 5gSi granules, 2gB granules and 778gCu granules to prepare a mixture according to mass percentage, put it into a container with acetone, and keep it at a temperature of about 20°C Perform ultrasonic cleaning for 15-20 minutes;

[0040] 2) drying the mixture after ultrasonic cleaning in step 1 at a temperature of 30-50° C. to obtain a dried mixture;

[00...

Embodiment 2

[0052] W80-Cu alloy and W60-Cu alloy were selected for vacuum brazing of butt joints. Among them, the size of W80-Cu alloy and W60-Cu alloy sample is 20mm×20mm×6mm, and the surface to be brazed is 20mm×6mm.

[0053] The composition and mass percentage ratio of the solder are: Mn15.0%, Co2.0%, Ni3.0%, Ti3.0%, Si0.3%, B0.15%, and the balance is Cu. The thickness of the solder was 130 μm.

[0054] The brazing process steps are:

[0055] (1) Preparation stage: Clean the end faces of W80-Cu alloy and W60-Cu alloy samples to be brazed, remove surface impurities, oil stains and oxide films, use W28~W3.5 metallographic sandpaper to grind smooth, use W3.5 metallographic sandpaper to grind both sides of the copper-based solder foil smooth, after grinding, put the W80-Cu alloy, W60-Cu alloy and the solder foil together in acetone, and use ultrasonic cleaning for 15-20 minutes, And carry out drying treatment;

[0056] (2) Assembly stage: place the cleaned solder foil between the W80-C...

Embodiment 3

[0060] W70-Cu alloy and W50-Cu alloy were selected for vacuum brazing of butt joints. Among them, the size of W70-Cu alloy and W50-Cu alloy sample is 20mm×20mm×6mm, and the surface to be brazed is 20mm×6mm.

[0061] The composition and mass percentage ratio of the solder are: Mn12.0%, Co3.0%, Ni4.0%, Ti3.0%, Si0.6%, B0.3%, and the balance is Cu. The thickness of the solder is 150 μm.

[0062] The brazing process steps are:

[0063] (1) Preparation stage: Clean the end faces of the W70-Cu alloy and W50-Cu alloy samples to be brazed to remove impurities, oil stains and oxide films on the surface, and use W28~W3.5 metallographic sandpaper to grind and smooth. W3.5 metallographic sandpaper to grind the copper-based solder foil on both sides to smooth, after grinding, put W70-Cu alloy, W50-Cu alloy and solder foil together in acetone, and use ultrasonic cleaning for 15-20min, And carry out drying treatment;

[0064] (2) Assembly stage: place the cleaned solder foil between the ...

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Abstract

The invention discloses a solder for soldering a different-component W-Cu alloy, a preparing method and a soldering method thereof. The mass percents of the components of the solder are described as follows: 10.0-16.0% of Mn, 0.5-3.5% of Co, 1.0-5.0% of Ni, 1.0-4.0% of Ti, 0.2-0.6% of Si, 0.1-.03% of B, and the balance of Cu. The soldering temperature of the copper-based solder is 1000-1050 DEG C. Moderate fusing temperature of the solder and high fusion uniformity of the solder are realized. Through adding related beneficial elements, good wetability and high metallurgical miscibility of the solder to the W-Cu alloy are realized. An obtained solder joint has high strength and high corrosion resistance and can be totally applied in a complicated environment. The solder is an economical solder with high comprehensive performance. A prepared copper-based solder foil has functions of facilitating diffusion and interface reaction between alloy elements in a soldering connecting process, improving wetting and spreading capabilities of the solder on the surface of the W-Cu alloy, and facilitating forming of a compact solder joint.

Description

technical field [0001] The invention relates to brazing filler metal for brazing heterogeneous W-Cu alloys, a preparation method and a brazing method, and belongs to the technical field of heterogeneous material welding. Background technique [0002] W-Cu alloy combines the excellent properties of tungsten and copper, has good electrical and thermal conductivity and low thermal expansion coefficient, and is often used as a heat sink material in high-power devices. However, with the high heat generation rate caused by the continuous miniaturization, high integration and high power development of microwave semiconductor devices, it is difficult for the existing homogeneous W-Cu alloy to meet the heat dissipation performance requirements of electronic substrates. This problem can be well solved if two W-Cu alloys of different desired compositions are joined. Brazing, a solid-liquid phase joining method, is one of the preferred methods for joining dissimilar materials. The con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/40B23K1/19B23K1/20B23K1/008B23K103/12
CPCB23K1/008B23K1/19B23K1/206B23K35/302B23K35/40B23K2103/12
Inventor 夏春智许祥平邹家生周怡杨骏吴磊
Owner 无锡腾达海川新材料有限公司
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