Lithium molybdate nano-rod electronic packaging material

Abstract

The invention discloses a lithium molybdate nano-rod electronic packaging material, and belongs to the technical field of electronic packaging materials. The lithium molybdate nano-rod electronic packaging material comprises, by mass, 65-80% of lithium molybdate nano-rods, 8-12% of polyvinyl alcohol, 0.05-0.5% of sodium fatty alcohol polyoxyethylene ether carboxylate, 4-8% of aluminum isopropoxide, 4-8% of microcrystalline paraffin and 3-7% of water, the diameter of the lithium molybdate nano-rods is 50-100nm, and the length of the lithium molybdate nano-rods is 1-3[mu]m. The lithium molybdate nano-rod electronic packaging material has the characteristics of good insulation property, excellent ageing and corrosion resistance, high heat conduction coefficient, small heat expansion coefficient, good workability, simple preparation process and low preparation temperature, and has good application prospect in the field of electronic packaging materials.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging materials, and particularly relates to a lithium molybdate nanorod electronic packaging material. Background technique [0002] With the miniaturization, multi-function and high performance of electronic devices, the requirements for electronic packaging materials are getting higher and higher. As an ideal electronic packaging material, it is required to have the characteristics of small thermal expansion coefficient, high thermal conductivity, good insulation, excellent aging resistance and corrosion resistance, and easy processing. Improve the lifespan of electronic equipment and enhance the ability to adapt to the environment. [0003] The national invention patent "Ceramic Powder for Electronic Components Packaging Materials and Its Production Method" (National Invention Patent No.: ZL201210396718.8) contains barium oxide, boron oxide, silicon oxide, aluminum oxide, zinc oxide, z...

AI Technical Summary

Problems solved by technology

[0004] Although inorganic non-metallic electronic packaging materials have the characteristics of high strength, small thermal expansion coefficient, and good aging resistance, they have the disadvantages of difficult processing and high preparation temperature.

Polymer electronic packaging materials have the

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