Epoxy resin system and preparation method thereof

An epoxy resin system and epoxy resin technology, applied in the chemical and material fields, can solve the problems of reducing the manufacturing cost of the mold production industry, the overall cracking of the mold, and the easy occurrence of dry spots, so as to avoid mold cracking, and the curing degree is uniform and good. The effect of toughness

Active Publication Date: 2016-01-06
GUANGZHOU POCHELY NEW MATERIAL TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this type of product still has obvious deficiencies, such as: in order to meet the requirements of high temperature resistance during the use of the mold, the Tg of the cured product is increased, but this brings about a problem of greater brittleness; Insufficient low, and then there is the risk of cracking of the whole mold due to uneven curing; poor wettability of the resin system and reinforcing materials such as glass fiber cloth leads to defects such as dry spots and dry threads during the molding process of the mold; at the same time, the existing market The epoxy resin system used for mold making is still expensive, which is not conducive to reducing the manufacturing cost of the mold production industry

Method used

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  • Epoxy resin system and preparation method thereof
  • Epoxy resin system and preparation method thereof
  • Epoxy resin system and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0057] The preparation method of epoxy resin system described in embodiment 1 may further comprise the steps:

[0058] The bisphenol A type epoxy resin, hydantoin epoxy resin, o-cresol novolac type epoxy resin, and diluent are put into the reaction kettle according to the set mass ratio, and the vacuum pumping device is opened to set the vacuum degree to be 220-350mmHg, and at the same time Turn on the heating device to heat up to 50°C, stir with the mixer at a speed of 200R / min, mix for 2 hours, then add functional additives dropwise, then lower the temperature to 40-45°C, and drop the nano-modified ring at a uniform speed Oxygen resin, then continue to stir for 2 hours, filter, and discharge to obtain component A, with a viscosity of 1250mpa.s (25°C), an epoxy value of 0.71, and a light yellow transparent liquid;

[0059] Add the curing agent to the reaction kettle, vacuumize to 300-400mmHg, then close the vacuum equipment and keep the equipment sealed, start the mixer to st...

Embodiment 2

[0062] The preparation method of epoxy resin system described in embodiment 2 may further comprise the steps:

[0063] The bisphenol A type epoxy resin, hydantoin epoxy resin, o-cresol novolac type epoxy resin, and diluent are put into the reaction kettle according to the set mass ratio, and the vacuum pumping device is opened to set the vacuum degree to be 220-350mmHg, and at the same time Turn on the heating device to heat up to 45°C, stir with the mixer at a speed of 100R / min, mix for 1 hour, then add functional additives dropwise, then lower the temperature to 40-45°C, and drop the nano-modified ring at a uniform speed Oxygen resin, then continue to stir for 1 hour, filter, and discharge to obtain component A, with a viscosity of 1070mpa.s (25°C), an epoxy value of 0.75, and a colorless transparent liquid;

[0064] Add the curing agent to the reaction kettle, evacuate to 300-400mmHg, then close the vacuum equipment and keep the equipment sealed, start the mixer to stir at ...

Embodiment 3

[0067] The preparation method of epoxy resin system described in embodiment 3 may further comprise the steps:

[0068] The bisphenol A type epoxy resin, hydantoin epoxy resin, o-cresol novolac type epoxy resin, and diluent are put into the reaction kettle according to the set mass ratio, and the vacuum pumping device is opened to set the vacuum degree to be 220-350mmHg, and at the same time Turn on the heating device to heat up to 65°C, stir with the mixer at a speed of 300R / min, mix for 3 hours, then add functional additives dropwise, then lower the temperature to 40-45°C, and drop the nano-modified ring at a uniform speed Oxygen resin, then continue to stir for 3 hours, filter, and discharge to obtain component A with a viscosity of 900mpa.s (25°C) and an epoxy value of 0.54;

[0069] Add the curing agent to the reaction kettle, vacuumize to 300-400mmHg, then close the vacuum equipment and keep the equipment sealed, start the mixer to stir at a stirring speed of 200R / min, an...

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Abstract

The invention relates to an epoxy resin system and a preparation method thereof. The epoxy resin system comprises a component A and a component B, wherein the component A comprises 10-25% of nano modified epoxy resin, 40-65% of bisphenol A type epoxy resin, 5-15% of hydantoin epoxy resin, 0.5-6% of o-cresol formaldehyde type epoxy resin, 4-18% of diluent and 1-3% of a functional auxiliary; the component B comprises 80-90% of a curing agent, 5-15% of a curing agent modifying agent and 3-5% of auxiliaries. The epoxy resin system has low viscosity applicable to a vacuum pouring technology and also has high heat resistance and excellent mechanical properties through coordination of all the components, has good wettability on carbon fibers and glass fibers and can react rapidly at a low temperature for realizing a certain curing degree, and the curing degrees of all the parts are uniform; meanwhile, the requirement of a composite material mould on resin properties is met, and the cost is low.

Description

technical field [0001] The invention relates to the technical fields of chemical engineering and materials, in particular to an epoxy resin system and a preparation method thereof. Background technique [0002] The mold industry is an important field of high-tech industrialization. The level of mold technology has become an important symbol to measure the level of a country's manufacturing industry, and to a large extent determines product quality, production efficiency and new product development capabilities. With the improvement of product requirements, mold materials generally need to meet the requirements of high dimensional accuracy, good processing performance, high impact strength, and wear resistance. Although traditional metal materials can fully meet the requirements of the above-mentioned mold materials, the cost is relatively high, and the surface needs anti-rust treatment and maintenance. In addition, it is difficult to repair when the mold surface is damaged. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08K3/22C08G59/50
Inventor 覃遵胜
Owner GUANGZHOU POCHELY NEW MATERIAL TECH CO LTD
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