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Preparation process of ceramic base plate for high-power LED (light emitting diode) heat radiation

A ceramic substrate and preparation technology, which is applied in the field of ceramic substrates, can solve the problems of affecting the light emission of LED light-emitting chips, affecting the service life of LED lamps, and increasing the temperature of lamp cups, and achieves excellent heat resistance, high bending strength, and thermal conductivity. big effect

Inactive Publication Date: 2016-01-20
SUZHOU ZHIRUI PHOTOELECTRIC MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] LED lights mainly include LED chips and lamp cups. Usually, LED chips are formed by connecting LED light-emitting chips to the heat dissipation substrate in the form of gold wire, eutectic or flip chip, and then the LED chips are fixed on the circuit board of the system. The heat dissipation substrate plays the triple role of heat dissipation, conduction, and insulation. The existing heat dissipation substrates are mainly metal substrates, and the most common ones are copper substrates and aluminum substrates. The common feature of these two substrates is that they have good electrical conductivity. However, this The technology of connecting metal-like substrates to LED light-emitting chips has the disadvantages of poor heat dissipation and poor insulation
The heat dissipation performance directly affects the service life of the LED lamp, because the light generated by the LED light-emitting chip does not contain ultraviolet rays and infrared rays when it is working, so its light cannot take away heat, which means that most of the electric energy is converted into heat. Distributed around the chip, and the junction temperature of the LED light-emitting chip is generally between 60-75 ° C, the heat accumulated for a long time that has not been dissipated in time makes the temperature in the lamp cup continue to rise, which in turn affects the light emission of the LED light-emitting chip , affecting the service life of LED lights

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1) Preparation of composite sintering aid

[0024] Disperse 40 kg of silicon powder, 8 kg of aluminum powder, 22 kg of kaolin powder, and 30 kg of calcium fluoride in 200 kg of absolute ethanol, soak for 20 minutes; then stir in a fume hood while blowing with hot air until there is no water The ethanol is completely dried to obtain a mixed powder, which is a composite sintering aid;

[0025] 2) Preparation of ceramic slurry

[0026] Add 70 kg of flaky micro-crystal form high-temperature calcined α-alumina powder with an average particle size of 3.5 μm, 4 kg of melamine, 6 kg of hydroxymethyl cellulose, 10 kg of deionized water and the composite sintering aid prepared in step (1) in sequence 10 kilograms carry out wet ball milling, ball milling 2 hours, make gelatable ceramic slurry, this ceramic slurry is carried out vacuum stirring defoaming;

[0027] 3) Ceramic molding

[0028] Press the ceramic slurry prepared in step (2) into the mold from the bottom of the mold,...

Embodiment 2

[0030] 1) Preparation of composite sintering aid

[0031] Disperse 60 kg of silicon powder, 10 kg of aluminum powder, 20 kg of kaolin powder, and 10 kg of calcium fluoride in 300 kg of absolute ethanol, soak for 20 minutes; then stir in a fume hood while blowing with hot air until there is no water The ethanol is completely dried to obtain a mixed powder, which is a composite sintering aid;

[0032] 2) Preparation of ceramic slurry

[0033] Add 75 kilograms of high-temperature calcined α-alumina powder with an average particle size of 1.0 μm short columnar microscopic crystal form, 8 kilograms of melamine, 3 kilograms of hydroxymethylcellulose, 6 kilograms of deionized water and the composite sintering aid prepared in step (1) 8 kilograms carry out wet ball milling, and ball milling is 3 hours, makes gelatable ceramic slurry, and this ceramic slurry is carried out vacuum stirring defoaming;

[0034] 3) Ceramic molding

[0035] Press the ceramic slurry prepared in step (2) i...

Embodiment 3

[0037] 1) Preparation of composite sintering aid

[0038] Disperse 50 kg of silicon powder, 5 kg of aluminum powder, 30 kg of kaolin powder, and 15 kg of calcium fluoride in 250 kg of absolute ethanol, soak for 20 minutes; then stir in a fume hood while blowing with hot air until there is no water The ethanol is completely dried to obtain a mixed powder, which is a composite sintering aid;

[0039] 2) Preparation of ceramic slurry

[0040] Add 80 kilograms of flaky microcrystalline high-temperature calcined α-alumina powder with an average particle size of 4.0 μm, 3 kilograms of melamine, 4 kilograms of hydroxymethylcellulose, 8 kilograms of deionized water and the composite sintering aid prepared in step (1) 5 kilograms carry out wet ball milling, ball milling 4 hours, make gelatable ceramic slurry, this ceramic slurry is carried out vacuum stirring defoaming;

[0041] 3) Ceramic molding

[0042] Press the ceramic slurry prepared in step (2) into the mold from the bottom o...

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Abstract

The invention belongs to the technical field of a ceramic base plate, and particularly relates to a preparation process of a ceramic base plate for high-power LED (light emitting diode) heat radiation. The preparation process comprises the following steps of 1, preparing composite sintering auxiliary agents; 2, preparing ceramic slurry; 3, forming ceramics. The preparation process has the following beneficial effects that 1, the heat conduction coefficient of the ceramic base plate is great, the heat-resistant performance is excellent; the bending-resistant intensity is high, and phenomena such as bending and tilting are avoided; 2, a proper sintering method is used, and the proper sintering auxiliary agents are selected, so that the compactness of alumina ceramic sintering bodies is realized, and the heat conductivity of the alumina ceramics is greatly improved; 3, low-melting point phases can be formed by the sintering auxiliary agents, the liquid-phase sintering can be realized, the sintering temperature is lowered, and the blank compactness is promoted; 4, melamine in a recipe can produce aluminum nitride and carbonitride at high temperature, and the hardness and the lustrousness of the surface of the ceramic base plate are improved.

Description

technical field [0001] The invention belongs to the technical field of ceramic substrates, and in particular relates to a preparation process of a ceramic substrate for high-power LED heat dissipation. Background technique [0002] LED lights mainly include LED chips and lamp cups. Usually, LED chips are formed by connecting LED light-emitting chips to the heat dissipation substrate in the form of gold wire, eutectic or flip chip, and then the LED chips are fixed on the circuit board of the system. The heat dissipation substrate plays the triple role of heat dissipation, conduction and insulation. The existing heat dissipation substrates are mainly metal substrates, the most common ones are copper substrates and aluminum substrates. The common feature of these two substrates is that they have good electrical conductivity. However, this The technology of connecting metal-like substrates to LED light-emitting chips has the disadvantages of poor heat dissipation and poor insula...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/624C04B35/63
Inventor 左士祥张宇王永飞吕列超于楼云杨阳
Owner SUZHOU ZHIRUI PHOTOELECTRIC MATERIAL TECH CO LTD
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