High-reliability epoxy bottom filling glue and preparation method thereof

An underfill and reliability technology, applied in the direction of epoxy resin glue, adhesives, non-polymer adhesive additives, etc., can solve the problems of slow flow speed, unreachable reliability, and affecting production efficiency

Active Publication Date: 2016-02-03
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional underfills can flow at relatively low temperatures, and their reliability does not meet the requirements for resistance to 3 reflow soldering. If the reliability can meet the requirements, generally the filler content is relatively large, the viscosity is too high, the flow speed is slow, and the substrate needs Preheating to above 90°C wastes energy and affects production efficiency

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Weigh raw materials according to the following parts by mass

[0021] Epoxy resin YL983U30.0 parts

[0022] Epoxy resin SE-300P (SHIN-AT&C) 5.0 parts

[0023] 10.0 parts of p-phenyl tert-butyl glycidyl ether

[0024] ALBIDUREP2240A9.0 copies

[0025] Spherical silica powder FEB25A (10μm) 38.0 parts

[0026] Spherical silica powder SC5500 (1.5μm) 10.0 parts

[0027] Spherical silica powder SC1500 (0.3μm) 5.0 parts

[0028] Spherical silica powder YA050C (50nm) 2.0 parts

[0029] Dispers6101.0 copies

[0030] 0.5 parts of γ-(methacryloyloxy)propyltrimethoxysilane

[0031] UDH (hydrazide) 2.0 parts

[0032] Dicyandiamide 4.0 parts

[0033] FXR-10302.0 copies

[0034] First add liquid epoxy resin, reactive diluent, toughening agent, wetting and dispersing agent into the stirring container, stir for 30 minutes under vacuum at room temperature, then add spherical silica powder with different particle sizes, mix well and then place under vacuum Stir at high speed fo...

Embodiment 2

[0036] Weigh raw materials according to the following parts by mass

[0037] SE-55F (SHIN-AT&C) 40.0 parts

[0038] SE-300P (SHIN-AT&C) 5.0 parts

[0039] 5.0 parts of 1,6-hexanediol diglycidyl ether

[0040] ALBIFLEX2466.0 parts

[0041] Spherical silica powder FEB45A (10μm) 36.0 parts

[0042] Spherical silica powder SE5500 (1.5μm) 8.0 parts

[0043] Spherical silica powder SE1500 (0.3μm) 5.0 parts

[0044] Spherical silica powder YA050C (50nm) 3.0 parts

[0045] Dispers6300.8 copies

[0046] 0.6 parts of γ-glycidyl etheroxypropyl trimethoxysilane

[0047] VDH (hydrazide) 2.0 parts

[0048] Dicyandiamide 6.0 parts

[0049] PN-503.0 copies

[0050] First add liquid epoxy resin, reactive diluent, toughening agent, wetting and dispersing agent into the stirring container, stir for 30 minutes under vacuum at room temperature, then add spherical silica powder with different particle sizes, mix well and then place under vacuum Stir at high speed for 3 hours, and finally...

Embodiment 3

[0052] Weigh raw materials according to the following parts by mass

[0053] SE-55F (SHIN-AT&C) 42.0 parts

[0054] AFG-908.0 copies

[0055] Neopentyl glycol diglycidyl ether 5.0 parts

[0056] ALBIFLEX2966.0 parts

[0057] Spherical silica powder FEB25A (10μm) 32.0 parts

[0058] Spherical silica powder SE5500 (1.5μm) 6.0 parts

[0059] Spherical silica powder SE1030 (0.3μm) 5.0 parts

[0060] Spherical silica powder YA050C (50nm) 2.0 parts

[0061] Dispers6520.7 copies

[0062] 0.2 parts of γ-aminopropyltriethoxysilane

[0063] VDH-J (hydrazide) 2.0 parts

[0064] Dicyandiamide 9.0 parts

[0065] PN-403.0 copies

[0066] First add liquid epoxy resin, reactive diluent, toughening agent, wetting and dispersing agent into the stirring container, stir for 30 minutes under vacuum at room temperature, then add spherical silica powder with different particle sizes, mix well and then place under vacuum Stir at high speed for 3 hours, and finally add silane coupling agent, ...

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Abstract

A high-reliability bottom filling glue consists of the following raw materials in parts by weight: 30-50 parts of liquid epoxy resin, 1-10 parts of an active diluent, 1-10 parts of a toughening agent, 40-60 parts of spherical silica micropowder with different particle diameters, 4-8 parts of a curing agent, 1-3 parts of a curing catalyst, 0.1-1 part of a coupling agent and 0.1-2 parts of a wetting dispersant. The raw materials are added into a stirring container respectively, and are uniformly stirred in the vacuum state to be discharged so as to obtain the product. The prepared fast-flowing high-reliability epoxy bottom filling glue is relatively high in flowing speed, high in modulus and reliability, low in linear expansion coefficient and suitable for packaging of flip chips.

Description

technical field [0001] The invention relates to a high-reliability epoxy bottom filling glue and a preparation method thereof, belonging to the field of electronic adhesives. Background technique [0002] The underfill material is used after the interconnection of the flip chip is formed. Under the action of the capillary, the resin flows into the gap between the chip and the substrate, and then heats and solidifies to fill a large area of ​​the bottom gap of the flip chip to form a permanent composite material. , thereby reducing stress on solder joints and chips, and protecting chips and solder joints to prolong their service life. [0003] With the miniaturization, multi-function and high integration requirements of electronic products, higher requirements are put forward for the underfill glue used in electronic flip-chip packaging. Conventional underfills can flow at relatively low temperatures, and their reliability does not meet the requirements for resistance to 3 r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06
Inventor 白战争王建斌陈田安牛青山
Owner YANTAI DARBOND TECH
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