Preparation method for sample of aluminum-based graphene thermal conductive composite

A heat-conducting composite material and graphene technology, applied in the direction of coating, etc., to achieve the effects of improving non-compactness, rapid and effective preparation, and simplifying the preparation process

Active Publication Date: 2016-02-03
SUZHOU ALOME SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

There are currently methods for preparing graphene-reinforced aluminum matrix composites, but how to prepare

Method used

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  • Preparation method for sample of aluminum-based graphene thermal conductive composite

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Example Embodiment

[0027] Example 1

[0028] 1# Preparation of aluminum-based graphene thermally conductive composite material sample, see figure 1 :

[0029] Put 5g of graphene with a particle size of 10μm, 250g of pure aluminum powder with a particle size of 100μm and 1.25g of stearic acid into a planetary ball mill, grind at 400 rpm for 6 hours to obtain graphene-coated metal Particles; then take 250g of pure aluminum and heat it to 580°C to become semi-solid and stir, add all the graphene-coated metal particles, heat and stir for 2 hours, quickly heat up to 720°C to make the aluminum alloy liquid, and cast immediately, get 1# Aluminum-based graphene thermally conductive composite material sample. The thermal conductivity of the 1# aluminum-based graphene thermally conductive composite material sample is 250W / mK.

Example Embodiment

[0030] Example 2

[0031] 2# Preparation of aluminum-based graphene thermally conductive composite material sample:

[0032] This embodiment is basically the same as Embodiment 1, and the difference is that the mass of graphene is 0.5 g. The thermal conductivity of the 2# aluminum-based graphene thermally conductive composite material sample is 210W / mK.

Example Embodiment

[0033] Example 3

[0034] 3# Preparation of aluminum-based graphene thermally conductive composite material sample:

[0035] This embodiment is basically the same as Embodiment 1, and the difference is that the mass of the graphene is 15 g. The thermal conductivity of the 3# aluminum-based graphene thermally conductive composite material sample is 270W / mK.

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Abstract

The present invention provides a preparation method for a sample of aluminum-based graphene thermal conductive composite. The method comprises the following steps: (1) grinding the graphene and metal powder with a ball mill, mixing uniformly to form graphene-cladded metal particles; (2) heating the aluminum alloy in a protection furnace with argon therein into semi-solid state, preserving heat and starting stirring; (3) adding the graphene-cladded metal particles prepared in step (2) to the semi-solid aluminum alloy in step (2) and keeping stirring; and (4) after uniformly stirring, heating the semi-solid aluminum alloy into liquid, and casting to obtain a sample of aluminum-based graphene thermal conductive composite. In the sample, the graphene is 0.1-5 wt% of the total amount of the metal. The preparation method avoids the complexity of the powder sintering and nonwetting of the graphene and aluminum. By melting the metal particles into liquid metal with semi-solid viscous force and uniformly mixing the reinforcing phase by stirring, it is possible to prepare a large sample quickly and efficiently with graphene-enhanced aluminum composite in a large scale.

Description

technical field [0001] The invention relates to the field of metal-based composite materials, in particular to a method for preparing an aluminum-based graphene heat-conducting composite material sample. Background technique [0002] In recent years, in order to meet the development needs of electronic technology, the research of high thermal conductivity and low expansion metal matrix composites for thermal management has made great progress. Because aluminum and its alloys have small specific gravity, strong plasticity, excellent processing performance, and low price, they are good conductors of heat and are widely used in air-conditioning heat sinks, computer heat sinks, LED module heat sinks and other fields. However, with the development of electronic science and technology, the heat dissipation performance requirements of various heat dissipation devices are getting higher and higher. On the basis of satisfying easy processing and molding, their thermal physical proper...

Claims

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Application Information

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IPC IPC(8): C22C1/10C22C1/02C22C21/00B22F1/02
Inventor 徐文雷童伟陈名海姚争争李清文
Owner SUZHOU ALOME SCI & TECH
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