Electronic carrier tape special base paper with treated surface and manufacturing method thereof

A surface treatment and electronic technology, which is applied in the field of special base paper for electronic carrier tape and its preparation, to achieve the effects of easy handling, high bonding strength and low cost

Active Publication Date: 2016-03-16
JIANGXI JIEMEI ELECTRONICS INFORMATION MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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  • Electronic carrier tape special base paper with treated surface and manufacturing method thereof
  • Electronic carrier tape special base paper with treated surface and manufacturing method thereof
  • Electronic carrier tape special base paper with treated surface and manufacturing method thereof

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Embodiment 1

[0039] 1. Process

[0040] (1) Pulp ratio and additives: Considering the stiffness and interlayer adhesion of the electronic special paper tape, we choose a high proportion of softwood fiber with a low proportion of hardwood fiber, and use a combination of water and moisture resistance To ensure the bonding force between the base paper layers.

[0041] For example, the production of 0.60mm size base paper, softwood pulp 65%, hardwood pulp 35%; 0.40mm size base paper, softwood pulp 75%, hardwood pulp 25%; 0.75mm size base paper, softwood pulp 60%, broadleaf pulp Leaf pulp 20%, recycled waste paper 20%, etc.

[0042] (2) Beating control process: Beating determines the product performance of the base paper. In this process, we will strictly control the beating process, and formulate the corresponding beating treatment process for different production specifications to ensure the binding capacity and other properties of the pulp fiber The indicators meet the process requirements. For ...

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PUM

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Abstract

The invention discloses an electronic carrier tape special base paper with a treated surface and a manufacturing method thereof. The electronic carrier tape special base paper has two layers or more than two layers of papermaking structures. The paper is characterized in that the surface and back surface of the paper are coated with a layer of treating fluid containing a hot melting glue binding modifier, so tension for tearing the processed paper tape surface and a hot melting upper adhesive tape reaches 10 g to 70 g after hot melt adhesion, and peeling and fluffing would not occur when the hot melting upper adhesive tape is peeled. The treating fluid contains 1.5%-2.0% of polyvinyl alcohol, 1.5%-2.0% of polyacrylamide modifier, 0.7%-0.9% of acrylate copolymer, 0.02% of cyanoethyl chitosan, and 0.50%-0.80% of hot melting glue binding modifier. The tension for tearing the processed paper tape surface and the hot melting upper adhesive tape reaches 10 g to 70 g after hot melt adhesion, and peeling and fluffing would not occur when the hot melting upper adhesive tape is peeled. The electronic carrier tape special base paper satisfies requirements in industries.

Description

Technical field [0001] The invention belongs to the technical field of electronic information materials, and particularly relates to a surface-treated special base paper for electronic carrier tape used for chip electronic component packaging in the field of microelectronics technology and a preparation method thereof. Background technique [0002] With the development of miniaturization of electrical appliances, the requirements for miniaturization of electronic components are getting higher and higher. When the size is larger, the use of plastic carrier tape is acceptable, but when the size is smaller, the production of plastic carrier tape is very difficult. It is difficult to guarantee the dimensional accuracy, especially when the chamfers around the hole are difficult to eliminate, which is particularly obvious when the size is small. It is especially important that the static electricity of plastic products is difficult to eliminate, which brings difficulties to the access p...

Claims

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Application Information

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IPC IPC(8): D21F11/04D21F5/04D21F5/06D21D1/20D21D1/02D21H15/10D21H11/14D21H11/12D21H21/16D21H19/20D21H19/24D21H19/30
CPCD21D1/02D21D1/20D21F5/04D21F5/06D21F11/04D21H11/12D21H11/14D21H15/10D21H19/22D21H19/24D21H19/30D21H21/16
Inventor 姜兆宏
Owner JIANGXI JIEMEI ELECTRONICS INFORMATION MATERIAL CO LTD
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