Electronic carrier tape special base paper with treated surface and manufacturing method thereof

Abstract

The invention discloses an electronic carrier tape special base paper with a treated surface and a manufacturing method thereof. The electronic carrier tape special base paper has two layers or more than two layers of papermaking structures. The paper is characterized in that the surface and back surface of the paper are coated with a layer of treating fluid containing a hot melting glue binding modifier, so tension for tearing the processed paper tape surface and a hot melting upper adhesive tape reaches 10 g to 70 g after hot melt adhesion, and peeling and fluffing would not occur when the hot melting upper adhesive tape is peeled. The treating fluid contains 1.5%-2.0% of polyvinyl alcohol, 1.5%-2.0% of polyacrylamide modifier, 0.7%-0.9% of acrylate copolymer, 0.02% of cyanoethyl chitosan, and 0.50%-0.80% of hot melting glue binding modifier. The tension for tearing the processed paper tape surface and the hot melting upper adhesive tape reaches 10 g to 70 g after hot melt adhesion, and peeling and fluffing would not occur when the hot melting upper adhesive tape is peeled. The electronic carrier tape special base paper satisfies requirements in industries.

Description

Technical field

[0001] The invention belongs to the technical field of electronic information materials, and particularly relates to a surface-treated special base paper for electronic carrier tape used for chip electronic component packaging in the field of microelectronics technology and a preparation method thereof. Background technique

[0002] With the development of miniaturization of electrical appliances, the requirements for miniaturization of electronic components are getting higher and higher. When the size is larger, the use of plastic carrier tape is acceptable, but when the size is smaller, the production of plastic carrier tape is very difficult. It is difficult to guarantee the dimensional accuracy, especially when the chamfers around the hole are difficult to eliminate, which is particularly obvious when the size is small. It is especially important that the static electricity of plastic products is difficult to eliminate, which brings difficulties to the access p...

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