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Trifluoropropyl-group-modification methyl phenyl vinyl silicon resin and LED packaging adhesive

A technology based on methylphenylethylene and trifluoropropyl, which is applied in the field of materials, can solve the problems of poor anti-vulcanization performance, thermal stability that cannot meet the needs of medium and high power LEDs, and obvious light decay.

Active Publication Date: 2016-03-23
GUANGDONG HENGDA NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Epoxy resin has poor high-temperature stability and UV stability, and the LED has a large light decay after long-term lighting. Silicone materials have excellent thermal stability, but poor adhesion, high moisture and oxygen permeability, and reduced weather resistance of LEDs. The anti-vulcanization performance is not good, and the light decay is obvious after long-term use
[0004] Chinese patent CN1837284A discloses an epoxy-organosilicon mixture resin composition and its manufacturing method / and a light-emitting semiconductor device. The combination is actually an epoxy-modified organosilicon material, which takes the balance between organosilicon and epoxy , in comparison, the thermal stability of the composition is better than that of epoxy resin, the adhesive force is better than that of silicone material, and the moisture and oxygen permeability rate is lower than that of silicone material, but its thermal stability still cannot meet the requirements of medium and high power LEDs. Demand, long-term use of its light attenuation is still very large

Method used

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  • Trifluoropropyl-group-modification methyl phenyl vinyl silicon resin and LED packaging adhesive
  • Trifluoropropyl-group-modification methyl phenyl vinyl silicon resin and LED packaging adhesive
  • Trifluoropropyl-group-modification methyl phenyl vinyl silicon resin and LED packaging adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Example 1 Preparation of Trifluoropropyl Modified Methylphenyl Vinyl Silicone Resin

[0058] Trifluoropropyl modified methylphenyl vinyl silicone resin and preparation method thereof:

[0059] (1) 58.0g (0.426mol) methyltrimethoxysilane, 28.6g (0.238mol) dimethyldimethoxysilane, 145.0g (0.531mol) phenyltrimethoxysilane, 103.6g (0.424mol) ) diphenyldimethoxysilane, 11.5g (0.0443mol) trifluoropropyltriethoxysilane, 300g toluene, 2.3g hydrochloric acid with a concentration of 0.2mol / L, and 48.2g water were mixed uniformly and placed at 56°C Hydrolysis 2h;

[0060] (2) Add 30.0 g (0.161 mol) of vinyl double caps to the reaction solution in step (1), and condense at 85°C for 5 hours;

[0061] (3) Wash the reaction solution of step (2) with deionized water for 5 times, and remove low boilers at 120° C. for 2 hours under a vacuum of 0.096 mPa to obtain 236 g of trifluoropropyl-modified methylphenyl vinyl silicone resin .

[0062] The silicone resin has a viscosity of 19600...

Embodiment 2

[0063] Example 2 Preparation of Trifluoropropyl Modified Methylphenyl Vinyl Silicone Resin

[0064] (1) 55.0g (0.309mol) methyltriethoxysilane, 46.8g (0.316mol) dimethyldiethoxysilane, 559.2g (2.824mol) phenyltrimethoxysilane, 53.2g (0.218 mol) diphenyldimethoxysilane, 27.82g (0.107mol) trifluoropropyl triethoxysilane, 1000g xylene, 5.6g concentration of 0.1mol / L sodium hydroxide solution, 102g water after mixing uniformly, in Hydrolysis at 85°C for 7 hours;

[0065] (2) Add 72.9 g (0.391 mol) of vinyl double-caps to the reaction liquid in step (1), and condense at 125 ° C for 5 h;

[0066] (3) Wash the reaction solution in step (2) with deionized water for 5 times, and remove low boilers at 160°C for 5.5 hours under a vacuum of 0.096mPa to obtain a trifluoropropyl-modified methylphenylvinyl silicone resin 253g.

[0067] The resin has a viscosity of 260000mPaS and a refractive index of 1.542.

Embodiment 3

[0068] Example 3 Preparation of Trifluoropropyl Modified Methylphenyl Vinyl Silicone Resin

[0069] (1) 93.6g (0.526mol) methyltriethoxysilane, 74.6g (0.41mol) methylphenyldimethoxysilane, 121.4g (0.613mol) phenyltrimethoxysilane, 87.8g ( 0.36mol) diphenyldimethoxysilane, 31.2g (0.12mol) trifluoropropyltriethoxysilane, 300g toluene, 3.8g dilute sulfuric acid with a concentration of 0.1mol / L, and 56.8g water were mixed uniformly, at 75 Hydrolysis at ℃ for 3.5h;

[0070] (2) Add 20.88 g (0.112 mol) of vinyl double-caps to the reaction liquid in step (1), and condense at 105 ° C for 3 h;

[0071] (3) Wash the reaction solution of step (2) with deionized water for 5 times, and remove low boilers at 150° C. for 3 hours under a vacuum of 0.096 mPa to obtain 240 g of trifluoropropyl modified methylphenyl vinyl silicone resin .

[0072] The resin has a viscosity of 31600 mPaS and a refractive index of 1.562.

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Abstract

The invention relates to a trifluoropropyl-group-modification methyl phenyl vinyl silicon resin. The general molecular formula of the trifluoropropyl-group-modification methyl phenyl vinyl silicon resin is (R13SiO0.5)a(R12SiO)b(R1SiO1.5)c, wherein R1 is Me, Vinyl, Ph and CF3CH2CH2-, the resin contains Me, Vinyl, Ph and CF3CH2CH2- at the same time and at least contains two pieces of Vinyl, and a, b and c are integers larger than 0. As a trifluoropropyl group is introduced into the structure, the heat stability of a modification material is improved, and the defect that an existing epoxy modification organosilicon material is poor in heat stability is effectively overcome; after LED packaging adhesive containing the silicon resin is mixed, heated and cured, colloid is high in bonding strength, good in heat stability and low in moisture permeability and oxygen permeability, and photoelectric attenuation caused by vulcanization can be effectively reduced.

Description

technical field [0001] The invention relates to the technical field of materials, in particular to trifluoropropyl modified methylphenyl vinyl silicone resin and LED encapsulation glue. Background technique [0002] The packaging materials of light-emitting diodes (LEDs) mainly include epoxy resins, organic silicon materials, and epoxy-modified organic silicon materials. [0003] Epoxy resin has poor high-temperature stability and UV stability, and the LED has a large light decay after long-term lighting. Silicone materials have excellent thermal stability, but poor adhesion, high moisture and oxygen permeability, and reduced weather resistance of LEDs. The anti-vulcanization performance is not good, and the light decay is obvious after long-term use. [0004] Chinese patent CN1837284A discloses an epoxy-organosilicon mixture resin composition and its manufacturing method / and a light-emitting semiconductor device. The combination is actually an epoxy-modified organosilicon ...

Claims

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Application Information

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IPC IPC(8): C08G77/24C08G77/20C09J183/08C09J183/07C09J183/05C09J183/06C09J11/06H01L33/56
CPCC08G77/20C08G77/24C08L2201/08C08L2203/206C08L2205/025C08L2205/035C09J11/06C09J183/04C09J183/08H01L33/56C08L83/08C08L83/04C08L83/06
Inventor 黎松关怀龙正宇周为民
Owner GUANGDONG HENGDA NEW MATERIALS TECH
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