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A kind of mems device and its preparation method, electronic device

A device and confinement layer technology, which is applied in the field of MEMS devices and its preparation, can solve the problems of destroying the structure of the oscillating film, affecting the movement of the device, and breaking the oscillating film, so as to reduce the cracking phenomenon, improve the life and reliability, and improve the yield. Effect

Active Publication Date: 2018-08-21
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the field of MEMS, the working principle of the MEMS device is that the movement of the oscillating membrane (Membrane) produces a change in capacitance, and the calculation and work are performed using the amount of capacitance change, but the stress of the oscillating membrane (Stress) faces a big challenge , the stress (Stress) of the oscillating membrane (Membrane) in the MEMS device (such as a miniature mobile phone, MicroPhone) will affect the movement of the device (Device) and the induction of the capacitance change. The stress release phenomenon produced by (Release) will destroy the structure of the shock membrane (Membrane), causing the shock membrane (Membrane) to rupture, such as Figure 1h shown, causing the device to fail

Method used

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  • A kind of mems device and its preparation method, electronic device
  • A kind of mems device and its preparation method, electronic device
  • A kind of mems device and its preparation method, electronic device

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Embodiment 1

[0059] In order to solve the problems existing in the prior art, the present invention provides a kind of preparation method of MEMS device, below in conjunction with attached Figure 2a-2h The method is described further.

[0060] First, step 201 is performed to provide a substrate 201 and form a first sacrificial material layer 202 on the substrate 201 .

[0061] Specifically, such as Figure 2a As shown, wherein the base 201 includes at least a semiconductor substrate, and the semiconductor substrate may be at least one of the materials mentioned below: silicon, silicon-on-insulator (SOI), silicon-on-insulator (SSOI), Silicon germanium on insulator (S-SiGeOI), silicon germanium on insulator (SiGeOI) and germanium on insulator (GeOI) are laminated. Active regions may be defined on the semiconductor substrate.

[0062] A first sacrificial material layer 202 is deposited on the substrate, wherein the first sacrificial material layer 202 can be selected to have a relatively ...

Embodiment 2

[0110] The present invention also provides a MEMS device, such as Figure 2h As shown, the MEMS device includes:

[0111] a stack of vibrating membranes, the stack of vibrating membranes comprising a first vibrating membrane and a second vibrating membrane positioned above the first vibrating membrane;

[0112] The fixed plate 206, including several parts spaced apart from each other, is located above the vibrating film stack;

[0113] The cavity is located between the stack of vibrating membranes and the fixed plate 206 .

[0114] Optionally, the first oscillating film and the second oscillating film are made of the same material.

[0115] The first oscillating film and the second oscillating film are made of polysilicon.

[0116] The MEMS device further includes a barrier located at the top of the cavity, above the stack of oscillating membranes.

[0117] The MEMS device further includes a sensing opening located under the oscillating membrane stack for realizing pressur...

Embodiment 3

[0120] The present invention also provides an electronic device, including the MEMS device described in Embodiment 2. Wherein, the semiconductor device is the MEMS device described in Example 2, or the MEMS device obtained according to the preparation method described in Example 1.

[0121] The electronic device of this embodiment can be any electronic product or equipment such as mobile phone, tablet computer, notebook computer, netbook, game console, TV set, VCD, DVD, navigator, camera, video recorder, voice recorder, MP3, MP4, PSP, etc. , can also be any intermediate product including the MEMS device. The electronic device of the embodiment of the present invention has better performance due to the use of the above-mentioned MEMS device.

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Abstract

The invention relates to an MEMS device, a preparation method thereof and an electronic device. The preparation method comprises following steps: S1: a substrate is provided and a first sacrificial material layer is formed on the substrate; S2: a first membrane material layer is formed on the first sacrificial material layer to cover the first sacrificial material layer; S3: a second membrane material layer is formed on the first membrane material layer to cover the first membrane material layer; and S4: the first membrane material layer and the second membrane material layer are patterned to form a membrane lamination layer. The MEMS device and the preparation method thereof have following advantages: (1) the occurrence of membrane crack due to stress is reduced and yield is increased; (2) the structure of a membrane is stabilized so that the service life of the MEMS is prolonged and reliability of the MEMS device is increased.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular, the invention relates to a MEMS device, a preparation method thereof, and an electronic device. Background technique [0002] With the continuous development of semiconductor technology, in the market of sensor (motion sensor) products, smart phones, integrated CMOS and micro-electromechanical system (MEMS) devices have increasingly become the most mainstream and advanced technology, and with the update of technology, The development direction of this kind of transmission sensor products is smaller size, high-quality electrical performance and lower loss. [0003] Among them, MEMS sensors are widely used in automotive electronics: such as TPMS, engine oil pressure sensor, air pressure sensor of automobile brake system, automobile engine intake manifold pressure sensor (TMAP), common rail pressure sensor of diesel engine; consumer electronics: such as tire pressure gauge , sphygmomano...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/02B81C1/00
Inventor 郑超刘炼李卫刚
Owner SEMICON MFG INT (SHANGHAI) CORP
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