A low-temperature glass brazing method assisted by anodic oxidation
A low-temperature glass, anodizing technology, applied in anodizing, welding equipment, manufacturing tools, etc., can solve the problems of high viscosity of molten glass solder, cumbersome solder paste configuration process, poor chemical compatibility of solder, etc., to reduce costs. and the complexity of the brazing process, good protection, and the effect of improving joint strength and air tightness
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specific Embodiment approach 1
[0019] Specific Embodiment 1: The low-temperature glass brazing method assisted by anodic oxidation in this embodiment is carried out according to the following steps:
[0020] 1. Put the low-temperature sealing glass powder into the graphite mold, place it in a resistance furnace, and heat it to 600-700°C at a heating rate of 10-15°C / min under nitrogen protection, keep it warm for 30-60min and then cool it with the furnace. Then keep it warm for 30-40 minutes at a temperature of 400-500°C, and cool to room temperature to obtain a low-temperature sealed glass block;
[0021] 2. Cut the low-temperature sealing glass block obtained in step 1 into thin slices by using an inner circle cutting machine to obtain sheet-like low-temperature glass solder, and then use cutting equipment to cut the base material to be welded into shape to obtain weldments;
[0022] 3. Use water sandpaper to mechanically grind the weldment obtained in step 2, then place the polished weldment in pickling s...
specific Embodiment approach 2
[0026] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the low-temperature sealing glass frit described in step one consists of 65 parts by mass of B 2 o 3 , 20 copies of P 2 o 5 , 12 parts of ZnO, 0.3 parts of A1 2 o 3 , 0.2 parts of SiO 2 and 0.3 part of Li 2 O composition. Other steps and parameters are the same as those in Embodiment 1.
[0027] In this embodiment, the low-temperature sealing glass powder is lead-free sealing glass powder, the sealing temperature is between 460-530°C, and the linear expansion coefficient is 80-150×10 -7 / °C, the viscosity when sealing is less than 10 5 Pa·s.
specific Embodiment approach 3
[0028] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the particle size of the low-temperature sealing glass frit described in step 1 is 30-80 μm. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.
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