Low-temperature thick film circuit paste and preparation method therefor

A thick-film circuit and paste technology, which is used in the manufacture of circuits, cables/conductors, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of low sintering temperature, short sintering time, and good solderability. Achieve low sintering temperature, short sintering time and good weldability

Active Publication Date: 2016-04-06
DONGGUAN ZUOYOU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are various circuit paste products in the prior art; however, for the existing circuit paste products, it is difficult to have

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Embodiment 1, a low-temperature thick-film circuit paste, including the following materials by mass, specifically:

[0057] Inorganic binder phase 4%

[0058] Organic solvent carrier 20%

[0059] High-purity silver powder 76%;

[0060] Wherein, the inorganic bonding phase includes the following materials by mass, specifically:

[0061] Bi 2 o 3 50%

[0062] B 2 o 3 30%

[0063] ZnO18%

[0064] CuO2%;

[0065] The organic solvent carrier includes the following materials by mass, specifically:

[0066] Main solvent 90%

[0067] Thickener 7%

[0068] Leveling agent 1%

[0069] Thixotropic agent 1%

[0070] Defoamer 1%;

[0071] Among them, the main solvent in the organic solvent carrier is butyl carbitol, dimethyl adipate or triethylene glycol diacetate, the thickener is polyacrylamide or polyvinyl alcohol, and the leveling agent is fluorine-modified Acrylic acid leveling agent or phosphorus modified acrylic leveling agent, thixotropic agent is polyamide wax ...

Embodiment 2

[0073] Embodiment 2, a low-temperature thick-film circuit paste, including the following materials by mass, specifically:

[0074] Inorganic binder phase 5%

[0075] Organic solvent carrier 10%

[0076] 85% high-purity silver powder;

[0077] Wherein, the inorganic bonding phase includes the following materials by mass, specifically:

[0078] Bi 2 o 3 40%

[0079] B 2 o 3 40%

[0080] ZnO18%

[0081] CuO2%;

[0082] The organic solvent carrier includes the following materials by mass, specifically:

[0083] Main solvent 85%

[0084] Thickener 10%

[0085] Leveling agent 4%

[0086] Thixotropic agent 0.5%

[0087] 0.5% defoamer;

[0088] Among them, the main solvent in the organic solvent carrier is butyl carbitol, dimethyl adipate or triethylene glycol diacetate, the thickener is polyacrylamide or polyvinyl alcohol, and the leveling agent is fluorine-modified Acrylic acid leveling agent or phosphorus modified acrylic leveling agent, thixotropic agent is polyami...

Embodiment 3

[0090] Embodiment 3, a low-temperature thick-film circuit paste, including the following materials by mass, specifically:

[0091] Inorganic binder phase 5%

[0092] Organic solvent carrier 30%

[0093] High-purity silver powder 65%;

[0094] Wherein, the inorganic bonding phase includes the following materials by mass, specifically:

[0095] Bi 2 o 3 60%

[0096] B 2 o 3 20%

[0097] ZnO19%

[0098] CuO1%;

[0099] The organic solvent carrier includes the following materials by mass, specifically:

[0100] Main solvent 90%

[0101] Thickener 7%

[0102] Leveling agent 1%

[0103] Thixotropic agent 1%

[0104] Defoamer 1%;

[0105] Among them, the main solvent in the organic solvent carrier is butyl carbitol, dimethyl adipate or triethylene glycol diacetate, the thickener is polyacrylamide or polyvinyl alcohol, and the leveling agent is fluorine-modified Acrylic acid leveling agent or phosphorus modified acrylic leveling agent, thixotropic agent is polyamide wa...

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Abstract

The present invention discloses low-temperature thick film circuit paste and a preparation method therefor. The low-temperature thick film circuit paste comprises, in percentage by mass, 1%-5% of an inorganic adhesive phase, 10%-30% of an organic solvent carrier, and 65%-85% of high-purity silver powder; the inorganic adhesive phase comprises, in percentage by mass, 40%-60% of Bi2O3, 20%-40% of B2O3, 15%-20% of ZnO, and 0.5%-2.5% of CuO; and the organic solvent carrier comprises, in percentage by mass, 85%-90% of a main solvent, 5%-10% of a thickening agent, 1%-5% of a leveling agent, 0.5%-1.5% of a thixotropic agent, and 0.5%-1% of a defoaming agent; The low-temperature thick film circuit paste is low in sintering temperature, short in sintering time, low in resistance value, good in adhesion and good in solderability. The preparation method sequentially comprises the process steps of: preparing the inorganic adhesive phase; preparing the organic solvent carrier; and preparing the low-temperature thick film circuit paste. The preparation method can effectively prepare the low-temperature thick film circuit paste.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a low-temperature thick-film circuit paste and a preparation method thereof. Background technique [0002] Circuit paste is the basic material for the manufacture of thick film components. It is a paste made of solid powder and organic solvents that are uniformly mixed by three-roll rolling (reminiscent of toothpaste, paint, etc.); among them, according to different uses, Circuit paste can be divided into dielectric paste, resistance paste and conductor paste: according to different substrate types, circuit paste can be divided into ceramic substrate, polymer substrate, glass substrate, metal insulating substrate circuit According to different sintering temperatures, circuit paste can be divided into high temperature, medium and low temperature drying circuit paste; according to different uses, circuit paste can be divided into general circuit paste (making general t...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 张念柏苏冠贤
Owner DONGGUAN ZUOYOU ELECTRONICS TECH CO LTD
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