A kind of preparation method of the crystallizer copper plate coated with nickel-iron alloy layer

Abstract

The invention discloses a preparation method of a crystallizer copper plate plated with a ferro-nickel alloy layer. The crystallizer copper plate comprises the following components in percentage by mass: 1-2% of Ni, 0.05-0.2% of Be, 0.5-0.7% of Al, 3.0-5.0% of Zr, 1.2-1.4% of Mn, 1-3% of Mg, 0.8-1.2% of Cr, 14.0-16.0% of Zn, and the balance of Cu. The preparation method comprises the following steps: a copper alloy with the components is adopted to prepare a crystallizer; a plating layer is electroplated on the surface of the crystallizer; plating solution adopted by electroplating comprises the following components: 220-240 g / l of nickel sulfate, 17-19 g / l of nickel chloride, 11.0-13.0 g / l of ferric sulfate, 23-27 g / l of boric acid, 5-7 g / l of nickel chloride, 30-40 g / l of sodium chloride, 0.2-0.4 g / l of lauryl sodium sulfate, and 20-22 ml / L of additive, wherein solution prepared by adding 10-12 g of sodium gluconate, 33-37 g of ascorbic acid and 22-26 g of dextrin in 1 l of water is added; and the electroplating process has the following conditions: the PH value is 2.3-3.5; the current density is 3.5-4.5 A / dm2; the temperature is 44-46 DEG C; and the electroplating is performed until the thickness of the plating layer is 1.3-1.5 mm.

Description

technical field

[0001] The invention relates to the technical field of electroplating, in particular to a method for preparing a crystallizer copper plate coated with a nickel-iron alloy layer. Background technique

[0002] The mold copper plate is an important part of the continuous casting machine. The molten steel flows through the mold of the continuous casting machine and is cooled to form a billet. In the continuous casting and drawing production process, the surface of the billet and the copper plate are in contact with each other to cause friction, and the surface of the copper plate is worn. Usually, a layer of material with good thermal conductivity and wear resistance is plated on the surface by functional electroplating technology to achieve lightening of the surface of the copper plate. The purpose of reducing wear, increasing the number of copper plate repairs, and prolonging the service life of the copper plate. With the development of continuous casting tech...

Examples

Embodiment 1

[0012] A method for preparing a crystallizer copper plate coated with a nickel-iron alloy layer, the composition of the crystallizer copper plate is: Ni: 1%; Be: 0.2%; Al: 0.5%, Zr: 5.0%; Mn: 1.2%; Mg: 3%; Cr: 0.8%; Zn: 16.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer. The plating bath that described electroplating adopts consists of: nickel sulfate 220g / l, nickel chloride 19g / l, ferric sulfate 11.0g / l, boric acid 27g / l, potassium sulfate 5g / l, sodium chloride 40g / l, twelve Sodium alkyl sulphate 0.2g / l, additive 22ml / L, wherein adding is to adopt 10g sodium gluconate, 37g ascorbic acid and 22g dextrin add the solution prepared in 1l water, described process condition is: pH value 2.3-3.5, current density 3.5A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.3mm.

Embodiment 2

[0014] A method for preparing a crystallizer copper plate coated with a nickel-iron alloy layer, the composition of the crystallizer copper plate is: Ni: 2%; Be: 0.05%; Al: 0.7%, Zr: 3.0%; Mn: 1.4%; Mg: 1%; Cr: 1.2%; Zn: 14.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer. The plating solution that described electroplating adopts consists of: nickel sulfate 240g / l, nickel chloride 17g / l, ferric sulfate 13.0g / l, boric acid 23g / l, potassium sulfate 7g / l, sodium chloride 30g / l, twelve Alkyl sodium sulphate 0.4g / l, additive 20ml / L, wherein adding is to adopt 12g sodium gluconate, 33g ascorbic acid and 26g dextrin to add the solution prepared in 1l water, described process condition is: pH value 2.3-3.5, current density 4.5A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.5mm.

Embodiment 3

[0016] A method for preparing a crystallizer copper plate coated with a nickel-iron alloy layer, the composition of the crystallizer copper plate is: Ni: 1.5%; Be: 0.12%; Al: 0.6%, Zr: 4.0%; Mn: 1.3%; Mg: 2.0%; Cr: 1.0%; Zn: 15.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer. The plating solution that described electroplating adopts consists of: nickel sulfate 230g / l, nickel chloride 18g / l, ferric sulfate 12.0g / l, boric acid 24g / l, potassium sulfate 6g / l, sodium chloride 35g / l, twelve Sodium alkyl sulphate 0.3g / l, additive 21ml / L, wherein adding is to adopt 11g sodium gluconate, 34g ascorbic acid and 24g dextrin to add the solution prepared in 1l water, described technological condition is: pH value 2.3-3.5, current density 4A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.4mm.

technical field

[0001] The invention relates to the technical field of electroplating, in particular to a method for preparing a crystallizer copper plate coated with a nickel-iron alloy layer. Background technique

[0002] The mold copper plate is an important part of the continuous casting machine. The molten steel flows through the mold of the continuous casting machine and is cooled to form a billet. In the continuous casting and drawing production process, the surface of the billet and the copper plate are in contact with each other to cause friction, and the surface of the copper plate is worn. Usually, a layer of material with good thermal conductivity and wear resistance is plated on the surface by functional electroplating technology to achieve lightening of the surface of the copper plate. The purpose of reducing wear, increasing the number of copper plate repairs, and prolonging the service life of the copper plate. With the development of continuous casting tech...

Examples

Embodiment 1

[0012] A method for preparing a crystallizer copper plate coated with a nickel-iron alloy layer, the composition of the crystallizer copper plate is: Ni: 1%; Be: 0.2%; Al: 0.5%, Zr: 5.0%; Mn: 1.2%; Mg: 3%; Cr: 0.8%; Zn: 16.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer. The plating bath that described electroplating adopts consists of: nickel sulfate 220g / l, nickel chloride 19g / l, ferric sulfate 11.0g / l, boric acid 27g / l, potassium sulfate 5g / l, sodium chloride 40g / l, twelve Sodium alkyl sulphate 0.2g / l, additive 22ml / L, wherein adding is to adopt 10g sodium gluconate, 37g ascorbic acid and 22g dextrin add the solution prepared in 1l water, described process condition is: pH value 2.3-3.5, current density 3.5A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.3mm.

Embodiment 2

[0014] A method for preparing a crystallizer copper plate coated with a nickel-iron alloy layer, the composition of the crystallizer copper plate is: Ni: 2%; Be: 0.05%; Al: 0.7%, Zr: 3.0%; Mn: 1.4%; Mg: 1%; Cr: 1.2%; Zn: 14.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer. The plating solution that described electroplating adopts consists of: nickel sulfate 240g / l, nickel chloride 17g / l, ferric sulfate 13.0g / l, boric acid 23g / l, potassium sulfate 7g / l, sodium chloride 30g / l, twelve Alkyl sodium sulphate 0.4g / l, additive 20ml / L, wherein adding is to adopt 12g sodium gluconate, 33g ascorbic acid and 26g dextrin to add the solution prepared in 1l water, described process condition is: pH value 2.3-3.5, current density 4.5A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.5mm.

Embodiment 3

[0016] A method for preparing a crystallizer copper plate coated with a nickel-iron alloy layer, the composition of the crystallizer copper plate is: Ni: 1.5%; Be: 0.12%; Al: 0.6%, Zr: 4.0%; Mn: 1.3%; Mg: 2.0%; Cr: 1.0%; Zn: 15.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer. The plating solution that described electroplating adopts consists of: nickel sulfate 230g / l, nickel chloride 18g / l, ferric sulfate 12.0g / l, boric acid 24g / l, potassium sulfate 6g / l, sodium chloride 35g / l, twelve Sodium alkyl sulphate 0.3g / l, additive 21ml / L, wherein adding is to adopt 11g sodium gluconate, 34g ascorbic acid and 24g dextrin to add the solution prepared in 1l water, described technological condition is: pH value 2.3-3.5, current density 4A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.4mm.