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A kind of preparation method of surface alloyed copper material with high performance

A surface alloying and high-performance technology, applied in the field of surface treatment, can solve the problems of complex process and large investment in plasma spraying process equipment, and achieve the effect of simple process, avoiding crystal structure defects and shortening the process flow.

Active Publication Date: 2017-12-15
NANJING TECH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the plasma spraying process equipment used in these copper surface alloying methods has a large investment and complicated process.

Method used

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  • A kind of preparation method of surface alloyed copper material with high performance
  • A kind of preparation method of surface alloyed copper material with high performance
  • A kind of preparation method of surface alloyed copper material with high performance

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preparation example Construction

[0027] Adopt following method to process in the preparation method of the present invention:

[0028] (1) Grinding and polishing the pure copper substrate until the mirror surface is bright, and then performing alkali cleaning and acid cleaning for activation.

[0029] (2) Connect the circuit, turn on the DC power supply, connect the positive and negative electrodes, and immerse in the electrolyte A to electroplate nickel.

[0030] (3) After the electroplated material is washed with distilled water, the positive and negative electrodes are connected and immersed in electrolyte B to electroplate manganese.

[0031] (4) Put the electroplated sample into a tubular atmosphere furnace for heat treatment. After the heat treatment, a copper material with a copper-nickel-manganese alloy surface layer with a thickness of 40-75 μm is obtained.

[0032] The anode material in electrolyte A is pure nickel; the cathode is pure copper. The anode material in electrolyte B is graphite; the c...

Embodiment 1

[0035] The cathode and anode electrodes are sequentially polished, degreased by alkali washing, activated by pickling, and then immersed in the electrolyte for electrolysis. NiSO in electrolyte A 4 、NiCl 2 、HBO 3The mass ratio is 6:1:1, the concentration of nickel sulfate is 200g / L, and the deposition current density is 1A / dm 2 , the deposition temperature was 40°C, and the deposition time was 20 min. MnSO in electrolyte B 4 , (NH 4 ) 2 SO 4 The mass ratio is 1:1, the concentration of manganese sulfate is 75g / L, and the deposition current density is 4A / dm 2 , the deposition temperature is 20°C, and the deposition time is 20 min. Put the electroplated sample into the tubular atmosphere furnace, replace the air in the system with argon in advance, then raise the temperature at a rate of 2°C / min, heat treatment at 800°C for 1 hour, and maintain the flow rate of argon at 70mL / min throughout the process. min. The crystal structure of the material after heat treatment is a...

Embodiment 2

[0037] The cathode and anode electrodes are sequentially polished, degreased by alkali washing, activated by pickling, and then immersed in the electrolyte for electrolysis. NiSO in electrolyte A 4 、NiCl 2 、HBO 3 The mass ratio is 6:2:1, the concentration of nickel sulfate is 250g / L, and the deposition current density is 2A / dm 2 , the deposition temperature is 50° C., and the deposition time is 30 min. MnSO in electrolyte B 4 , (NH 4 ) 2 SO 4 The mass ratio is 1:1, the concentration of manganese sulfate is 75g / L, and the deposition current density is 5A / dm 2 , the deposition temperature is 20°C, and the deposition time is 20 min. Put the electroplated sample into the tubular atmosphere furnace, replace the air in the system with argon in advance, then raise the temperature at a rate of 3°C / min, heat treatment at 850°C for 2h, and maintain the flow rate of argon at 80mL / min throughout the process. min. The cross-sectional scanning electron microscope picture (SEM) of ...

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Abstract

The invention relates to a preparation method of a high-performance surface alloying copper material. The method uses a direct-current electrolysis method for obtaining a nickel deposition layer and a manganese deposition layer in succession on a pure copper surface, and then, performs heat treatment to prepare a copper base copper-nickel-manganese alloy material. The preparation method shortens the technological process, can control corresponding thickness, improves the working efficiency, and largely reduces the energy consumption; the copper-nickel-manganese alloy with a thickness of 40-75 microns and prepared by the proposed preparation process has a face-centered cubic crystal structure; the lattice constant is 4.1695-4.1782 angstroms; the resistivity is 0.051-0.064 omega.mm2.m-1; the microhardness is 327.21-392.36 HV; and the corrosion current density is 2.07*10-6-7.41*10-6 A / cm2.

Description

technical field [0001] The invention relates to a method for preparing a high-performance surface alloyed copper material. The method is to obtain a nickel deposition layer and then a manganese deposition layer on the surface of pure copper by using a direct current electrolysis method, and then perform heat treatment to obtain a copper-based A copper-nickel-manganese alloy material belongs to the technical field of surface treatment. Background technique [0002] The rapid development of communication, electronics and other industries has greatly promoted the research and development of high-performance copper materials. At present, the alloyed copper materials such as bronze, brass, and white copper are mainly used in the market. However, they are restricted by various factors such as environmental protection, material characteristics, processing technology, etc., which limit the further development of these materials. Therefore, the development of high-performance coppe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/12C25D3/54C25D5/12C25D5/50
CPCC25D3/12C25D3/54C25D5/12C25D5/50
Inventor 朱承飞马超瞿澄姚力军
Owner NANJING TECH UNIV