Preparation method of silver coated copper nanoparticles capable of being used for conductive ink

A technology of conductive ink and nano particles, which is applied in transportation and packaging, metal processing equipment, coating, etc., can solve the problems of large silver consumption, low cost, and simple preparation process, and achieve green and mild reaction conditions and strong anti-oxidation Ability, high effect of monodispersity

Active Publication Date: 2016-05-25
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The copper-silver bimetallic materials prepared by the above methods have good electrical conductivity, but all have the disadvantages of large silver consumption, complicated preparation proces...

Method used

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  • Preparation method of silver coated copper nanoparticles capable of being used for conductive ink
  • Preparation method of silver coated copper nanoparticles capable of being used for conductive ink

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Embodiment 1

[0039] This embodiment is used for the preparation method of the silver-coated copper nanoparticles of conductive ink, comprises the following steps:

[0040] (1) Prepare solution a; add 0.25 g of copper nitrate trihydrate and 0.50 g of polyvinylpyrrolidone into 100 ml of ethylene glycol, stir for 5 minutes and then heat to 100° C. to obtain solution a;

[0041] (2) Prepare solution b; add 3.2g ascorbic acid in 200ml ethylene glycol, stir well and keep the same temperature as solution a to obtain solution b;

[0042] (3) Add solution b to solution a, and continue to stir for 30 minutes to obtain a mixed solution; then add 0.12 g of silver nitrate to 10 ml of deionized water, and add the above mixed solution after completely dissolving, react for 20 minutes and cool to room temperature, 8000r / min The deionized water was centrifuged and washed 4 times, and the precipitate was taken and dried at room temperature for 6 hours under the condition of a vacuum degree of less than 0.01...

Embodiment 2

[0045] This embodiment is used for the preparation method of the silver-coated copper nanoparticles of conductive ink, comprises the following steps:

[0046] (1) Prepare solution a; add 0.45 g of copper acetylacetonate and 1.05 g of cetyltrimethylammonium bromide into 140 ml of diethylene glycol, stir for 15 minutes and then heat to 120° C. to obtain solution a;

[0047] (2) Prepare solution b; add 2.5g of ascorbic acid into 80ml of diethylene glycol, stir well and keep the same temperature as solution a to obtain solution b;

[0048] (3) Add solution b to solution a, and continue to stir for 20 minutes; then add 0.36 g of silver nitrate to 15 ml of deionized water, add the above solution after completely dissolving, react for 100 minutes, cool to room temperature, and centrifuge and wash with 6000 r / min deionized water 4 times, the precipitate was taken and dried at room temperature for 12 hours under the condition that the vacuum degree was less than 0.01 MPa to obtain silv...

Embodiment 3

[0051] This embodiment is used for the preparation method of the silver-coated copper nanoparticles of conductive ink, comprises the following steps:

[0052] (1) Prepare solution a; add 0.58g of copper hydroxide and 2.16g of polyethylene glycol-2000 into 80ml of glycerol, stir for 30min and then heat to 150°C to obtain solution a;

[0053] (2) Prepare solution b; add 2.9g of ascorbic acid into 150ml of glycerol, stir well and keep the same temperature as solution a to obtain solution b;

[0054] (3) Add solution b to solution a, and continue to stir for 40 minutes; then add 0.29 g of silver nitrate to 8 ml of deionized water, add the above solution after completely dissolving, react for 240 minutes, cool to room temperature, and centrifuge wash with 3000 r / min deionized water 4 times, the precipitate was taken and dried at room temperature for 10 h under the condition of a vacuum degree of less than 0.01 MPa to obtain silver-coated copper nanoparticles.

[0055] The XRD patt...

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Abstract

The invention relates to a preparation method of silver coated copper nanoparticles capable of being used for conductive ink. The method comprises the steps that a copper precursor, a protective agent and a reducing agent are dissolved in an organic solvent, the mixture is heated, and a nanocopper solution is obtained; a silver nitrate solution is added into the nanocopper solution, then cooling, centrifugation and drying are carried out, and the silver coated copper nanoparticles capable of being used for the conductive ink are obtained. The silver coated copper nanoparticles capable of being used for the conductive ink are prepared through a continuous reduction and replacement method. In the preparation process, no complex chelating agent is added, the intermediate processes of separation and purification, activation and sensitization and the like are not needed, and the reaction conditions are free of pollution and mild. In addition, the silver coated copper nanoparticles prepared through the preparation method are good in dispersity, high in monodispersion degree, high in oxidation resistance and capable of being produced in a large scale and applied to the field of the conductive ink.

Description

technical field [0001] The invention relates to a method for preparing silver-coated copper nanoparticles, in particular to a method for preparing silver-coated copper nanoparticles used in conductive inks, and belongs to the field of bimetallic nanomaterials. Background technique [0002] The rapid development of printed electronics has put forward higher requirements for its core material - conductive ink. At present, there are mostly nano-gold and silver-based conductive inks on the market, but their industrial production is limited due to possible electromigration and high costs. In contrast, nano-copper-based conductive inks have similar conductivity and lower cost to gold and silver conductive inks, and are ideal substitutes for gold and silver conductive inks. However, the easy oxidation of metallic copper greatly reduces its reliability. Based on this, researchers have considered uniformly coating a layer of metallic silver on the surface of nano-copper particles to...

Claims

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Application Information

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IPC IPC(8): B22F9/24B22F1/02
CPCB22F9/24B22F1/065B22F1/17
Inventor 孙蓉张昱朱朋莉欧阳琼林李刚赵涛
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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